Semiconductor Assembly and Testing Services Market: Global Industry Analysis and Forecast (2021-2027)

Semiconductor Assembly and Testing Services Market was valued at US$ 36.81 Bn. in 2020. Global Semiconductor Assembly and Testing Services Market size is estimated to grow at a CAGR of 5.73% over the forecast period.

Semiconductor Assembly and Testing Services Market Overview:

Semiconductor Assembly & Testing Services (SATS), is the packaging and testing of outsourced integrated circuits before they are delivered to third-party providers. The advancements in a system in packaging or SiP modules along with an increase in demand for FOWLP solutions are primarily driving the market growth across the globe. Consumer demand for well-equipped automobile vehicles with steering aids, GPRS, multimedia systems, and other features is driving up the demand for semiconductor assembly and testing services, which are necessary to ensure and provide high-quality end-products. Semiconductor Assembly and Testing Services Market To know about the Research Methodology :- Request Free Sample Report 2020 is considered as a base year to forecast the market from 2021 to 2027. 2020’s market size is estimated on real numbers and outputs of the key players and major players across the globe. Past five years' trends are considered while forecasting the market through 2027. 2020 is a year of exception and analysis especially with the impact of lockdown by region.

Semiconductor Assembly and Testing Services Market Dynamics:

Growing Automotive Sector across the Globe: The use of safety-related electronics systems is steadily increasing. Manufacturers of semiconductor components are constantly concentrating on developing advanced systems. Automotive semiconductor vendors profit from an increase in demand for a variety of semiconductor devices used in cars, such as microcontrollers, sensors, and memory. In addition, electrification, automation, digital connection, and security systems all result in more semiconductor technology being used in-car electronics. The growth of electric cars has had a significant impact on the semiconductor assembly and test services sector. Electric vehicle (EV) batteries, which are critical for electric vehicles, must undergo thorough testing before being installed in order to assure optimum safety and on-road performance, In addition, the range of electronics and electrical components available for automobiles is extensive. As a result, the semiconductor assembly and testing services market is expected to grow at a significant rate throughout the forecast period. Advanced Features Offered by Semiconductor Assembly and Testing Services Providers to Drive Sales: Flexible multilayer organic build-up substrates for changeable performance needs, well-established process equipment competence, proven construction, and reduced stress on the active region are all advantages of semiconductor assembly and testing services. A flip-chip provides for more interconnects than packaging solutions that use wire bonding technology since it uses the entire surface area of the die, and occasionally the perimeter as well. Due to the dependability of such qualities, the semiconductor assembly and testing services industry is expected to grow significantly throughout the forecast period. The market for Semiconductor Assembly and Testing Services in the Future: New semiconductor assembly and testing technologies such as wafer-level packaging (WLP) interconnecting technology and organic-substrate-interposer technology, among others, are being developed. Thanks to their low cost, faster test times, and scalability, these technologies are used in a variety of 3D packages, 3D integrated circuits, and image sensors. In the context of semiconductor assembly procedures, the introduction of 3D semiconductor assemblies is seen as revolutionary. As a result, the entire electronics sector has been able to increase the usefulness of its products. Product boards are substantially smaller than their predecessor's thanks to the integration of several die parts into a single package structure. In addition, the electrical performance and functional capability of semiconductors have improved as a result of the shorter connections. As a result, this bodes well for the adoption of 3D semiconductor assemblies. High Costs Associated with Wafer Fabrication: Wafer manufacture involves complicated processes, high-tech equipment, and high costs. Wafer fabrication is expensive, despite the fact that silicon is the second most abundant element on the earth. This is owing to the fact that to create semiconductor wafers and chips, silicon must be properly purified, which is a time-consuming process that ultimately escalates the cost. In addition, the final product's pricing is heavily influenced by the assembling of semiconductor products. After the chips have been assembled, they must be tested. It has to do with dependability, price, and quality. The cost of wafer manufacture has increased due to advancements in semiconductor processing technology for larger wafers and smaller circuits, which is expected to hamper the market growth during the forecast period.

Semiconductor Assembly and Testing Services Market Segment Analysis:

Based on the Application, the Semiconductor Assembly and Testing Services Market are segmented into Communication, Computing and Networking, Consumer Electronics, Industrial, and Automotive Electronics. The Communication segment is expected to witness significant growth at a CAGR of 5.28% during the forecast period. Thanks to the semiconductor assembly and testing service providers' wider capability of offering additional features such as miniaturization, additional functionality, low power consumption, and improved thermal and electrical performance for the communication industry, the communications industry is expected to boost the segment growth throughout the forecast period. Semiconductor Assembly and Testing Services Market

Global Semiconductor Assembly and Testing Services Market Regional Insights:

The Asia Pacific region held the largest market share accounting for 56.2% in 2020. The region’s growth is attributed to the significant demand for 3D packaging solutions environments from the testing and packaging sectors. The region's demand for efficient technologies for advanced packaging is predicted to grow, presenting attractive prospects for industry leaders. In addition, as people's disposable incomes rise throughout the region, sales of consumer electronics gadgets such as televisions, smartphones, and tablets rise, so does the demand for semiconductor assembly and testing services. The North American region is expected to witness a significant growth rate at a CAGR of 5.63% during the forecast period. The region’s growth is attributed to the growing telecommunications and IT industries, particularly in the United States. In addition, the growing adoption of modern electronic gadgets compatible with advanced networking technologies such as 5G, 4G, and VoLTE are also boosting the regional semiconductor assembly and testing services market growth. The objective of the report is to present a comprehensive analysis of the global Semiconductor Assembly and Testing Services Market to the stakeholders in the industry. The past and current status of the industry with the forecasted market size and trends are presented in the report with the analysis of complicated data in simple language. The report covers all the aspects of the industry with a dedicated study of key players that include market leaders, followers, and new entrants. PORTER, PESTEL analysis with the potential impact of micro-economic factors of the market have been presented in the report. External as well as internal factors that are supposed to affect the business positively or negatively have been analyzed, which will give a clear futuristic view of the industry to the decision-makers. The reports also help in understanding the Semiconductor Assembly and Testing Services Market dynamic, structure by analyzing the market segments and projecting the Semiconductor Assembly and Testing Services Market size. Clear representation of competitive analysis of key players by Vehicle type, price, financial position, product portfolio, growth strategies, and regional presence in the Semiconductor Assembly and Testing Services Market make the report investor’s guide.

Semiconductor Assembly and Testing Services Market Scope: Inquire before Buying

Global Semiconductor Assembly and Testing Services Market
Report Coverage Details
Base Year: 2020 Forecast Period: 2021-2027
Historical Data: 2016 to 2020 Market Size in 2020: US $ 36.81 Bn.
Forecast Period 2021 to 2027 CAGR: 5.73% Market Size in 2027: US $ 54.37 Bn.
Segments Covered: by Type • Assembly and Packaging Services o Copper Wire & Gold Wire Bonding o Flip Chip o Wafer Level Packaging o TSV o Others • Testing Services
by Application • Communication • Computing and Networking • Consumer Electronics • Industrial • Automotive Electronics

Semiconductor Assembly and Testing Services Market by Region

• North America • Europe • Asia Pacific • Latin America • The Middle East and Africa

Semiconductor Assembly and Testing Services Market Key Players

ASE Technology Holding Co., Ltd. • Amkor Technology Powertech Technology Inc. • Chip bond Technology Corporation Integrated Micro-Electronics, Inc. • Global Foundries • UTAC Group • TongFu Microelectronics Co., Ltd • King Yuan ELECTRONICS CO., LTD • ChipMOS TECHNOLOGIES INC • Amkor Technology • JCET • Powertech Technology Inc. • SPIL • ChipMOS TECHNOLOGIES INC. • Tongfu Microelectronics Co. Ltd. • Tianshui Huatian Technology Co., Ltd • King Yuan ELECTRONICS Co. Ltd. Frequently Asked Questions: 1] What segments are covered in the Global Semiconductor Assembly and Testing Services Market report? Ans. The segments covered in the Semiconductor Assembly and Testing Services Market report are based on Type and Application. 2] Which region is expected to hold the highest share in the Global Semiconductor Assembly and Testing Services Market? Ans. The Asia Pacific region is expected to hold the highest share in the Semiconductor Assembly and Testing Services Market. 3] What is the market size of the Global Semiconductor Assembly and Testing Services Market by 2027? Ans. The market size of the Semiconductor Assembly and Testing Services Market by 2027 is expected to reach US$ 54.37 Bn. 4] What is the forecast period for the Global Semiconductor Assembly and Testing Services Market? Ans. The forecast period for the Semiconductor Assembly and Testing Services Market is 2020-2027. 5] What was the market size of the Global Semiconductor Assembly and Testing Services Market in 2020? Ans. The market size of the Semiconductor Assembly and Testing Services Market in 2020 was valued at US$ 36.81 Bn.
1. Global Semiconductor Assembly and Testing Services Market Size: Research Methodology 2. Global Semiconductor Assembly and Testing Services Market Size: Executive Summary 2.1. Market Overview and Definitions 2.1.1. Introduction to Global Semiconductor Assembly and Testing Services Market Size 2.2. Summary 2.2.1. Key Findings 2.2.2. Recommendations for Investors 2.2.3. Recommendations for Market Leaders 2.2.4. Recommendations for New Market Entry 3. Global Semiconductor Assembly and Testing Services Market Size: Competitive Analysis 3.1. MMR Competition Matrix 3.1.1. Market Structure by region 3.1.2. Competitive Benchmarking of Key Players 3.2. Consolidation in the Market 3.2.1 M&A by region 3.3. Key Developments by Companies 3.4. Market Drivers 3.5. Market Restraints 3.6. Market Opportunities 3.7. Market Challenges 3.8. Market Dynamics 3.9. PORTERS Five Forces Analysis 3.10. PESTLE 3.11. Regulatory Landscape by region • North America • Europe • Asia Pacific • The Middle East and Africa • Latin America 3.12. COVID-19 Impact 4. Global Semiconductor Assembly and Testing Services Market Size Segmentation 4.1. Global Semiconductor Assembly and Testing Services Market Size, by Type (2020-2027) • Assembly and Packaging Services • Copper Wire & Gold Wire Bonding • Flip Chip • Wafer Level Packaging • TSV • Others • Testing Services 4.2. Global Semiconductor Assembly and Testing Services Market Size, by Application (2020-2027) • Communication • Computing and Networking • Consumer Electronics • Industrial • Automotive Electronics 5. North America Semiconductor Assembly and Testing Services Market (2020-2027) 5.1. North America Semiconductor Assembly and Testing Services Market Size, by Type (2020-2027) • Assembly and Packaging Services • Copper Wire & Gold Wire Bonding • Flip Chip • Wafer Level Packaging • TSV • Others • Testing Services 5.2. North America Semiconductor Assembly and Testing Services Market Size, by Application (2020-2027) • Communication • Computing and Networking • Consumer Electronics • Industrial • Automotive Electronics 5.3. North America Semiconductor Assembly and Testing Services Market, by Country (2020-2027) • United States • Canada • Mexico 6. European Semiconductor Assembly and Testing Services Market (2020-2027) 6.1. European Semiconductor Assembly and Testing Services Market, by Type (2020-2027) 6.2. European Semiconductor Assembly and Testing Services Market, by Application (2020-2027) 6.3. European Semiconductor Assembly and Testing Services Market, by Country (2020-2027) • UK • France • Germany • Italy • Spain • Sweden • Austria • Rest Of Europe 7. Asia Pacific Semiconductor Assembly and Testing Services Market (2020-2027) 7.1. Asia Pacific Semiconductor Assembly and Testing Services Market, by Type (2020-2027) 7.2. Asia Pacific Semiconductor Assembly and Testing Services Market, by Application (2020-2027) 7.3. Asia Pacific Semiconductor Assembly and Testing Services Market, by Country (2020-2027) • China • India • Japan • South Korea • Australia • ASEAN • Rest Of APAC 8. The Middle East and Africa Semiconductor Assembly and Testing Services Market (2020-2027) 8.1. The Middle East and Africa Semiconductor Assembly and Testing Services Market, by Type (2020-2027) 8.2. The Middle East and Africa Semiconductor Assembly and Testing Services Market, by Application (2020-2027) 8.3. The Middle East and Africa Semiconductor Assembly and Testing Services Market, by Country (2020-2027) • South Africa • GCC • Egypt • Nigeria • Rest Of ME&A 9. Latin America Semiconductor Assembly and Testing Services Market (2020-2027) 9.1. Latin America Semiconductor Assembly and Testing Services Market, by Type (2020-2027) 9.2. Latin America Semiconductor Assembly and Testing Services Market, by Application (2020-2027) 9.3. Latin America Semiconductor Assembly and Testing Services Market, by Country (2020-2027) • Brazil • Argentina • Rest Of Latin America 10. Company Profile: Key players 10.1. ASE Technology Holding Co., Ltd. 10.1.1. Company Overview 10.1.2. Financial Overview 10.1.3. Global Presence 10.1.4. Capacity Portfolio 10.1.5. Business Strategy 10.1.6. Recent Developments 10.2. Amkor Technology Powertech Technology Inc. 10.3. Chip bond Technology Corporation Integrated Micro-Electronics, Inc. 10.4. Global Foundries 10.5. UTAC Group 10.6. TongFu Microelectronics Co., Ltd 10.7. King Yuan ELECTRONICS CO., LTD 10.8. ChipMOS TECHNOLOGIES INC 10.9. Amkor Technology 10.10. JCET 10.11. Powertech Technology Inc. 10.12. SPIL 10.13. ChipMOS TECHNOLOGIES INC. 10.14. Tongfu Microelectronics Co. Ltd. 10.15. Tianshui Huatian Technology Co., Ltd 10.16. King Yuan ELECTRONICS Co. Ltd.

About This Report

Report ID 35637
Category Electronics
Published Date oct 2019
Updated Date Feb 2022
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