Semiconductor Manufacturing Equipment Market was valued at US$ 95.12 Bn in 2021 and is expected to reach US$ 180.01 Bn by 2029 at a CAGR of 8.3% over forecast period 2022-2029.To know about the Research Methodology :- Request Free Sample Report
Semiconductor Manufacturing Equipment Market Drivers and Restrains:
Semiconductor manufacturing is a difficult process that provides quality assertion of various semiconductor products. Semiconductor manufacturing equipment is used in order to safeguard assembling of semiconductor parts, testing of the entire device and wafer fab. Rising demand of electronics and gadget services have contributed majorly in the progress of semiconductor manufacturing equipment market. The report study has analyzed revenue impact of covid-19 pandemic on the sales revenue of market leaders, market followers and disrupters in the report and same is reflected in our analysis The key factors that are driving the growth of the global semiconductor manufacturing equipment market are increase in research and development facilities, growing demand for electric and hybrid vehicles, rising consumer electronics market, the upsurge in the number of foundries, the progress of Internet of Things (IoT) and expanding demand for automotive semiconductors. High costs and maintenance of the equipment and complication of pattern and functional faults in manufacturing process hamper the growth of the market. The major challenges to the growth of the semiconductor manufacturing equipment market are technical problems faced during the construction process and amplified complexities associated with reduced structures of the circuit. Growth in demand for silicon-based sensors in IoT, growing chip industry in China and the rising number of data centers and servers is expected to create lucrative opportunities for the global semiconductor manufacturing equipment market over forecast period.Global Semiconductor Manufacturing Equipment Market Segmentation Analysis:
Global Semiconductor Manufacturing Equipment Market is segmented by Front-end Equipment, by Dimension, by Fab Facility, by Back-end Equipment and by Region. By Front-end Equipment, Lithography sub-segment held highest market share in 2021 and is expected to keep its dominance over forecast period thanks to an extensive R&D in this field. In The semiconductor manufacturing companies are supported to manufacture high-quality devices because of availability of new and advanced manufacturing technologies. An application of different semiconductor devices in different industries such as automotive, telecommunication, and consumer electronics led to the increased demand for semiconductor devices. These factors propel the growth of the lithography equipment during the forecast period. By Back-end Equipment, wafer testing equipment held largest market share in 2021 and is expected to keep its dominance over forecast period. These devices are used for testing electronic devices for functionality and performance at different points during the semiconductor manufacturing process. With new technological development, there is an increase in the design complexities and development of new products. By Fab Facility, Automation subbasement holds major share over forecast period. An automation is helpful in many ways, such as reductions idle time, removes pointless processes, waste, and inventory. Automation systems help resolve difficulties like minimization of waste, reduction in cost, ideal planning, and appropriate utilization of resources. It is a substantial strategy used by equipment manufacturers to accomplish sustainable semiconductor manufacturing. These factors are boosting the growth of the automation in the global semiconductor manufacturing equipment market. Also, the chemical control equipment’s is expected to grow at xx% CAGR over forecast period due to the use of chemical control equipment in the semiconductor manufacturing processes for repeated and reliable delivery of chemicals.Global Semiconductor Manufacturing Equipment Market Regional Analysis:
By geography, market is segmented into, APAC, North America, Europe, MEA& Africa and Latin America. Asia Pacific region held 42.6% market share in 2021 and is expected to keep its dominance over forecast period owing to low-cost labors in China, India. Taiwanese invention and development in fabrication plants, and Japanese semiconductor equipment manufacturing capabilities, which are certain of the leading-edge benefits for the Asian semiconductor industry. Moreover an increasing raw material suppliers, low labor cost, and increasing investment by global business giants in the Asia Pacific. The existence of local players such as Nikon and Canon are also contributing to the progress of the market in the region. APAC is followed by North America and Europe. North America holds 27.84% of market share over forecast period. An increasing demand for consumer electronic devices in U.S. and Canada is propelling the growth of the semiconductor manufacturing equipment market. Additionally, an increase in adoption of IoT, artificial intelligence, and connected devices across various industry verticals is expected to boost the market growth in this region.Global Semiconductor Manufacturing Equipment Market Competitive Landscape
The Global Semiconductor Market has the presence of a large number of players. Major players in the market are concentrating on developing new technologies to facilitate the industry with lowest time and low expenditure consuming technologies. In the recent years there are many discoveries in the field of technologies with regards to global semiconductor market, which in turn will help the industry to grow resulting in boost to the competition too. Detailed analysis of competition, new entrants, strategic alliances, mergers and acquisition in the global semiconductor market is covered in the report. Major players covered in this report are Tokyo Electron (Japan), LAM Research (US), ASML (Netherlands), Applied Materials (US), KLA-Tencor (US), Screen Holdings (Japan), Teradyne (US), Advantest Corporation (Japan), Hitachi High-Technologies (Japan), Plasma-Therm (US).Recent Development in Global Semiconductor Manufacturing Equipment Market
• Recently Lam Research Corporation made a strategic collaboration with NanoString Technologies, Inc. to develop Nano String’s proprietary Hyb & Seq next-generation sequencing platform. • KLA-Tencor Corporation is investing more than $70 million to establish a new research and development facility in Ann Arbor, MI. This expansion underscores the attractiveness of company’s business environment as well as the strength of its logistical assets, talented workforce and high quality of life. The objective of the report is to present a comprehensive analysis of the Global Semiconductor Manufacturing Equipment market including all the stakeholders of the industry. The past and current status of the industry with forecasted market size and trends are presented in the report with the analysis of complicated data in simple language. The report covers all the aspects of the industry with a dedicated study of key players that includes market leaders, followers and new entrants. PORTER, SVOR, PESTEL analysis with the potential impact of micro-economic factors in the market have been presented in the report. External as well as internal factors that are supposed to affect the business positively or negatively have been analyzed, which will give a clear futuristic view of the industry to the decision-makers. The report also helps in understanding Global Semiconductor Manufacturing Equipment market dynamics, structure by analyzing the market segments and project the Global Semiconductor Manufacturing Equipment market size. Clear representation of competitive analysis of key players by End-User Industry, price, financial position, Product portfolio, growth strategies, and regional presence in the Global Semiconductor Manufacturing Equipment market make the report investor’s guide.Global Semiconductor Manufacturing Equipment market Scope: Inquire before buying
Global Semiconductor Manufacturing Equipment Market Report Coverage Details Base Year: 2021 Forecast Period: 2022-2029 Historical Data: 2017 to 2021 Market Size in 2021: US $ 95.12 Bn. Forecast Period 2022 to 2029 CAGR: 8.3% Market Size in 2029: US $ 180.01 Bn. Segments Covered: by Front-end Equipment • Lithography • Wafer surface conditioning equipment • Cleaning processes • Others by Dimension • 2D • 2.5D • 3D by Fab Facility • Automation • Chemical control equipment • Gas control equipment • Others by Back-end Equipment • Assembly and packaging equipment • Dicing equipment • Bonding equipment • Metrology equipment • Test equipment Global Semiconductor Manufacturing Equipment market, by Region
• North America • Europe • Asia-Pacific • Middle East & Africa • South AmericaSemiconductor Manufacturing Equipment market Key Players:
• Tokyo Electron Limited • LAM Research Corporation • ASML Holdings N.V. • Applied Materials Inc. • KLA-Tencor Corporation. • Screen Holdings Co., Ltd. • Teradyne Inc. • Advantest Corporation • Hitachi High-Technologies Corporation. • Plasma-Therm. • Rudolph Technologies, Inc • Startup Ecosystem • Canon Inc., • Nikon Corporation • Hitachi, Ltd. • Screen Holdings Co., Ltd. • Adams Lithographing • AM Lithography Corporation • Energetiq Technology, Inc. • evgroup.in. • Gigaphoton Inc. • Inpria Corp • JEOL Ltd. • Mapper Lithography Frequently Asked Questions: 1. Which region has the largest share in Global Semiconductor Manufacturing Equipment Market? Ans: Asia Pacific region holds the highest share in 2021. 2. What is the growth rate of Global Semiconductor Manufacturing Equipment Market? Ans: The Global Semiconductor Manufacturing Equipment Market is growing at a CAGR 8.3% during forecasting period 2022-2029. 3. What is scope of the Global Semiconductor Manufacturing Equipment market report? Ans: Global Semiconductor Manufacturing Equipment Market report helps with the PESTEL, PORTER, COVID-19 Impact analysis, Recommendations for Investors & Leaders, and market estimation of the forecast period. 4. Who are the key players in Global Semiconductor Manufacturing Equipment market? Ans: The important key players in the Global Semiconductor Manufacturing Equipment Market are – Tokyo Electron Limited, LAM Research Corporation, ASML Holdings N.V., Applied Materials Inc 5. What is the study period of this market? Ans: The Global Semiconductor Manufacturing Equipment Market is studied from 2021 to 2029.
Global Semiconductor Manufacturing Equipment Market
1. Preface 1.1. Report Scope and Market Segmentation 1.2. Research Highlights 1.3. Research Objectives 2. Assumptions and Research Methodology 2.1. Report Assumptions 2.2. Abbreviations 2.3. Research Methodology 2.3.1. Secondary Research 2.3.1.1. Secondary data 2.3.1.2. Secondary Sources 2.3.2. Primary Research 2.3.2.1. Data from Primary Sources 2.3.2.2. Breakdown of Primary Sources 3. Executive Summary: Global Semiconductor Manufacturing Equipment Size, by Market Value (US$ Bn) 4. Market Overview 4.1. Introduction 4.2. Market Indicator 4.2.1. Drivers 4.2.2. Restraints 4.2.3. Opportunities 4.2.4. Challenges 4.3. Porter’s Analysis 4.4. Value Chain Analysis 4.5. Market Risk Analysis 4.6. SWOT Analysis 4.7. Global Semiconductor Manufacturing Equipment Market Industry Trends 4.8. Patent Registration 5. Supply Side and Demand Side Indicators 6. Global Semiconductor Manufacturing Equipment Market Analysis and Forecast 6.1. Global Semiconductor Manufacturing Equipment Market Size & Y-o-Y Growth Analysis 6.1.1. North America 6.1.2. Europe 6.1.3. Asia Pacific 6.1.4. Middle East & Africa 6.1.5. South America 7. Global Semiconductor Manufacturing Equipment Market Analysis and Forecast, by Front-end Equipment 7.1. Introduction and Definition 7.2. Key Findings 7.3. Global Semiconductor Manufacturing Equipment Market Value Share Analysis, by Front-end Equipment 7.4. Global Semiconductor Manufacturing Equipment Market Size (US$ Bn) Forecast, by Front-end Equipment 7.5. Global Semiconductor Manufacturing Equipment Market Analysis, by Front-end Equipment 7.6. Global Semiconductor Manufacturing Equipment Market Attractiveness Analysis, by Front-end Equipment 8. Global Semiconductor Manufacturing Equipment Market Analysis and Forecast, by Dimension 8.1. Introduction and Definition 8.2. Key Findings 8.3. Global Semiconductor Manufacturing Equipment Market Value Share Analysis, by Dimension 8.4. Global Semiconductor Manufacturing Equipment Market Size (US$ Bn) Forecast, by Dimension 8.5. Global Semiconductor Manufacturing Equipment Market Analysis, by Dimension 8.6. Global Semiconductor Manufacturing Equipment Market Attractiveness Analysis, by Dimension 9. Global Semiconductor Manufacturing Equipment Market Analysis and Forecast, by Back-end Equipment 9.1. Introduction and Definition 9.2. Key Findings 9.3. Global Semiconductor Manufacturing Equipment Market Value Share Analysis, by Back-end Equipment 9.4. Global Semiconductor Manufacturing Equipment Market Size (US$ Bn) Forecast, by Back-end Equipment 9.5. Global Semiconductor Manufacturing Equipment Market Analysis, by Back-end Equipment 9.6. Global Semiconductor Manufacturing Equipment Market Attractiveness Analysis, by Back-end Equipment 10. Global Semiconductor Manufacturing Equipment Market Analysis and Forecast, by Fab Facility 10.1. Introduction and Definition 10.2. Key Findings 10.3. Global Semiconductor Manufacturing Equipment Market Value Share Analysis, by Fab Facility 10.4. Global Semiconductor Manufacturing Equipment Market Size (US$ Bn) Forecast, by Fab Facility 10.5. Global Semiconductor Manufacturing Equipment Market Analysis, by Fab Facility 10.6. Global Semiconductor Manufacturing Equipment Market Attractiveness Analysis, by Fab Facility 11. Global Semiconductor Manufacturing Equipment Market Analysis, by Region 11.1. Global Semiconductor Manufacturing Equipment Market Value Share Analysis, by Region 11.2. Global Semiconductor Manufacturing Equipment Market Size (US$ Bn) Forecast, by Region 11.3. Global Semiconductor Manufacturing Equipment Market Attractiveness Analysis, by Region 12. North America Semiconductor Manufacturing Equipment Market Analysis 12.1. Key Findings 12.2. North America Semiconductor Manufacturing Equipment Market Overview 12.3. North America Semiconductor Manufacturing Equipment Market Value Share Analysis, by Front-end Equipment 12.4. North America Semiconductor Manufacturing Equipment Market Forecast, by Front-end Equipment 12.4.1. Lithography 12.4.2. Wafer surface conditioning equipment 12.4.3. Cleaning processes 12.4.4. Others 12.5. North America Semiconductor Manufacturing Equipment Market Value Share Analysis, by Dimension 12.6. North America Semiconductor Manufacturing Equipment Market Forecast, by Dimension 12.6.1. 2D 12.6.2. 2.5D 12.6.3. 3D 12.7. North America Semiconductor Manufacturing Equipment Market Value Share Analysis, by Back-end Equipment 12.8. North America Semiconductor Manufacturing Equipment Market Forecast, by Back-end Equipment 12.8.1. Assembly and packaging equipment 12.8.2. Dicing equipment 12.8.3. Bonding equipment 12.8.4. Metrology equipment 12.8.5. Test equipment 12.9. North America Semiconductor Manufacturing Equipment Market Value Share Analysis, by Fab Facility 12.10. North America Semiconductor Manufacturing Equipment Market Forecast, by Fab Facility 12.10.1. Automation 12.10.2. Chemical control equipment 12.10.3. Gas control equipment 12.10.4. Others 12.11. North America Semiconductor Manufacturing Equipment Market Value Share Analysis, by Country 12.12. North America Semiconductor Manufacturing Equipment Market Forecast, by Country 12.12.1. U.S. 12.12.2. Canada 12.13. North America Semiconductor Manufacturing Equipment Market Analysis, by Country 12.14. U.S. Semiconductor Manufacturing Equipment Market Forecast, by Front-end Equipment 12.14.1. Lithography 12.14.2. Wafer surface conditioning equipment 12.14.3. Cleaning processes 12.14.4. Others 12.15. U.S. Semiconductor Manufacturing Equipment Market Forecast, by Dimension 12.15.1. 2D 12.15.2. 2.5D 12.15.3. 3D 12.16. U.S. Semiconductor Manufacturing Equipment Market Forecast, by Back-end Equipment 12.16.1. Assembly and packaging equipment 12.16.2. Dicing equipment 12.16.3. Bonding equipment 12.16.4. Metrology equipment 12.16.5. Test equipment 12.17. U.S. Semiconductor Manufacturing Equipment Market Forecast, by Fab Facility 12.17.1. Automation 12.17.2. Chemical control equipment 12.17.3. Gas control equipment 12.17.4. Others 12.18. Canada Semiconductor Manufacturing Equipment Market Forecast, by Front-end Equipment 12.18.1. Lithography 12.18.2. Wafer surface conditioning equipment 12.18.3. Cleaning processes 12.18.4. Others 12.19. Canada Semiconductor Manufacturing Equipment Market Forecast, by Dimension 12.19.1. 2D 12.19.2. 2.5D 12.19.3. 3D 12.20. Canada Semiconductor Manufacturing Equipment Market Forecast, by Back-end Equipment 12.20.1. Assembly and packaging equipment 12.20.2. Dicing equipment 12.20.3. Bonding equipment 12.20.4. Metrology equipment 12.20.5. Test equipment 12.21. Canada Semiconductor Manufacturing Equipment Market Forecast, by Fab Facility 12.21.1. Automation 12.21.2. Chemical control equipment 12.21.3. Gas control equipment 12.21.4. Others 12.22. North America Semiconductor Manufacturing Equipment Market Attractiveness Analysis 12.22.1. By Front-end Equipment 12.22.2. By Dimension 12.22.3. By Back-end Equipment 12.22.4. By Fab Facility 12.23. PEST Analysis 12.24. Key Trends 12.25. Key Developments 13. Europe Semiconductor Manufacturing Equipment Market Analysis 13.1. Key Findings 13.2. Europe Semiconductor Manufacturing Equipment Market Overview 13.3. Europe Semiconductor Manufacturing Equipment Market Value Share Analysis, by Front-end Equipment 13.4. Europe Semiconductor Manufacturing Equipment Market Forecast, by Front-end Equipment 13.4.1. Lithography 13.4.2. Wafer surface conditioning equipment 13.4.3. Cleaning processes 13.4.4. Others 13.5. Europe Semiconductor Manufacturing Equipment Market Value Share Analysis, by Dimension 13.6. Europe Semiconductor Manufacturing Equipment Market Forecast, by Dimension 13.6.1. 2D 13.6.2. 2.5D 13.6.3. 3D 13.7. Europe Semiconductor Manufacturing Equipment Market Value Share Analysis, by Back-end Equipment 13.8. Europe Semiconductor Manufacturing Equipment Market Forecast, by Back-end Equipment 13.8.1. Assembly and packaging equipment 13.8.2. Dicing equipment 13.8.3. Bonding equipment 13.8.4. Metrology equipment 13.8.5. Test equipment 13.9. Europe Semiconductor Manufacturing Equipment Market Value Share Analysis, by Fab Facility 13.10. Europe Semiconductor Manufacturing Equipment Market Forecast, by Fab Facility 13.10.1. Automation 13.10.2. Chemical control equipment 13.10.3. Gas control equipment 13.10.4. Others 13.11. Europe Semiconductor Manufacturing Equipment Market Value Share Analysis, by Country 13.12. Europe Semiconductor Manufacturing Equipment Market Forecast, by Country 13.12.1. Germany 13.12.2. U.K. 13.12.3. France 13.12.4. Italy 13.12.5. Spain 13.12.6. Rest of Europe 13.13. Europe Semiconductor Manufacturing Equipment Market Analysis, by Country 13.14. Germany Semiconductor Manufacturing Equipment Market Forecast, by Front-end Equipment 13.14.1. Lithography 13.14.2. Wafer surface conditioning equipment 13.14.3. Cleaning processes 13.14.4. Others 13.15. Germany Semiconductor Manufacturing Equipment Market Forecast, by Dimension 13.15.1. 2D 13.15.2. 2.5D 13.15.3. 3D 13.16. Germany Semiconductor Manufacturing Equipment Market Forecast, by Back-end Equipment 13.16.1. Assembly and packaging equipment 13.16.2. Dicing equipment 13.16.3. Bonding equipment 13.16.4. Metrology equipment 13.16.5. Test equipment 13.17. Germany Semiconductor Manufacturing Equipment Market Forecast, by Fab Facility 13.17.1. Automation 13.17.2. Chemical control equipment 13.17.3. Gas control equipment 13.17.4. Others 13.18. U.K. Semiconductor Manufacturing Equipment Market Forecast, by Front-end Equipment 13.18.1. Lithography 13.18.2. Wafer surface conditioning equipment 13.18.3. Cleaning processes 13.18.4. Others 13.19. U.K. Semiconductor Manufacturing Equipment Market Forecast, by Dimension 13.19.1. 2D 13.19.2. 2.5D 13.19.3. 3D 13.20. U.K. Semiconductor Manufacturing Equipment Market Forecast, by Back-end Equipment 13.20.1. Assembly and packaging equipment 13.20.2. Dicing equipment 13.20.3. Bonding equipment 13.20.4. Metrology equipment 13.20.5. Test equipment 13.21. U.K. Semiconductor Manufacturing Equipment Market Forecast, by Fab Facility 13.21.1. Automation 13.21.2. Chemical control equipment 13.21.3. Gas control equipment 13.21.4. Others 13.22. France Semiconductor Manufacturing Equipment Market Forecast, by Front-end Equipment 13.22.1. Lithography 13.22.2. Wafer surface conditioning equipment 13.22.3. Cleaning processes 13.22.4. Others 13.23. France Semiconductor Manufacturing Equipment Market Forecast, by Dimension 13.23.1. 2D 13.23.2. 2.5D 13.23.3. 3D 13.24. France Semiconductor Manufacturing Equipment Market Forecast, by Back-end Equipment 13.24.1. Assembly and packaging equipment 13.24.2. Dicing equipment 13.24.3. Bonding equipment 13.24.4. Metrology equipment 13.24.5. Test equipment 13.25. France Semiconductor Manufacturing Equipment Market Forecast, by Fab Facility 13.25.1. Automation 13.25.2. Chemical control equipment 13.25.3. Gas control equipment 13.25.4. Others 13.26. Italy Semiconductor Manufacturing Equipment Market Forecast, by Front-end Equipment 13.26.1. Lithography 13.26.2. Wafer surface conditioning equipment 13.26.3. Cleaning processes 13.26.4. Others 13.27. Italy Semiconductor Manufacturing Equipment Market Forecast, by Dimension 13.27.1. 2D 13.27.2. 2.5D 13.27.3. 3D 13.28. Italy Semiconductor Manufacturing Equipment Market Forecast, by Back-end Equipment 13.28.1. Assembly and packaging equipment 13.28.2. Dicing equipment 13.28.3. Bonding equipment 13.28.4. Metrology equipment 13.28.5. Test equipment 13.29. Italy Semiconductor Manufacturing Equipment Market Forecast, by Fab Facility 13.29.1. Automation 13.29.2. Chemical control equipment 13.29.3. Gas control equipment 13.29.4. Others 13.30. Spain Semiconductor Manufacturing Equipment Market Forecast, by Front-end Equipment 13.30.1. PHY 13.30.2. Integrated Lithography 13.30.3. Wafer surface conditioning equipment 13.30.4. Cleaning processes 13.30.5. Others 13.31. Spain Semiconductor Manufacturing Equipment Market Forecast, by Dimension 13.31.1. 2D 13.31.2. 2.5D 13.31.3. 3D 13.32. Spain Semiconductor Manufacturing Equipment Market Forecast, by Back-end Equipment 13.32.1. Assembly and packaging equipment 13.32.2. Dicing equipment 13.32.3. Bonding equipment 13.32.4. Metrology equipment 13.32.5. Test equipment 13.33. Spain Semiconductor Manufacturing Equipment Market Forecast, by Fab Facility 13.33.1. Automation 13.33.2. Chemical control equipment 13.33.3. Gas control equipment 13.33.4. Others 13.34. Rest of Europe Semiconductor Manufacturing Equipment Market Forecast, by Front-end Equipment 13.34.1. Lithography 13.34.2. Wafer surface conditioning equipment 13.34.3. Cleaning processes 13.34.4. Others 13.35. Rest of Europe Semiconductor Manufacturing Equipment Market Forecast, by Dimension 13.35.1. 2D 13.35.2. 2.5D 13.35.3. 3D 13.36. Rest of Europe Semiconductor Manufacturing Equipment Market Forecast, by Back-end Equipment 13.36.1. Assembly and packaging equipment 13.36.2. Dicing equipment 13.36.3. Bonding equipment 13.36.4. Metrology equipment 13.36.5. Test equipment 13.37. Rest Of Europe Semiconductor Manufacturing Equipment Market Forecast, by Fab Facility 13.37.1. Automation 13.37.2. Chemical control equipment 13.37.3. Gas control equipment 13.37.4. Others 13.38. Europe Semiconductor Manufacturing Equipment Market Attractiveness Analysis 13.38.1. By Front-end Equipment 13.38.2. By Dimension 13.38.3. By Back-end Equipment 13.38.4. By Fab Facility 13.39. PEST Analysis 13.40. Key Trends 13.41. Key Developments 14. Asia Pacific Semiconductor Manufacturing Equipment Market Analysis 14.1. Key Findings 14.2. Asia Pacific Semiconductor Manufacturing Equipment Market Overview 14.3. Asia Pacific Semiconductor Manufacturing Equipment Market Value Share Analysis, by Front-end Equipment 14.4. Asia Pacific Semiconductor Manufacturing Equipment Market Forecast, by Front-end Equipment 14.4.1. Lithography 14.4.2. Wafer surface conditioning equipment 14.4.3. Cleaning processes 14.4.4. Others 14.5. Asia Pacific Semiconductor Manufacturing Equipment Market Value Share Analysis, by Dimension 14.6. Asia Pacific Semiconductor Manufacturing Equipment Market Forecast, by Dimension 14.6.1. 2D 14.6.2. 2.5D 14.6.3. 3D 14.7. Asia Pacific Semiconductor Manufacturing Equipment Market Value Share Analysis, by Back-end Equipment 14.8. Asia Pacific Semiconductor Manufacturing Equipment Market Forecast, by Back-end Equipment 14.8.1. Assembly and packaging equipment 14.8.2. Dicing equipment 14.8.3. Bonding equipment 14.8.4. Metrology equipment 14.8.5. Test equipment 14.9. Asia Pacific Semiconductor Manufacturing Equipment Market Value Share Analysis, by Fab Facility 14.10. Asia Pacific Semiconductor Manufacturing Equipment Market Forecast, by Fab Facility 14.10.1. Automation 14.10.2. Chemical control equipment 14.10.3. Gas control equipment 14.10.4. Others 14.11. Asia Pacific Semiconductor Manufacturing Equipment Market Value Share Analysis, by Country 14.12. Asia Pacific Semiconductor Manufacturing Equipment Market Forecast, by Country 14.12.1. China 14.12.2. India 14.12.3. Japan 14.12.4. ASEAN 14.12.5. Rest of Asia Pacific 14.13. Asia Pacific Semiconductor Manufacturing Equipment Market Analysis, by Country 14.14. China Semiconductor Manufacturing Equipment Market Forecast, by Front-end Equipment 14.14.1. Lithography 14.14.2. Wafer surface conditioning equipment 14.14.3. Cleaning processes 14.14.4. Others 14.15. China Semiconductor Manufacturing Equipment Market Forecast, by Dimension 14.15.1. 2D 14.15.2. 2.5D 14.15.3. 3D 14.16. China Semiconductor Manufacturing Equipment Market Forecast, by Back-end Equipment 14.16.1. Assembly and packaging equipment 14.16.2. Dicing equipment 14.16.3. Bonding equipment 14.16.4. Metrology equipment 14.16.5. Test equipment 14.17. China Semiconductor Manufacturing Equipment Market Forecast, by Fab Facility 14.17.1. Automation 14.17.2. Chemical control equipment 14.17.3. Gas control equipment 14.17.4. Others 14.18. India Semiconductor Manufacturing Equipment Market Forecast, by Front-end Equipment 14.18.1. Lithography 14.18.2. Wafer surface conditioning equipment 14.18.3. Cleaning processes 14.18.4. Others 14.19. India Semiconductor Manufacturing Equipment Market Forecast, by Dimension 14.19.1. 2D 14.19.2. 2.5D 14.19.3. 3D 14.20. India Semiconductor Manufacturing Equipment Market Forecast, by Back-end Equipment 14.20.1. Assembly and packaging equipment 14.20.2. Dicing equipment 14.20.3. Bonding equipment 14.20.4. Metrology equipment 14.20.5. Test equipment 14.21. India Semiconductor Manufacturing Equipment Market Forecast, by Fab Facility 14.21.1. Automation 14.21.2. Chemical control equipment 14.21.3. Gas control equipment 14.21.4. Others 14.22. Japan Semiconductor Manufacturing Equipment Market Forecast, by Front-end Equipment 14.22.1. Lithography 14.22.2. Wafer surface conditioning equipment 14.22.3. Cleaning processes 14.22.4. Others 14.23. Japan Semiconductor Manufacturing Equipment Market Forecast, by Dimension 14.23.1. 2D 14.23.2. 2.5D 14.23.3. 3D 14.24. Japan Semiconductor Manufacturing Equipment Market Forecast, by Back-end Equipment 14.24.1. Assembly and packaging equipment 14.24.2. Dicing equipment 14.24.3. Bonding equipment 14.24.4. Metrology equipment 14.24.5. Test equipment 14.25. Japan Semiconductor Manufacturing Equipment Market Forecast, by Fab Facility 14.25.1. Automation 14.25.2. Chemical control equipment 14.25.3. Gas control equipment 14.25.4. Others 14.26. ASEAN Semiconductor Manufacturing Equipment Market Forecast, by Front-end Equipment 14.26.1. Lithography 14.26.2. Wafer surface conditioning equipment 14.26.3. Cleaning processes 14.26.4. Others 14.27. ASEAN Semiconductor Manufacturing Equipment Market Forecast, by Dimension 14.27.1. 2D 14.27.2. 2.5D 14.27.3. 3D 14.28. ASEAN Semiconductor Manufacturing Equipment Market Forecast, by Back-end Equipment 14.28.1. Assembly and packaging equipment 14.28.2. Dicing equipment 14.28.3. Bonding equipment 14.28.4. Metrology equipment 14.28.5. Test equipment 14.29. ASEAN Semiconductor Manufacturing Equipment Market Forecast, by Fab Facility 14.29.1. Automation 14.29.2. Chemical control equipment 14.29.3. Gas control equipment 14.29.4. Others 14.30. Rest of Asia Pacific Semiconductor Manufacturing Equipment Market Forecast, by Front-end Equipment 14.30.1. Lithography 14.30.2. Wafer surface conditioning equipment 14.30.3. Cleaning processes 14.30.4. Others 14.31. Rest of Asia Pacific Semiconductor Manufacturing Equipment Market Forecast, by Dimension 14.31.1. 2D 14.31.2. 2.5D 14.31.3. 3D 14.32. Rest of Asia Pacific Semiconductor Manufacturing Equipment Market Forecast, by Back-end Equipment 14.32.1. Assembly and packaging equipment 14.32.2. Dicing equipment 14.32.3. Bonding equipment 14.32.4. Metrology equipment 14.32.5. Test equipment 14.33. Rest of Asia Pacific Semiconductor Manufacturing Equipment Market Forecast, by Fab Facility 14.33.1. Automation 14.33.2. Chemical control equipment 14.33.3. Gas control equipment 14.33.4. Others 14.34. Asia Pacific Semiconductor Manufacturing Equipment Market Attractiveness Analysis 14.34.1. By Front-end Equipment 14.34.2. By Dimension 14.34.3. By Back-end Equipment 14.34.4. By Fab Facility 14.35. PEST Analysis 14.36. Key Trends 14.37. Key Developments 15. Middle East & Africa Semiconductor Manufacturing Equipment Market Analysis 15.1. Key Findings 15.2. Middle East & Africa Semiconductor Manufacturing Equipment Market Overview 15.3. Middle East & Africa Semiconductor Manufacturing Equipment Market Value Share Analysis, by Front-end Equipment 15.4. Middle East & Africa Semiconductor Manufacturing Equipment Market Forecast, by Front-end Equipment 15.4.1. Lithography 15.4.2. Wafer surface conditioning equipment 15.4.3. Cleaning processes 15.4.4. Others 15.5. Middle East & Africa Semiconductor Manufacturing Equipment Market Value Share Analysis, by Dimension 15.6. Middle East & Africa Semiconductor Manufacturing Equipment Market Forecast, by Dimension 15.6.1. 2D 15.6.2. 2.5D 15.6.3. 3D 15.7. Middle East & Africa Semiconductor Manufacturing Equipment Market Value Share Analysis, by Back-end Equipment 15.8. Middle East & Africa Semiconductor Manufacturing Equipment Market Forecast, by Back-end Equipment 15.8.1. Assembly and packaging equipment 15.8.2. Dicing equipment 15.8.3. Bonding equipment 15.8.4. Metrology equipment 15.8.5. Test equipment 15.9. Middle East & Africa Semiconductor Manufacturing Equipment Market Value Share Analysis, by Fab Facility 15.10. Middle East & Africa Semiconductor Manufacturing Equipment Market Forecast, by Fab Facility 15.10.1. Automation 15.10.2. Chemical control equipment 15.10.3. Gas control equipment 15.10.4. Others 15.11. Middle East & Africa Semiconductor Manufacturing Equipment Market Value Share Analysis, by Country 15.12. Middle East & Africa Semiconductor Manufacturing Equipment Market Forecast, by Country 15.12.1. GCC 15.12.2. South Africa 15.12.3. Rest of Middle East & Africa 15.13. Middle East & Africa Semiconductor Manufacturing Equipment Market Analysis, by Country 15.14. GCC Semiconductor Manufacturing Equipment Market Forecast, by Front-end Equipment 15.14.1. Lithography 15.14.2. Wafer surface conditioning equipment 15.14.3. Cleaning processes 15.14.4. Others 15.15. GCC Semiconductor Manufacturing Equipment Market Forecast, by Dimension 15.15.1. 2D 15.15.2. 2.5D 15.15.3. 3D 15.16. GCC Semiconductor Manufacturing Equipment Market Forecast, by Back-end Equipment 15.16.1. Assembly and packaging equipment 15.16.2. Dicing equipment 15.16.3. Bonding equipment 15.16.4. Metrology equipment 15.16.5. Test equipment 15.17. GCC Semiconductor Manufacturing Equipment Market Forecast, by Fab Facility 15.17.1. Automation 15.17.2. Chemical control equipment 15.17.3. Gas control equipment 15.17.4. Others 15.18. South Africa Semiconductor Manufacturing Equipment Market Forecast, by Front-end Equipment 15.18.1. Lithography 15.18.2. Wafer surface conditioning equipment 15.18.3. Cleaning processes 15.18.4. Others 15.19. South Africa Semiconductor Manufacturing Equipment Market Forecast, by Dimension 15.19.1. 2D 15.19.2. 2.5D 15.19.3. 3D 15.20. South Africa Semiconductor Manufacturing Equipment Market Forecast, by Back-end Equipment 15.20.1. Assembly and packaging equipment 15.20.2. Dicing equipment 15.20.3. Bonding equipment 15.20.4. Metrology equipment 15.20.5. Test equipment 15.21. South Africa Semiconductor Manufacturing Equipment Market Forecast, by Fab Facility 15.21.1. Automation 15.21.2. Chemical control equipment 15.21.3. Gas control equipment 15.21.4. Others 15.22. Rest of Middle East & Africa Semiconductor Manufacturing Equipment Market Forecast, by Front-end Equipment 15.22.1. Lithography 15.22.2. Wafer surface conditioning equipment 15.22.3. Cleaning processes 15.22.4. Others 15.23. Rest of Middle East & Africa Semiconductor Manufacturing Equipment Market Forecast, by Dimension 15.23.1. 2D 15.23.2. 2.5D 15.23.3. 3D 15.24. Rest of Middle East & Africa Semiconductor Manufacturing Equipment Market Forecast, by Back-end Equipment 15.24.1. Assembly and packaging equipment 15.24.2. Dicing equipment 15.24.3. Bonding equipment 15.24.4. Metrology equipment 15.24.5. Test equipment 15.25. Rest of Middle East & Africa Semiconductor Manufacturing Equipment Market Forecast, by Fab Facility 15.25.1. Automation 15.25.2. Chemical control equipment 15.25.3. Gas control equipment 15.25.4. Others 15.26. Middle East & Africa Semiconductor Manufacturing Equipment Market Attractiveness Analysis 15.26.1. By Front-end Equipment 15.26.2. By Dimension 15.26.3. By Back-end Equipment 15.26.4. By Fab Facility 15.27. PEST Analysis 15.28. Key Trends 15.29. Key Developments 16. South America Semiconductor Manufacturing Equipment Market Analysis 16.1. Key Findings 16.2. South America Semiconductor Manufacturing Equipment Market Overview 16.3. South America Semiconductor Manufacturing Equipment Market Value Share Analysis, by Front-end Equipment 16.4. South America Semiconductor Manufacturing Equipment Market Forecast, by Front-end Equipment 16.4.1. Lithography 16.4.2. Wafer surface conditioning equipment 16.4.3. Cleaning processes 16.4.4. Others 16.5. South America Semiconductor Manufacturing Equipment Market Value Share Analysis, by Dimension 16.6. South America Semiconductor Manufacturing Equipment Market Forecast, by Dimension 16.6.1. 2D 16.6.2. 2.5D 16.6.3. 3D 16.7. South America Semiconductor Manufacturing Equipment Market Value Share Analysis, by Back-end Equipment 16.8. South America Semiconductor Manufacturing Equipment Market Forecast, by Back-end Equipment 16.8.1. Assembly and packaging equipment 16.8.2. Dicing equipment 16.8.3. Bonding equipment 16.8.4. Metrology equipment 16.8.5. Test equipment 16.9. South America Semiconductor Manufacturing Equipment Market Value Share Analysis, by Fab Facility 16.10. South America Semiconductor Manufacturing Equipment Market Forecast, by Fab Facility 16.10.1. Automation 16.10.2. Chemical control equipment 16.10.3. Gas control equipment 16.10.4. Others 16.11. South America Semiconductor Manufacturing Equipment Market Value Share Analysis, by Country 16.12. South America Semiconductor Manufacturing Equipment Market Forecast, by Country 16.12.1. Brazil 16.12.2. Mexico 16.12.3. Rest of South America 16.13. South America Semiconductor Manufacturing Equipment Market Analysis, by Country 16.14. Brazil Semiconductor Manufacturing Equipment Market Forecast, by Front-end Equipment 16.14.1. Lithography 16.14.2. Wafer surface conditioning equipment 16.14.3. Cleaning processes 16.14.4. Others 16.15. Brazil Semiconductor Manufacturing Equipment Market Forecast, by Dimension 16.15.1. 2D 16.15.2. 2.5D 16.15.3. 3D 16.16. Brazil Semiconductor Manufacturing Equipment Market Forecast, by Back-end Equipment 16.16.1. Assembly and packaging equipment 16.16.2. Dicing equipment 16.16.3. Bonding equipment 16.16.4. Metrology equipment 16.16.5. Test equipment 16.17. Brazil Semiconductor Manufacturing Equipment Market Forecast, by Fab Facility 16.17.1. Automation 16.17.2. Chemical control equipment 16.17.3. Gas control equipment 16.17.4. Others 16.18. Mexico Semiconductor Manufacturing Equipment Market Forecast, by Front-end Equipment 16.18.1. Lithography 16.18.2. Wafer surface conditioning equipment 16.18.3. Cleaning processes 16.18.4. Others 16.19. Mexico Semiconductor Manufacturing Equipment Market Forecast, by Dimension 16.19.1. 2D 16.19.2. 2.5D 16.19.3. 3D 16.20. Mexico Semiconductor Manufacturing Equipment Market Forecast, by Back-end Equipment 16.20.1. Assembly and packaging equipment 16.20.2. Dicing equipment 16.20.3. Bonding equipment 16.20.4. Metrology equipment 16.20.5. Test equipment 16.21. Mexico Semiconductor Manufacturing Equipment Market Forecast, by Fab Facility 16.21.1. Automation 16.21.2. Chemical control equipment 16.21.3. Gas control equipment 16.21.4. Others 16.22. Rest of South America Semiconductor Manufacturing Equipment Market Forecast, by Front-end Equipment 16.22.1. Lithography 16.22.2. Wafer surface conditioning equipment 16.22.3. Cleaning processes 16.22.4. Others 16.23. Rest of South America Semiconductor Manufacturing Equipment Market Forecast, by Dimension 16.23.1. 2D 16.23.2. 2.5D 16.23.3. 3D 16.24. Rest of South America Semiconductor Manufacturing Equipment Market Forecast, by Back-end Equipment 16.24.1. Assembly and packaging equipment 16.24.2. Dicing equipment 16.24.3. Bonding equipment 16.24.4. Metrology equipment 16.24.5. Test equipment 16.25. Rest of South America Semiconductor Manufacturing Equipment Market Forecast, by Fab Facility 16.25.1. Automation 16.25.2. Chemical control equipment 16.25.3. Gas control equipment 16.25.4. Others 16.26. South America Semiconductor Manufacturing Equipment Market Attractiveness Analysis 16.26.1. By Front-end Equipment 16.26.2. By Dimension 16.26.3. By Back-end Equipment 16.26.4. By Fab Facility 16.27. PEST Analysis 16.28. Key Trends 16.29. Key Developments 17. Company Profiles 17.1. Market Share Analysis, by Company 17.2. Competition Matrix 17.2.1. Competitive Benchmarking of key players by price, presence, market share, Applications and R&D investment 17.2.2. New Product Launches and Product Enhancements 17.2.3. Market Consolidation 17.2.3.1. M&A by Regions, Investment and Applications 17.2.3.2. M&A Key Players, Forward Integration and Backward Integration 17.3. Company Profiles: Key Players 17.3.1. Tokyo Electron Limited 17.3.1.1. Company Overview 17.3.1.2. Financial Overview 17.3.1.3. Product Portfolio 17.3.1.4. Business Strategy 17.3.1.5. Recent Developments 17.3.1.6. Developments Footprints 17.3.2. LAM Research Corporation 17.3.3. ASML Holdings N.V. 17.3.4. Applied Materials Inc. 17.3.5. KLA-Tencor Corporation. 17.3.6. Screen Holdings Co., Ltd. 17.3.7. Teradyne Inc. 17.3.8. Advantest Corporation 17.3.9. Hitachi High-Technologies Corporation. 17.3.10. Plasma-Therm. 17.3.11. Rudolph Technologies, Inc 17.3.12. Startup Ecosystem 17.3.13. Canon Inc., 17.3.14. Nikon Corporation 17.3.15. Hitachi, Ltd. 17.3.16. Screen Holdings Co., Ltd. 17.3.17. Adams Lithographing 17.3.18. AM Lithography Corporation 17.3.19. Energetiq Technology, Inc. 17.3.20. evgroup.in. 17.3.21. Gigaphoton Inc. 17.3.22. Inpria Corp 17.3.23. JEOL Ltd. 17.3.24. Mapper Lithography 18. Primary Key Insights