Global High Density Interconnect Market – Industry Analysis and Forecast (2019-2027) – By Product, Application, End-Users and Region.

Market Scenario

Global High Density Interconnect Market size was valued at US$ 9.3 Bn in 2019 and is expected to reach US$ 24.23 Bn by 2027 to exhibit a CAGR of 12.72 % during the forecast period. The report includes the analysis of impact of COVID-19 lock-down on the revenue of market leaders, followers, and disrupters. Since lock down was implemented differently in different regions and countries, impact of same is also different by regions and segments. The report has covered the current short term and long term impact on the market, same will help decision makers to prepare the outline for short term and long term strategies for companies by region. The objective of the report is to present a comprehensive assessment of the market and contains thoughtful insights, facts, historical data, industry-validated market data and projections with a suitable set of assumptions and methodology. The report also helps in understanding global high density interconnect market dynamics, structure by identifying and analyzing the market segments and project the global market size. Further, the report also focuses on the competitive analysis of key players by technology, price, financial position, technology portfolio, growth strategies, and regional presence. The report also provides PEST analysis, PORTER’s analysis, and SWOT analysis to address questions of shareholders to prioritizing the efforts and investment in the near future to the emerging segment in global high density interconnect market. HDI printed circuit board is one of the fastest developing technologies in PCBs. High density interconnects boards comprise blind and buried via and often contain micro-vias. The growth of high-density PCB offers greater design freedom and flexibility and faster signal transmission beside with improved signal quality. Designers using high density interconnect systems can place more components on both sides of the raw PCB if desired. Growing adoption of advanced electronics and safety measures in the automotive vertical and growing demand for smart consumer electronics and wearable devices, rising trend toward sophisticated safety systems, autonomous driving, and reduction of electronic devices in the automobile sector, an upsurge in utilization of high density interconnect technology in healthcare are the major factors behind the growth of the market. The factors which hamper the growth of the market are a complex manufacturing process, On the contrary, high construction cost. The key challenges to the growth of the high density interconnect markets are rapid changes in technology and increasing functionality of electronic devices. Increasing demand for connected devices and development of 5g technology are generating many opportunities in the global high density interconnect market. The HDI market for 10+ Layers HDI is anticipated to grow at the highest CAGR during the forecast period. This growth can be attributed to 10+ Layers HDIs being used in a wide range of devices, like high-reliability automotive products, high-density mobile devices, and IoT units. 10+ layers HDI provide benefits like the small size, lightweight construction, and improved flexibility. The HDI market for wearable devices is anticipated to grow at the highest rate during the forecast period owing to HDI PCBs technical characteristics of extremely high-density routing interconnections and create the high density of components possible. These attributes contribute to the high performance and lightweight of HDI boards that mark them perfect for powering wearable devices. Also, the medical end-user segment is expected to grow at high speed in the upcoming years. The rising sales of consumer electronics and a substantial increase in the demand for HDI PCBs in these applications are driving the progress of the global HDI PCB market. So, the consumer electronics industry is becoming one of the key end-user markets for high-density technology. Now, the application of these boards in consumer electronic devices like smartphones, smart wearables, gaming consoles, tablets, and others are important. Thus with growing demand and production of these devices, the global HDI PCB market is anticipated to grow in the forecast period. APAC is expected to hold the main share of the global high density interconnects market during the forecast period Owing to the increasing application of HDI in consumer electronics, automotive, and healthcare verticals in countries such as China, India, and South Korea. It is also due to the delay of telecommunications networks in China, Thailand, Malaysia, South Korea, India, and other emerging countries in APAC.

Scope of the Global High Density Interconnect Market

Global High Density Interconnect Market, by Product

• 4–6 Layers HDI • 8–10 Layers HDI • 10+ Layers HDI

Global High Density Interconnect Market, by Application

• Automotive Electronics • Computer and Display • Communication Devices and Equipment • Audio/Audiovisual Devices • Connected Devices • Wearable Devices • Others

Global High Density Interconnect Market, by End-Users

• Automotive • Consumer Electronics • Telecommunications • Medical • Others

Global High Density Interconnect Market, by Region

• North America • Europe • Asia-Pacific • Middle East & Africa • South America

Key Players operating in the Global High Density Interconnect Market

• Compeq Co. • TTM Technologies • Austria Technologie & Systemtechnik • Unimicron • Zhen Ding Tech. • Ncab Group • Fujitsu Interconnect Technologies • CMK • Sierra Circuits • EPEC Sano Corporation • Meiko Electronics Co. • Kingboard Holdings • Daeduck GDS Co. • Shenzhen Kinwong Electronic Co. • Multek • Rush Pcb • Bittele Electronics

Table of Contents

Global High Density Interconnect Market

1. Preface 1.1. Report Scope and Market Segmentation 1.2. Research Highlights 1.3. Research Objectives 2. Assumptions and Research Methodology 2.1. Report Assumptions 2.2. Abbreviations 2.3. Research Methodology 2.3.1. Secondary Research 2.3.1.1. Secondary data 2.3.1.2. Secondary Sources 2.3.2. Primary Research 2.3.2.1. Data from Primary Sources 2.3.2.2. Breakdown of Primary Sources 3. Executive Summary: Global High Density Interconnect Market, by Market Value (US$ Bn) and Market Volume (Units) 4. Market Overview 4.1. Introduction 4.2. Market Indicator 4.2.1. Drivers 4.2.2. Restraints 4.2.3. Opportunities 4.2.4. Challenges 4.3. Porter’s Analysis 4.4. Value Chain Analysis 4.5. Market Risk Analysis 4.6. SWOT Analysis 4.7. Global High Density Interconnect Market Industry Trends 4.8. Patent Registration 5. Supply Side and Demand Side Indicators 6. Global High Density Interconnect Market Analysis and Forecast 6.1. Global High Density Interconnect Market Size & Y-o-Y Growth Analysis 6.1.1. North America 6.1.2. Europe 6.1.3. Asia Pacific 6.1.4. Middle East & Africa 6.1.5. South America 7. Global High Density Interconnect Market Analysis and Forecast, by Product 7.1. Introduction and Definition 7.2. Key Findings 7.3. Global High Density Interconnect Market Value Share Analysis, by Product 7.4. Global High Density Interconnect Market Size (US$ Bn) Forecast, by Product 7.5. Global High Density Interconnect Market Analysis, by Product 7.6. Global High Density Interconnect Market Attractiveness Analysis, by Product 8. Global High Density Interconnect Market Analysis and Forecast, by Application 8.1. Introduction and Definition 8.2. Key Findings 8.3. Global High Density Interconnect Market Value Share Analysis, by Application 8.4. Global High Density Interconnect Market Size (US$ Bn) Forecast, by Application 8.5. Global High Density Interconnect Market Analysis, by Application 8.6. Global High Density Interconnect Market Attractiveness Analysis, by Application 9. Global High Density Interconnect Market Analysis and Forecast, by End-Users 9.1. Introduction and Definition 9.2. Key Findings 9.3. Global High Density Interconnect Market Value Share Analysis, by End-Users 9.4. Global High Density Interconnect Market Size (US$ Bn) Forecast, by End-Users 9.5. Global High Density Interconnect Market Analysis, by End-Users 9.6. Global High Density Interconnect Market Attractiveness Analysis, by End-Users 10. Global High Density Interconnect Market Analysis, by Region 10.1. Global High Density Interconnect Market Value Share Analysis, by Region 10.2. Global High Density Interconnect Market Size (US$ Bn) Forecast, by Region 10.3. Global High Density Interconnect Market Attractiveness Analysis, by Region 11. North America High Density Interconnect Market Analysis 11.1. Key Findings 11.2. North America High Density Interconnect Market Overview 11.3. North America High Density Interconnect Market Value Share Analysis, by Product 11.4. North America High Density Interconnect Market Forecast, by Product 11.4.1. 4–6 Layers HDI 11.4.2. 8–10 Layers HDI 11.4.3. 10+ Layers HDI 11.5. North America High Density Interconnect Market Value Share Analysis, by Application 11.6. North America High Density Interconnect Market Forecast, by Application 11.6.1. Automotive Electronics 11.6.2. Computer and Display 11.6.3. Communication Devices and Equipment 11.6.4. Audio/Audiovisual Devices 11.6.5. Connected Devices 11.6.6. Wearable Devices 11.6.7. Others 11.7. North America High Density Interconnect Market Value Share Analysis, by End-Users 11.8. North America High Density Interconnect Market Forecast, by End-Users 11.8.1. Automotive 11.8.2. Consumer Electronics 11.8.3. Telecommunications 11.8.4. Medical 11.8.5. Others 11.9. North America High Density Interconnect Market Value Share Analysis, by Country 11.10. North America High Density Interconnect Market Forecast, by Country 11.10.1. U.S. 11.10.2. Canada 11.11. North America High Density Interconnect Market Analysis, by Country 11.12. U.S. High Density Interconnect Market Forecast, by Product 11.12.1. 4–6 Layers HDI 11.12.2. 8–10 Layers HDI 11.12.3. 10+ Layers HDI 11.13. U.S. High Density Interconnect Market Forecast, by Application 11.13.1. Automotive Electronics 11.13.2. Computer and Display 11.13.3. Communication Devices and Equipment 11.13.4. Audio/Audiovisual Devices 11.13.5. Connected Devices 11.13.6. Wearable Devices 11.13.7. Others 11.14. U.S. High Density Interconnect Market Forecast, by End-Users 11.14.1. Automotive 11.14.2. Consumer Electronics 11.14.3. Telecommunications 11.14.4. Medical 11.14.5. Others 11.15. Canada High Density Interconnect Market Forecast, by Product 11.15.1. 4–6 Layers HDI 11.15.2. 8–10 Layers HDI 11.15.3. 10+ Layers HDI 11.16. Canada High Density Interconnect Market Forecast, by Application 11.16.1. Automotive Electronics 11.16.2. Computer and Display 11.16.3. Communication Devices and Equipment 11.16.4. Audio/Audiovisual Devices 11.16.5. Connected Devices 11.16.6. Wearable Devices 11.16.7. Others 11.17. Canada High Density Interconnect Market Forecast, by End-Users 11.17.1. Automotive 11.17.2. Consumer Electronics 11.17.3. Telecommunications 11.17.4. Medical 11.17.5. Others 11.18. North America High Density Interconnect Market Attractiveness Analysis 11.18.1. By Product 11.18.2. By Application 11.18.3. By End-Users 11.19. PEST Analysis 11.20. Key Trends 11.21. Key Developments 12. Europe High Density Interconnect Market Analysis 12.1. Key Findings 12.2. Europe High Density Interconnect Market Overview 12.3. Europe High Density Interconnect Market Value Share Analysis, by Product 12.4. Europe High Density Interconnect Market Forecast, by Product 12.4.1. 4–6 Layers HDI 12.4.2. 8–10 Layers HDI 12.4.3. 10+ Layers HDI 12.5. Europe High Density Interconnect Market Value Share Analysis, by Application 12.6. Europe High Density Interconnect Market Forecast, by Application 12.6.1. Automotive Electronics 12.6.2. Computer and Display 12.6.3. Communication Devices and Equipment 12.6.4. Audio/Audiovisual Devices 12.6.5. Connected Devices 12.6.6. Wearable Devices 12.6.7. Others 12.7. Europe High Density Interconnect Market Value Share Analysis, by End-Users 12.8. Europe High Density Interconnect Market Forecast, by End-Users 12.8.1. Automotive 12.8.2. Consumer Electronics 12.8.3. Telecommunications 12.8.4. Medical 12.8.5. Others 12.9. Europe High Density Interconnect Market Value Share Analysis, by Country 12.10. Europe High Density Interconnect Market Forecast, by Country 12.10.1. Germany 12.10.2. U.K. 12.10.3. France 12.10.4. Italy 12.10.5. Spain 12.10.6. Rest of Europe 12.11. Europe High Density Interconnect Market Analysis, by Country 12.12. Germany High Density Interconnect Market Forecast, by Product 12.12.1. 4–6 Layers HDI 12.12.2. 8–10 Layers HDI 12.12.3. 10+ Layers HDI 12.13. Germany High Density Interconnect Market Forecast, by Application 12.13.1. Automotive Electronics 12.13.2. Computer and Display 12.13.3. Communication Devices and Equipment 12.13.4. Audio/Audiovisual Devices 12.13.5. Connected Devices 12.13.6. Wearable Devices 12.13.7. Others 12.14. Germany High Density Interconnect Market Forecast, by End-Users 12.14.1. Automotive 12.14.2. Consumer Electronics 12.14.3. Telecommunications 12.14.4. Medical 12.14.5. Others 12.15. U.K. High Density Interconnect Market Forecast, by Product 12.15.1. 4–6 Layers HDI 12.15.2. 8–10 Layers HDI 12.15.3. 10+ Layers HDI 12.16. U.K. High Density Interconnect Market Forecast, by Application 12.16.1. Automotive Electronics 12.16.2. Computer and Display 12.16.3. Communication Devices and Equipment 12.16.4. Audio/Audiovisual Devices 12.16.5. Connected Devices 12.16.6. Wearable Devices 12.16.7. Others 12.17. U.K. High Density Interconnect Market Forecast, by End-Users 12.17.1. Automotive 12.17.2. Consumer Electronics 12.17.3. Telecommunications 12.17.4. Medical 12.17.5. Others 12.18. France High Density Interconnect Market Forecast, by Product 12.18.1. 4–6 Layers HDI 12.18.2. 8–10 Layers HDI 12.18.3. 10+ Layers HDI 12.19. France High Density Interconnect Market Forecast, by Application 12.19.1. Automotive Electronics 12.19.2. Computer and Display 12.19.3. Communication Devices and Equipment 12.19.4. Audio/Audiovisual Devices 12.19.5. Connected Devices 12.19.6. Wearable Devices 12.19.7. Others 12.20. France High Density Interconnect Market Forecast, by End-Users 12.20.1. Automotive 12.20.2. Consumer Electronics 12.20.3. Telecommunications 12.20.4. Medical 12.20.5. Others 12.21. Italy High Density Interconnect Market Forecast, by Product 12.21.1. 4–6 Layers HDI 12.21.2. 8–10 Layers HDI 12.21.3. 10+ Layers HDI 12.22. Italy High Density Interconnect Market Forecast, by Application 12.22.1. Automotive Electronics 12.22.2. Computer and Display 12.22.3. Communication Devices and Equipment 12.22.4. Audio/Audiovisual Devices 12.22.5. Connected Devices 12.22.6. Wearable Devices 12.22.7. Others 12.23. Italy High Density Interconnect Market Forecast, by End-Users 12.23.1. Automotive 12.23.2. Consumer Electronics 12.23.3. Telecommunications 12.23.4. Medical 12.23.5. Others 12.24. Spain High Density Interconnect Market Forecast, by Product 12.24.1. 4–6 Layers HDI 12.24.2. 8–10 Layers HDI 12.24.3. 10+ Layers HDI 12.25. Spain High Density Interconnect Market Forecast, by Application 12.25.1. Automotive Electronics 12.25.2. Computer and Display 12.25.3. Communication Devices and Equipment 12.25.4. Audio/Audiovisual Devices 12.25.5. Connected Devices 12.25.6. Wearable Devices 12.25.7. Others 12.26. Spain High Density Interconnect Market Forecast, by End-Users 12.26.1. Automotive 12.26.2. Consumer Electronics 12.26.3. Telecommunications 12.26.4. Medical 12.26.5. Others 12.27. Rest of Europe High Density Interconnect Market Forecast, by Product 12.27.1. 4–6 Layers HDI 12.27.2. 8–10 Layers HDI 12.27.3. 10+ Layers HDI 12.28. Rest of Europe High Density Interconnect Market Forecast, by Application 12.28.1. Automotive Electronics 12.28.2. Computer and Display 12.28.3. Communication Devices and Equipment 12.28.4. Audio/Audiovisual Devices 12.28.5. Connected Devices 12.28.6. Wearable Devices 12.28.7. Others 12.29. Rest of Europe High Density Interconnect Market Forecast, by End-Users 12.29.1. Automotive 12.29.2. Consumer Electronics 12.29.3. Telecommunications 12.29.4. Medical 12.29.5. Others 12.30. Europe High Density Interconnect Market Attractiveness Analysis 12.30.1. By Product 12.30.2. By Application 12.30.3. By End-Users 12.31. PEST Analysis 12.32. Key Trends 12.33. Key Developments 13. Asia Pacific High Density Interconnect Market Analysis 13.1. Key Findings 13.2. Asia Pacific High Density Interconnect Market Overview 13.3. Asia Pacific High Density Interconnect Market Value Share Analysis, by Product 13.4. Asia Pacific High Density Interconnect Market Forecast, by Product 13.4.1. 4–6 Layers HDI 13.4.2. 8–10 Layers HDI 13.4.3. 10+ Layers HDI 13.5. Asia Pacific High Density Interconnect Market Value Share Analysis, by Application 13.6. Asia Pacific High Density Interconnect Market Forecast, by Application 13.6.1. Automotive Electronics 13.6.2. Computer and Display 13.6.3. Communication Devices and Equipment 13.6.4. Audio/Audiovisual Devices 13.6.5. Connected Devices 13.6.6. Wearable Devices 13.6.7. Others 13.7. Asia Pacific High Density Interconnect Market Value Share Analysis, by End-Users 13.8. Asia Pacific High Density Interconnect Market Forecast, by End-Users 13.8.1. Automotive 13.8.2. Consumer Electronics 13.8.3. Telecommunications 13.8.4. Medical 13.8.5. Others 13.9. Asia Pacific High Density Interconnect Market Value Share Analysis, by Country 13.10. Asia Pacific High Density Interconnect Market Forecast, by Country 13.10.1. China 13.10.2. India 13.10.3. Japan 13.10.4. ASEAN 13.10.5. Rest of Asia Pacific 13.11. Asia Pacific High Density Interconnect Market Analysis, by Country 13.12. China High Density Interconnect Market Forecast, by Product 13.12.1. 4–6 Layers HDI 13.12.2. 8–10 Layers HDI 13.12.3. 10+ Layers HDI 13.13. China High Density Interconnect Market Forecast, by Application 13.13.1. Automotive Electronics 13.13.2. Computer and Display 13.13.3. Communication Devices and Equipment 13.13.4. Audio/Audiovisual Devices 13.13.5. Connected Devices 13.13.6. Wearable Devices 13.13.7. Others 13.14. China High Density Interconnect Market Forecast, by End-Users 13.14.1. Automotive 13.14.2. Consumer Electronics 13.14.3. Telecommunications 13.14.4. Medical 13.14.5. Others 13.15. India High Density Interconnect Market Forecast, by Product 13.15.1. 4–6 Layers HDI 13.15.2. 8–10 Layers HDI 13.15.3. 10+ Layers HDI 13.16. India High Density Interconnect Market Forecast, by Application 13.16.1. Automotive Electronics 13.16.2. Computer and Display 13.16.3. Communication Devices and Equipment 13.16.4. Audio/Audiovisual Devices 13.16.5. Connected Devices 13.16.6. Wearable Devices 13.16.7. Others 13.17. India High Density Interconnect Market Forecast, by End-Users 13.17.1. Automotive 13.17.2. Consumer Electronics 13.17.3. Telecommunications 13.17.4. Medical 13.17.5. Others 13.18. Japan High Density Interconnect Market Forecast, by Product 13.18.1. 4–6 Layers HDI 13.18.2. 8–10 Layers HDI 13.18.3. 10+ Layers HDI 13.19. Japan High Density Interconnect Market Forecast, by Application 13.19.1. Automotive Electronics 13.19.2. Computer and Display 13.19.3. Communication Devices and Equipment 13.19.4. Audio/Audiovisual Devices 13.19.5. Connected Devices 13.19.6. Wearable Devices 13.19.7. Others 13.20. Japan High Density Interconnect Market Forecast, by End-Users 13.20.1. Automotive 13.20.2. Consumer Electronics 13.20.3. Telecommunications 13.20.4. Medical 13.20.5. Others 13.21. ASEAN High Density Interconnect Market Forecast, by Product 13.21.1. 4–6 Layers HDI 13.21.2. 8–10 Layers HDI 13.21.3. 10+ Layers HDI 13.22. ASEAN High Density Interconnect Market Forecast, by Application 13.22.1. Automotive Electronics 13.22.2. Computer and Display 13.22.3. Communication Devices and Equipment 13.22.4. Audio/Audiovisual Devices 13.22.5. Connected Devices 13.22.6. Wearable Devices 13.22.7. Others 13.23. ASEAN High Density Interconnect Market Forecast, by End-Users 13.23.1. Automotive 13.23.2. Consumer Electronics 13.23.3. Telecommunications 13.23.4. Medical 13.23.5. Others 13.24. Rest of Asia Pacific High Density Interconnect Market Forecast, by Product 13.24.1. 4–6 Layers HDI 13.24.2. 8–10 Layers HDI 13.24.3. 10+ Layers HDI 13.25. Rest of Asia Pacific High Density Interconnect Market Forecast, by Application 13.25.1. Automotive Electronics 13.25.2. Computer and Display 13.25.3. Communication Devices and Equipment 13.25.4. Audio/Audiovisual Devices 13.25.5. Connected Devices 13.25.6. Wearable Devices 13.25.7. Others 13.26. Rest of Asia Pacific High Density Interconnect Market Forecast, by End-Users 13.26.1. Automotive 13.26.2. Consumer Electronics 13.26.3. Telecommunications 13.26.4. Medical 13.26.5. Others 13.27. Asia Pacific High Density Interconnect Market Attractiveness Analysis 13.27.1. By Product 13.27.2. By Application 13.27.3. By End-Users 13.28. PEST Analysis 13.29. Key Trends 13.30. Key Developments 14. Middle East & Africa High Density Interconnect Market Analysis 14.1. Key Findings 14.2. Middle East & Africa High Density Interconnect Market Overview 14.3. Middle East & Africa High Density Interconnect Market Value Share Analysis, by Product 14.4. Middle East & Africa High Density Interconnect Market Forecast, by Product 14.4.1. 4–6 Layers HDI 14.4.2. 8–10 Layers HDI 14.4.3. 10+ Layers HDI 14.5. Middle East & Africa High Density Interconnect Market Value Share Analysis, by Application 14.6. Middle East & Africa High Density Interconnect Market Forecast, by Application 14.6.1. Automotive Electronics 14.6.2. Computer and Display 14.6.3. Communication Devices and Equipment 14.6.4. Audio/Audiovisual Devices 14.6.5. Connected Devices 14.6.6. Wearable Devices 14.6.7. Others 14.7. Middle East & Africa High Density Interconnect Market Value Share Analysis, by End-Users 14.8. Middle East & Africa High Density Interconnect Market Forecast, by End-Users 14.8.1. Automotive 14.8.2. Consumer Electronics 14.8.3. Telecommunications 14.8.4. Medical 14.8.5. Others 14.9. Middle East & Africa High Density Interconnect Market Value Share Analysis, by Country 14.10. Middle East & Africa High Density Interconnect Market Forecast, by Country 14.10.1. GCC 14.10.2. South Africa 14.10.3. Rest of Middle East & Africa 14.11. Middle East & Africa High Density Interconnect Market Analysis, by Country 14.12. GCC High Density Interconnect Market Forecast, by Product 14.12.1. 4–6 Layers HDI 14.12.2. 8–10 Layers HDI 14.12.3. 10+ Layers HDI 14.13. GCC High Density Interconnect Market Forecast, by Application 14.13.1. Automotive Electronics 14.13.2. Computer and Display 14.13.3. Communication Devices and Equipment 14.13.4. Audio/Audiovisual Devices 14.13.5. Connected Devices 14.13.6. Wearable Devices 14.13.7. Others 14.14. GCC High Density Interconnect Market Forecast, by End-Users 14.14.1. Automotive 14.14.2. Consumer Electronics 14.14.3. Telecommunications 14.14.4. Medical 14.14.5. Others 14.15. South Africa High Density Interconnect Market Forecast, by Product 14.15.1. 4–6 Layers HDI 14.15.2. 8–10 Layers HDI 14.15.3. 10+ Layers HDI 14.16. South Africa High Density Interconnect Market Forecast, by Application 14.16.1. Automotive Electronics 14.16.2. Computer and Display 14.16.3. Communication Devices and Equipment 14.16.4. Audio/Audiovisual Devices 14.16.5. Connected Devices 14.16.6. Wearable Devices 14.16.7. Others 14.17. South Africa High Density Interconnect Market Forecast, by End-Users 14.17.1. Automotive 14.17.2. Consumer Electronics 14.17.3. Telecommunications 14.17.4. Medical 14.17.5. Others 14.18. Rest of Middle East & Africa High Density Interconnect Market Forecast, by Product 14.18.1. 4–6 Layers HDI 14.18.2. 8–10 Layers HDI 14.18.3. 10+ Layers HDI 14.19. Rest of Middle East & Africa High Density Interconnect Market Forecast, by Application 14.19.1. Automotive Electronics 14.19.2. Computer and Display 14.19.3. Communication Devices and Equipment 14.19.4. Audio/Audiovisual Devices 14.19.5. Connected Devices 14.19.6. Wearable Devices 14.19.7. Others 14.20. Rest of Middle East & Africa High Density Interconnect Market Forecast, by End-Users 14.20.1. Automotive 14.20.2. Consumer Electronics 14.20.3. Telecommunications 14.20.4. Medical 14.20.5. Others 14.21. Middle East & Africa High Density Interconnect Market Attractiveness Analysis 14.21.1. By Product 14.21.2. By Application 14.21.3. By End-Users 14.22. PEST Analysis 14.23. Key Trends 14.24. Key Developments 15. South America High Density Interconnect Market Analysis 15.1. Key Findings 15.2. South America High Density Interconnect Market Overview 15.3. South America High Density Interconnect Market Value Share Analysis, by Product 15.4. South America High Density Interconnect Market Forecast, by Product 15.4.1. 4–6 Layers HDI 15.4.2. 8–10 Layers HDI 15.4.3. 10+ Layers HDI 15.5. South America High Density Interconnect Market Value Share Analysis, by Application 15.6. South America High Density Interconnect Market Forecast, by Application 15.6.1. Automotive Electronics 15.6.2. Computer and Display 15.6.3. Communication Devices and Equipment 15.6.4. Audio/Audiovisual Devices 15.6.5. Connected Devices 15.6.6. Wearable Devices 15.6.7. Others 15.7. South America High Density Interconnect Market Value Share Analysis, by End-Users 15.8. South America High Density Interconnect Market Forecast, by End-Users 15.8.1. Automotive 15.8.2. Consumer Electronics 15.8.3. Telecommunications 15.8.4. Medical 15.8.5. Others 15.9. South America High Density Interconnect Market Value Share Analysis, by Country 15.10. South America High Density Interconnect Market Forecast, by Country 15.10.1. Brazil 15.10.2. Mexico 15.10.3. Rest of South America 15.11. South America High Density Interconnect Market Analysis, by Country 15.12. Brazil High Density Interconnect Market Forecast, by Product 15.12.1. 4–6 Layers HDI 15.12.2. 8–10 Layers HDI 15.12.3. 10+ Layers HDI 15.13. Brazil High Density Interconnect Market Forecast, by Application 15.13.1. Automotive Electronics 15.13.2. Computer and Display 15.13.3. Communication Devices and Equipment 15.13.4. Audio/Audiovisual Devices 15.13.5. Connected Devices 15.13.6. Wearable Devices 15.13.7. Others 15.14. Brazil High Density Interconnect Market Forecast, by End-Users 15.14.1. Automotive 15.14.2. Consumer Electronics 15.14.3. Telecommunications 15.14.4. Medical 15.14.5. Others 15.15. Mexico High Density Interconnect Market Forecast, by Product 15.15.1. 4–6 Layers HDI 15.15.2. 8–10 Layers HDI 15.15.3. 10+ Layers HDI 15.16. Mexico High Density Interconnect Market Forecast, by Application 15.16.1. Automotive Electronics 15.16.2. Computer and Display 15.16.3. Communication Devices and Equipment 15.16.4. Audio/Audiovisual Devices 15.16.5. Connected Devices 15.16.6. Wearable Devices 15.16.7. Others 15.17. Mexico High Density Interconnect Market Forecast, by End-Users 15.17.1. Automotive 15.17.2. Consumer Electronics 15.17.3. Telecommunications 15.17.4. Medical 15.17.5. Others 15.18. Rest of South America High Density Interconnect Market Forecast, by Product 15.18.1. 4–6 Layers HDI 15.18.2. 8–10 Layers HDI 15.18.3. 10+ Layers HDI 15.19. Rest of South America High Density Interconnect Market Forecast, by Application 15.19.1. Automotive Electronics 15.19.2. Computer and Display 15.19.3. Communication Devices and Equipment 15.19.4. Audio/Audiovisual Devices 15.19.5. Connected Devices 15.19.6. Wearable Devices 15.19.7. Others 15.20. Rest of South America High Density Interconnect Market Forecast, by End-Users 15.20.1. Automotive 15.20.2. Consumer Electronics 15.20.3. Telecommunications 15.20.4. Medical 15.20.5. Others 15.21. South America High Density Interconnect Market Attractiveness Analysis 15.21.1. By Product 15.21.2. By Application 15.21.3. By End-Users 15.22. PEST Analysis 15.23. Key Trends 15.24. Key Developments 16. Company Profiles 16.1. Market Share Analysis, by Company 16.2. Competition Matrix 16.2.1. Competitive Benchmarking of key players by price, presence, market share, Application and R&D investment 16.2.2. New Product Launches and Product Enhancements 16.2.3. Market Consolidation 16.2.3.1. M&A by Regions, Investment with Application 16.2.3.2. M&A Key Players, Forward Integration and Backward Integration 16.3. Company Profiles : Key Players 16.3.1. Compeq Co. 16.3.1.1. Company Overview 16.3.1.2. Financial Overview 16.3.1.3. Product Portfolio 16.3.1.4. Business Strategy 16.3.1.5. Recent Developments 16.3.1.6. Development and Company Footprints 16.3.2. TTM Technologies 16.3.3. Austria Technologie & Systemtechnik 16.3.4. Unimicron 16.3.5. Zhen Ding Tech. 16.3.6. Ncab Group 16.3.7. Fujitsu Interconnect Technologies 16.3.8. CMK 16.3.9. Sierra Circuits 16.3.10. EPEC Sano Corporation 16.3.11. Meiko Electronics Co. 16.3.12. Kingboard Holdings 16.3.13. Daeduck GDS Co. 16.3.14. Shenzhen Kinwong Electronic Co. 16.3.15. Multek 16.3.16. Rush Pcb 16.3.17. Bittele Electronics 17. Primary Key Insights

About This Report

Report ID 26294
Category Information Technology & Telecommunication
Published Date Feb 2019
No of Pages 200
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