Global LED Packaging Market – Global Industry Analysis and Forecast (2017-2026) _By Package Type (SMD, COB and CSP), Packaging Material (Lead Frames, Substrates, Bonding Wire and Encapsulation Resins), Application, and Geography

Global LED Packaging Market – Global Industry Analysis and Forecast (2017-2026) _By Package Type (SMD, COB and CSP), Packaging Material (Lead Frames, Substrates, Bonding Wire and Encapsulation Resins), Application, and Geography

Market Scenario

Global LED Packaging Market is expected to reach US$ 34.29 Bn by 2026 from US$ 18.2 Bn in 2016 at a CAGR of 6.54%. The factors such as increasing demand for high power grade LED packages for lighting applications, rising demand for LED packages in the display panel market, growing government initiatives and regulations for adoption of energy-efficient LED lighting and increasing demand for smart LED lighting solutions are responsible for the growth of the global LED packaging market. LED PACKEGING MARKET The Global LED Packaging Market is segmented by package type, packaging material, application, and geography. Further package type is segmented by surface mount device (SMD), chip on board (COB), chip scale package (CSP). The market is governed by surface mount device (SMD) and chip scale package (CSP) is projected to grow at the highest CAGR during the forecast period due to reduced weight, thin profile and reduced package footprint. Later, the packaging material is segmented by lead frames, substrates, bonding wire, encapsulation resins. The substrates sub-segment had governed the market in 2016 and is projected to grow at the highest CAGR during the forecast period. The market by application is further segmented by general lighting, automotive lighting, and backlighting. The general lighting sub-segment is projected to have the largest Global LED Packaging Market size due to increasing demand for residential and industrial lighting. Automotive lighting sub-segment is projected to grow at a high CAGR during the forecast period due to increasing use of LEDs in automotive headlights and interiors. Asia Pacific had the largest market in 2016 and is projected to grow at the highest CAGR during the forecast period due to the flourishing automotive industry. Key Highlights: • Global LED Packaging Market analysis and forecast, in terms of value. • Comprehensive study and analysis of market drivers, restraints and opportunities influencing the growth of the LED Packaging market. • Global LED Packaging Market segmentation on the basis of type, source, end-user, and region (country-wise) has been provided. • Global LED Packaging Market strategic analysis with respect to individual growth trends, future prospects along with the contribution of various sub-market stakeholders have been considered under the scope of the study. • LED Packaging market analysis and forecast for five major regions namely North America, Europe, Asia Pacific, the Middle East & Africa (MEA) and Latin America along with country-wise segmentation. • Profiles of key industry players, their strategic perspective, market positioning and analysis of core competencies are further profiled. • Competitive developments, investments, strategic expansion and competitive landscape of the key players operating in the LED Packaging market are also profiled.

Major players in the Global LED packaging market are as follows:

• Nichia (Japan) • Samsung (South Korea) • LG Innotek (South Korea) • Lumileds (Netherlands) • Stanley Electric (Japan) • Osram (Germany) • Everlight Electronics (Taiwan) • Epistar (Taiwan) • Seoul Semiconductor (South Korea) • Cree (US) • Toyoda Gosei (Japan) • TT Electronics (UK) • Dow Corning (US) • Citizen Electronics (Japan) Key Target Audience: • Raw material suppliers • Regulatory bodies • Traders, distributors, and suppliers of LED materials • Industry associations • Manufacturing equipment providers • Automotive lighting manufacturers or suppliers • General lighting manufacturers or suppliers • Backlighting manufacturers or suppliers • Research organizations Years considered to estimate the market size of the LED Packaging market have been mentioned below: • Base year-2016 • Estimated year-2017 • Forecast year- 2017 to 2026

Scope of the Global LED Packaging Market:

This research report segments the LED packaging market based on type, packaging material, application, and geography.

Global LED Packaging Market, by Type:

• surface mount device (SMD) • chip on board (COB) • chip scale package (CSP) • Others

Global LED Packaging Market, by Packaging Material:

• Lead Frames • Substrates • Ceramic Packages • Bonding Wire • Encapsulation Resins • Others

Global LED Packaging Market, by Application:

• General Lighting • Automotive Lighting • Backlighting • Others

Global LED Packaging Market, by Geography:

• North America • Europe • Asia Pacific • Middle East & Africa • Latin America Geographic Analysis • Breakdown of The North America LED Packaging Market • Breakdown of The Europe LED Packaging Market • Breakdown of The Asia Pacific LED Packaging Market • Breakdown of The Middle East & Africa LED Packaging Market • Breakdown of The Latin America LED Packaging Market Available Customizations: Maximize Market Research offers customization of reports according to the specific requirement of our client. InGaAs Camera Market

Table of Contents

Global LED Packaging Market

1. LED PACKAGING EXECUTIVE SUMMARY 2. LED PACKAGING RESEARCH METHODOLOGY 2.1. LED Packaging Market Definition 2.2. LED Packaging Market Scope 2.3. LED Packaging Data Sources 3. LED PACKAGING MARKET DYNAMICS 3.1. LED Packaging Market Drivers 3.2. LED Packaging Market Restraints 3.3. LED Packaging Market Opportunities 3.4. Global LED Packaging Market Industry Trends and Emerging Technologies 4. LED PACKAGING END-USER OVERVIEW 4.1. LED Packaging Value Chain Analysis 4.2. LED Packaging Key Trends 5. LED PACKAGING MARKET, BY PACKAGE TYPE (2016-2026) 5.1. Introduction 5.2. LED Packaging Market, by SMD 5.2.1. LED Packaging SMD Market Overview 5.2.2. LED Packaging SMD Market Size & Forecast 5.3. LED Packaging Market, by COB 5.3.1. LED Packaging COB Market Overview 5.3.2. LED Packaging COB Market Size & Forecast 5.4. LED Packaging Market, by CSP 5.4.1. LED Packaging CSP Market Overview 5.4.2. LED Packaging CSP Market Size & Forecast 5.5. LED Packaging Market, by Others 5.5.1. Others Market Overview 5.5.2. Others Market Size & Forecast 6. LED PACKAGING MARKET, BY PACKAGING MATERIAL (2016-2026) 6.1. Introduction 6.2. LED Packaging Market, by Lead Frames 6.2.1. LED Packaging Lead Frames Market Overview 6.2.2. LED Packaging Lead Frames Market Size & Forecast 6.3. LED Packaging Market, by Substrates 6.3.1. LED Packaging Substrates Market Overview 6.3.2. LED Packaging Substrates Market Size & Forecast 6.4. LED Packaging Market, by Ceramic Packages 6.4.1. LED Packaging Ceramic Packages Market Overview 6.4.2. LED Packaging Ceramic Packages Market Size & Forecast 6.5. LED Packaging Market, by Bonding Wire 6.5.1. LED Packaging Bonding Wire Market Overview 6.5.2. LED Packaging Bonding Wire Market Size & Forecast 6.6. LED Packaging Market, by Encapsulation Resins 6.6.1. LED Packaging Encapsulation Resins Market Overview 6.6.2. LED Packaging Encapsulation Resins Market Size & Forecast 6.7. LED Packaging Market, by Other Packaging Materials 6.7.1. Other Packaging Materials Market Overview 6.7.2. Other Packaging Materials Market Size & Forecast 7. LED PACKAGING MARKET, BY APPLICATION (2016-2026) 7.1. Introduction 7.2. LED Packaging Market, by General Lighting 7.2.1. LED Packaging General Lighting Market Overview 7.2.2. LED Packaging General Lighting Market Size & Forecast 7.3. LED Packaging Market, by Automotive Lighting 7.3.1. LED Packaging Automotive Lighting Market Overview 7.3.2. LED Packaging Automotive Lighting Market Size & Forecast 7.4. LED Packaging Market, by Backlighting 7.4.1. LED Packaging Backlighting Market Overview 7.4.2. LED Packaging Backlighting Market Size & Forecast 7.5. LED Packaging Market, by Other Applications 7.5.1. Other Applications Market Overview 7.5.2. Other Applications Market Size & Forecast 8. LED PACKAGING MARKET, BY GEOGRAPHY (2016-2026) 8.1. North America LED Packaging Market 8.1.1. North America LED Packaging Market, by Package Type 8.1.2. North America LED Packaging Market, by Packaging Material 8.1.3. North America LED Packaging Market, by Application 8.1.4. North America LED Packaging Market, by Region 8.1.4.1. U.S. LED Packaging Market 8.1.4.2. Canada LED Packaging Market 8.2. Europe LED Packaging Market 8.2.1. Europe LED Packaging Market, by Package Type 8.2.2. Europe LED Packaging Market, by Packaging Material 8.2.3. Europe LED Packaging Market, by Application 8.2.4. Europe LED Packaging Market, by Region 8.2.4.1. France LED Packaging Market 8.2.4.2. Germany LED Packaging Market 8.2.4.3. U.K .LED Packaging Market 8.2.4.4. Rest of Europe LED Packaging Market 8.3. Asia Pacific LED Packaging Market 9. LED PACKAGING MARKET COMPETITION ANALYSIS 9.1.Market Share/Positioning Analysis 9.2.Key Innovators 9.3.Company Profiles 9.3.1. Nichia 9.3.1.1.Overview 9.3.1.2.Application/Service End-user 9.3.1.3.Strategy 9.3.1.4.Key Developments 9.3.2. Samsung 9.3.2.1.Overview 9.3.2.2.Application/Service End-user 9.3.2.3.Strategy 9.3.2.4.Key Developments 9.3.3. LG Innotek 9.3.3.1.Overview 9.3.3.2.Application/Service End-user 9.3.3.3.Strategy 9.3.3.4.Key Developments 9.3.4. Lumileds 9.3.4.1.Overview 9.3.4.2.Application/Service End-user 9.3.4.3.Strategy 9.3.4.4.Key Developments 9.3.5. Stanley Electric 9.3.5.1.Overview 9.3.5.2.Application/Service End-user 9.3.5.3.Strategy 9.3.5.4.Key Developments 9.3.6. Osram 9.3.6.1.Overview 9.3.6.2.Application/Service End-user 9.3.6.3.Strategy 9.3.6.4.Key Developments 9.3.7. Everlight Electronics 9.3.7.1.Overview 9.3.7.2.Application/Service End-user 9.3.7.3.Strategy 9.3.7.4.Key Developments 9.3.8. Epistar 9.3.8.1.Overview 9.3.8.2.Application/Service End-user 9.3.8.3.Strategy 9.3.8.4.Key Developments 9.3.9. Seoul Semiconductor 9.3.9.1.Overview 9.3.9.2.Application/Service End-user 9.3.9.3.Strategy 9.3.9.4.Key Developments 9.3.10. Cree 9.3.10.1.Overview 9.3.10.2.Application/Service End-user 9.3.10.3.Strategy 9.3.10.4.Key Developments 9.3.11. Toyoda Gosei 9.3.11.1.Overview 9.3.11.2.Application/Service End-user 9.3.11.3.Strategy 9.3.11.4.Key Developments 9.3.12. TT Electronics 9.3.12.1.Overview 9.3.12.2.Application/Service End-user 9.3.12.3.Strategy 9.3.12.4.Key Developments 9.3.13. Dow Corning 9.3.13.1.Overview 9.3.13.2.Application/Service End-user 9.3.13.3.Strategy 9.3.13.4.Key Developments 9.3.14. Citizen Electronics 9.3.14.1.Overview 9.3.14.2.Application/Service End-user 9.3.14.3.Strategy 9.3.14.4.Key Developments

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