Radiation-Hardened Electronics Market- Global Industry Analysis and Forecast (2023-2029)

Radiation-Hardened Electronics Market is expected to grow at a CAGR of 3.6% during the forecast period and market is expected to reach US$ 2.03 Bn. by 2029. The report includes the analysis of impact of COVID-19 lock-down on the revenue of market leaders, followers, and disrupters. Since lock down was implemented differently in different regions and countries, impact of same is also different by regions and segments. The report has covered the current short term and long term impact on the market, same will help decision makers to prepare the outline for short term and long term strategies for companies by region.Radiation-Hardened-Electronics-MarketTo know about the Research Methodology:-Request Free Sample Report The major factor driving the radiation hardened electronics market is the rising demand for power management devices. Another factor augmenting the market for radiation-hardened electronics market is the rising demand for diodes, transistors, and MOSFETs in various defense and space applications. More technological advancements are leading to focus on the integration of radiation hardened electronics chip into various devices. Another major driver for the market is the increase in the number of space missions. One of the drivers for the radiation hardened electronics market is a rise in demand for communication satellites. Rising ISR (Intelligence, Surveillance, and Reconnaissance) processes, multicore processor technology and FPGA advancements will boost the radiation hardened electronics market in future. However, the challenge to create an actual testing environment and manufacturing & design challenges hinder the growth of the market. On the other hand, growing R&D activities at various space stations and demand from commercial and military applications create opportunities in the market. Power management components are estimated to hold the largest share of the global radiation-hardened electronics market during the forecast period. High demand for MOSFETs and transistors in the commercial space market is driving the growth of the power management components in the global market place. The radiation-hardened electronics market for the radiation hardening by design (RHBD) is expected to be the fastest-growing market by 2029. The RHBD technique is expected to have good opportunities in the near future as it can provide immunity from total-dose and single-event effects in commercially produced circuitry. The defense & space industries mostly use RHBD memories, microcontrollers, and ASICs in their applications and it also has a wide scope in military applications. North America is the largest market for the radiation-hardened electronics market. Europe is the second largest market of radiation-hardened electronics followed by APAC. In North America, U.S. accounts for the largest share in the radiation hardened electronics market. Canada follows the numbers in the U.S. for the radiation-hardened electronics market. The increasing demand of the radiation hardened electronics market in the North America region could be because of the presence of rad-hard component manufacturers in large numbers. Also, the presence of some famous defense and space research institutes is the major reason for the growing radiation hardened electronics market. The objective of the report is to present a comprehensive assessment of the market and contains thoughtful insights, facts, historical data, industry-validated market data and projections with a suitable set of assumptions and methodology. The report also helps in understanding dynamics, structure by analyzing the market segments by type, service, components, and region and, project the global market size. Global report also provides a clear representation of competitive analysis of key players by product, price, financial position, product portfolio, growth strategies, and regional presence in the Radiation-Hardened Electronics market. The report also provides PEST analysis, PORTER’s analysis, SWOT analysis to address the question of shareholders in arranging the efforts and investment in the near future to a particular market segment.

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Radiation-Hardened Electronics Market
Report Coverage Details
Base Year: 2022 Forecast Period: 2023-2029
Historical Data: 2018 to 2022 Market Size in 2022: US $ 1.58 Bn.
Forecast Period 2023 to 2029 CAGR: 3.6% Market Size in 2029: US $ 2.03 Bn.
Segments Covered: by Component Power Management ASIC Logic Memory FPGA
by Manufacturing Technique RHBD (Radiation Hardening by Design) RHBP(Radiation Hardening by Process)
by Application Space (Satellite) Aerospace & Defense Nuclear Power Plant

Radiation-Hardened Electronics Market, by Region

North America (United States, Canada and Mexico) Europe (UK, France, Germany, Italy, Spain, Sweden, Austria and Rest of Europe) Asia Pacific (China, South Korea, Japan, India, Australia, Indonesia, Malaysia, Vietnam, Taiwan, Bangladesh, Pakistan and Rest of APAC) Middle East and Africa (South Africa, GCC, Egypt, Nigeria and Rest of ME&A) South America (Brazil, Argentina Rest of South America)

Radiation-Hardened Electronics Market, Key players are:

1.Honeywell Aerospace 2.BAE Systems 3.Microsemi Corporation 4.Xilinx Incorporation 5.Texas Instruments 6.Maxwell Technologies 7.Intersil Corporation 8.Atmel Corporation 9.Linear Technology Corporation 10.ST Microelectronics 11.Microchip Technology 12.Renesas Electronics 13.Infeneon Technologies 14.Cobham Plc 15.Data Device Corporation 16.Boeing Company 17.AIS Tech Space 18.Helios Wire 19.Kepler Communications 20.Swarm Technology Frequently Asked Questions: 1. Which region has the largest share in Global Radiation-Hardened Electronics Market? Ans: North America region held the highest share in 2022. 2. What is the growth rate of Global Radiation-Hardened Electronics Market? Ans: The Global Radiation-Hardened Electronics Market is growing at a CAGR of 3.6% during forecasting period 2023-2029. 3. What is scope of the Global Radiation-Hardened Electronics Market report? Ans: Global Radiation-Hardened Electronics Market report helps with the PESTEL, PORTER, COVID-19 Impact analysis, Recommendations for Investors & Leaders, and market estimation of the forecast period. 4. Who are the key players in Global Radiation-Hardened Electronics Market? Ans: The important key players in the Global Radiation-Hardened Electronics Market are – Honeywell Aerospace, BAE Systems, Microsemi Corporation, Xilinx Incorporation, Texas Instruments, Maxwell Technologies, Intersil Corporation, Atmel Corporation, Linear Technology Corporation, ST Microelectronics, Microchip Technology, Renesas Electronics, Infeneon Technologies, Cobham Plc, Data Device Corporation, Boeing Company, AIS Tech Space, Helios Wire, Kepler Communications, and Swarm Technology 5. What is the study period of this Market? Ans: The Global Radiation-Hardened Electronics Market is studied from 2022 to 2029.

Table of Content

1. Preface 1.1. Report Scope and Market Segmentation 1.2. Research Highlights 1.3. Research Objectives 2. Assumptions and Research Methodology 2.1. Report Assumptions 2.2. Abbreviations 2.3. Research Methodology 2.3.1. Secondary Research 2.3.1.1. Secondary data 2.3.1.2. Secondary Sources 2.3.2. Primary Research 2.3.2.1. Data from Primary Sources 2.3.2.2. Breakdown of Primary Sources 3. Executive Summary : Global Radiation-Hardened Electronics Market, by Market Value (US$ Bn) 4. Market Overview 4.1. Introduction 4.2. Market Indicator 4.2.1. Drivers 4.2.2. Restraints 4.2.3. Opportunities 4.2.4. Challenges 4.3. Porter’s Analysis 4.3.1. Value Chain Analysis 4.4. Market Risk Analysis 4.5. SWOT Analysis 4.6. Industry Trends in Global Radiation-Hardened Electronics Market 5. Supply Side and Demand Side Indicators 6. Global Radiation-Hardened Electronics Market Analysis and Forecast 6.1. Global Radiation-Hardened Electronics Market Size & Y-o-Y Growth Analysis 6.1.1. North America 6.1.2. Europe 6.1.3. Asia Pacific 6.1.4. Middle East & Africa 6.1.5. South America 7. Global Radiation-Hardened Electronics Market Analysis and Forecast, By Component 7.1. Introduction and Definition 7.2. Key Findings 7.3. Global Radiation-Hardened Electronics Market Value Share Analysis, By Component 7.4. Global Radiation-Hardened Electronics Market Size (US$ Bn) Forecast, By Component 7.5. Global Radiation-Hardened Electronics Market Analysis, By Component 7.6. Global Radiation-Hardened Electronics Market Attractiveness Analysis, By Component 8. Global Radiation-Hardened Electronics Market Analysis and Forecast, By Manufacturing Technique 8.1. Introduction and Definition 8.2. Key Findings 8.3. Global Radiation-Hardened Electronics Market Value Share Analysis, By Manufacturing Technique 8.4. Global Radiation-Hardened Electronics Market Size (US$ Bn) Forecast, By Manufacturing Technique 8.5. Global Radiation-Hardened Electronics Market Analysis, By Manufacturing Technique 8.6. Global Radiation-Hardened Electronics Market Attractiveness Analysis, By Manufacturing Technique 9. Global Radiation-Hardened Electronics Market Analysis and Forecast, by Application 9.1. Introduction and Definition 9.2. Key Findings 9.3. Global Radiation-Hardened Electronics Market Value Share Analysis, by Application 9.4. Global Radiation-Hardened Electronics Market Size (US$ Bn) Forecast, by Application 9.5. Global Radiation-Hardened Electronics Market Analysis, by Application 9.6. Global Radiation-Hardened Electronics Market Attractiveness Analysis, by Application 10. Global Radiation-Hardened Electronics Market Analysis, by Region 10.1. Global Radiation-Hardened Electronics Market Value Share Analysis, by Region 10.2. Global Radiation-Hardened Electronics Market Size (US$ Bn) Forecast, by Region 10.3. Global Radiation-Hardened Electronics Market Attractiveness Analysis, by Region 11. North America Radiation-Hardened Electronics Market Analysis 11.1. Key Findings 11.2. North America Radiation-Hardened Electronics Market Overview 11.3. North America Radiation-Hardened Electronics Market Value Share Analysis, By Component 11.4. North America Radiation-Hardened Electronics Market Forecast, By Component 11.4.1. Power Management 11.4.2. ASIC 11.4.3. Logic 11.4.4. Memory 11.4.5. FPGA 11.5. North America Radiation-Hardened Electronics Market Value Share Analysis, By Manufacturing Technique 11.6. North America Radiation-Hardened Electronics Market Forecast, By Manufacturing Technique 11.6.1. RHBD (Radiation Hardening by Design) 11.6.2. RHBP(Radiation Hardening by Process) 11.7. North America Radiation-Hardened Electronics Market Value Share Analysis, by Application 11.8. North America Radiation-Hardened Electronics Market Forecast, by Application 11.8.1. Space (Satellite) 11.8.2. Aerospace & Defense 11.8.3. Nuclear Power Plant 11.9. North America Radiation-Hardened Electronics Market Value Share Analysis, by Country 11.10. North America Radiation-Hardened Electronics Market Forecast, by Country 11.10.1. U.S. 11.10.2. Canada 11.11. North America Radiation-Hardened Electronics Market Analysis, by Country 11.12. U.S. Radiation-Hardened Electronics Market Forecast, By Component 11.12.1. Power Management 11.12.2. ASIC 11.12.3. Logic 11.12.4. Memory 11.12.5. FPGA 11.13. U.S. Radiation-Hardened Electronics Market Forecast, By Manufacturing Technique 11.13.1. RHBD (Radiation Hardening by Design) 11.13.2. RHBP(Radiation Hardening by Process) 11.14. U.S. Radiation-Hardened Electronics Market Forecast, by Application 11.14.1. Space (Satellite) 11.14.2. Aerospace & Defense 11.14.3. Nuclear Power Plant 11.15. Canada Radiation-Hardened Electronics Market Forecast, By Component 11.15.1. Power Management 11.15.2. ASIC 11.15.3. Logic 11.15.4. Memory 11.15.5. FPGA 11.16. Canada Radiation-Hardened Electronics Market Forecast, By Manufacturing Technique 11.16.1. RHBD (Radiation Hardening by Design) 11.16.2. RHBP(Radiation Hardening by Process) 11.17. Canada Radiation-Hardened Electronics Market Forecast, by Application 11.17.1. Space (Satellite) 11.17.2. Aerospace & Defense 11.17.3. Nuclear Power Plant 11.18. North America Radiation-Hardened Electronics Market Attractiveness Analysis 11.18.1. By Component 11.18.2. By Manufacturing Technique 11.18.3. By Application 11.19. PEST Analysis 11.20. Key Trends 11.21. Key Development 12. Europe Radiation-Hardened Electronics Market Analysis 12.1. Key Findings 12.2. Europe Radiation-Hardened Electronics Market Overview 12.3. Europe Radiation-Hardened Electronics Market Value Share Analysis, By Component 12.4. Europe Radiation-Hardened Electronics Market Forecast, By Component 12.4.1. Power Management 12.4.2. ASIC 12.4.3. Logic 12.4.4. Memory 12.4.5. FPGA 12.5. Europe Radiation-Hardened Electronics Market Value Share Analysis, By Manufacturing Technique 12.6. Europe Radiation-Hardened Electronics Market Forecast, By Manufacturing Technique 12.6.1. RHBD (Radiation Hardening by Design) 12.6.2. RHBP(Radiation Hardening by Process) 12.7. Europe Radiation-Hardened Electronics Market Value Share Analysis, by Application 12.8. Europe Radiation-Hardened Electronics Market Forecast, by Application 12.8.1. Space (Satellite) 12.8.2. Aerospace & Defense 12.8.3. Nuclear Power Plant 12.9. Europe Radiation-Hardened Electronics Market Value Share Analysis, by Country 12.10. Europe Radiation-Hardened Electronics Market Forecast, by Country 12.10.1. Germany 12.10.2. U.K. 12.10.3. France 12.10.4. Italy 12.10.5. Spain 12.10.6. Rest of Europe 12.11. Europe Radiation-Hardened Electronics Market Analysis, by Country 12.12. Germany Radiation-Hardened Electronics Market Forecast, By Component 12.12.1. Power Management 12.12.2. ASIC 12.12.3. Logic 12.12.4. Memory 12.12.5. FPGA 12.13. Germany Radiation-Hardened Electronics Market Forecast, By Manufacturing Technique 12.13.1. RHBD (Radiation Hardening by Design) 12.13.2. RHBP(Radiation Hardening by Process) 12.14. Germany Radiation-Hardened Electronics Market Forecast, by Application 12.14.1. Space (Satellite) 12.14.2. Aerospace & Defense 12.14.3. Nuclear Power Plant 12.15. U.K. Radiation-Hardened Electronics Market Forecast, By Component 12.15.1. Power Management 12.15.2. ASIC 12.15.3. Logic 12.15.4. Memory 12.15.5. FPGA 12.16. U.K. Radiation-Hardened Electronics Market Forecast, By Manufacturing Technique 12.16.1. RHBD (Radiation Hardening by Design) 12.16.2. RHBP(Radiation Hardening by Process) 12.17. U.K. Radiation-Hardened Electronics Market Forecast, by Application 12.17.1. Space (Satellite) 12.17.2. Aerospace & Defense 12.17.3. Nuclear Power Plant 12.18. France Radiation-Hardened Electronics Market Forecast, By Component 12.18.1. Power Management 12.18.2. ASIC 12.18.3. Logic 12.18.4. Memory 12.18.5. FPGA 12.19. France Radiation-Hardened Electronics Market Forecast, By Manufacturing Technique 12.19.1. RHBD (Radiation Hardening by Design) 12.19.2. RHBP(Radiation Hardening by Process) 12.20. France Radiation-Hardened Electronics Market Forecast, by Application 12.20.1. Space (Satellite) 12.20.2. Aerospace & Defense 12.20.3. Nuclear Power Plant 12.21. Italy Radiation-Hardened Electronics Market Forecast, By Component 12.21.1. Power Management 12.21.2. ASIC 12.21.3. Logic 12.21.4. Memory 12.21.5. FPGA 12.22. Italy Radiation-Hardened Electronics Market Forecast, By Manufacturing Technique 12.22.1. RHBD (Radiation Hardening by Design) 12.22.2. RHBP(Radiation Hardening by Process) 12.23. Italy Radiation-Hardened Electronics Market Forecast, by Application 12.23.1. Space (Satellite) 12.23.2. Aerospace & Defense 12.23.3. Nuclear Power Plant 12.24. Spain Radiation-Hardened Electronics Market Forecast, By Component 12.24.1. Power Management 12.24.2. ASIC 12.24.3. Logic 12.24.4. Memory 12.24.5. FPGA 12.25. Spain Radiation-Hardened Electronics Market Forecast, By Manufacturing Technique 12.25.1. RHBD (Radiation Hardening by Design) 12.25.2. RHBP(Radiation Hardening by Process) 12.26. Spain Radiation-Hardened Electronics Market Forecast, by Application 12.26.1. Space (Satellite) 12.26.2. Aerospace & Defense 12.26.3. Nuclear Power Plant 12.27. Rest of Europe Radiation-Hardened Electronics Market Forecast, By Component 12.27.1. Power Management 12.27.2. ASIC 12.27.3. Logic 12.27.4. Memory 12.27.5. FPGA 12.28. Rest of Europe Radiation-Hardened Electronics Market Forecast, By Manufacturing Technique 12.28.1. RHBD (Radiation Hardening by Design) 12.28.2. RHBP(Radiation Hardening by Process) 12.29. Rest of Europe Radiation-Hardened Electronics Market Forecast, by Application 12.29.1. Space (Satellite) 12.29.2. Aerospace & Defense 12.29.3. Nuclear Power Plant 12.30. Europe Radiation-Hardened Electronics Market Attractiveness Analysis 12.30.1. By Component 12.30.2. By Manufacturing Technique 12.30.3. By Application 12.31. PEST Analysis 12.32. Key Trends 12.33. Key Development 13. Asia Pacific Radiation-Hardened Electronics Market Analysis 13.1. Key Findings 13.2. Asia Pacific Radiation-Hardened Electronics Market Overview 13.3. Asia Pacific Radiation-Hardened Electronics Market Value Share Analysis, By Component 13.4. Asia Pacific Radiation-Hardened Electronics Market Forecast, By Component 13.4.1. Power Management 13.4.2. ASIC 13.4.3. Logic 13.4.4. Memory 13.4.5. FPGA 13.5. Asia Pacific Radiation-Hardened Electronics Market Value Share Analysis, By Manufacturing Technique 13.6. Asia Pacific Radiation-Hardened Electronics Market Forecast, By Manufacturing Technique 13.6.1. RHBD (Radiation Hardening by Design) 13.6.2. RHBP(Radiation Hardening by Process) 13.7. Asia Pacific Radiation-Hardened Electronics Market Value Share Analysis, by Application 13.8. Asia Pacific Radiation-Hardened Electronics Market Forecast, by Application 13.8.1. Space (Satellite) 13.8.2. Aerospace & Defense 13.8.3. Nuclear Power Plant 13.9. Asia Pacific Radiation-Hardened Electronics Market Value Share Analysis, by Country 13.10. Asia Pacific Radiation-Hardened Electronics Market Forecast, by Country 13.10.1. China 13.10.2. India 13.10.3. Japan 13.10.4. ASEAN 13.10.5. Rest of Asia Pacific 13.11. Asia Pacific Radiation-Hardened Electronics Market Analysis, by Country 13.12. China Radiation-Hardened Electronics Market Forecast, By Component 13.12.1. Power Management 13.12.2. ASIC 13.12.3. Logic 13.12.4. Memory 13.12.5. FPGA 13.13. China Radiation-Hardened Electronics Market Forecast, By Manufacturing Technique 13.13.1. RHBD (Radiation Hardening by Design) 13.13.2. RHBP(Radiation Hardening by Process) 13.14. China Radiation-Hardened Electronics Market Forecast, by Application 13.14.1. Space (Satellite) 13.14.2. Aerospace & Defense 13.14.3. Nuclear Power Plant 13.15. India Radiation-Hardened Electronics Market Forecast, By Component 13.15.1. Power Management 13.15.2. ASIC 13.15.3. Logic 13.15.4. Memory 13.15.5. FPGA 13.16. India Radiation-Hardened Electronics Market Forecast, By Manufacturing Technique 13.16.1. RHBD (Radiation Hardening by Design) 13.16.2. RHBP(Radiation Hardening by Process) 13.17. India Radiation-Hardened Electronics Market Forecast, by Application 13.17.1. Space (Satellite) 13.17.2. Aerospace & Defense 13.17.3. Nuclear Power Plant 13.18. Japan Radiation-Hardened Electronics Market Forecast, By Component 13.18.1. Power Management 13.18.2. ASIC 13.18.3. Logic 13.18.4. Memory 13.18.5. FPGA 13.19. Japan Radiation-Hardened Electronics Market Forecast, By Manufacturing Technique 13.19.1. RHBD (Radiation Hardening by Design) 13.19.2. RHBP(Radiation Hardening by Process) 13.20. Japan Radiation-Hardened Electronics Market Forecast, by Application 13.20.1. Space (Satellite) 13.20.2. Aerospace & Defense 13.20.3. Nuclear Power Plant 13.21. ASEAN Radiation-Hardened Electronics Market Forecast, By Component 13.21.1. Power Management 13.21.2. ASIC 13.21.3. Logic 13.21.4. Memory 13.21.5. FPGA 13.22. ASEAN Radiation-Hardened Electronics Market Forecast, By Manufacturing Technique 13.22.1. RHBD (Radiation Hardening by Design) 13.22.2. RHBP(Radiation Hardening by Process) 13.23. ASEAN Radiation-Hardened Electronics Market Forecast, by Application 13.23.1. Space (Satellite) 13.23.2. Aerospace & Defense 13.23.3. Nuclear Power Plant 13.24. Rest of Asia Pacific Radiation-Hardened Electronics Market Forecast, By Component 13.24.1. Power Management 13.24.2. ASIC 13.24.3. Logic 13.24.4. Memory 13.24.5. FPGA 13.25. Rest of Asia Pacific Radiation-Hardened Electronics Market Forecast, By Manufacturing Technique 13.25.1. RHBD (Radiation Hardening by Design) 13.25.2. RHBP(Radiation Hardening by Process) 13.26. Rest of Asia Pacific Radiation-Hardened Electronics Market Forecast, by Application 13.26.1. Space (Satellite) 13.26.2. Aerospace & Defense 13.26.3. Nuclear Power Plant 13.27. Asia Pacific Radiation-Hardened Electronics Market Attractiveness Analysis 13.27.1. By Component 13.27.2. By Manufacturing Technique 13.27.3. By Application 13.28. PEST Analysis 13.29. Key Trends 13.30. Key Development 14. Middle East & Africa Radiation-Hardened Electronics Market Analysis 14.1. Key Findings 14.2. Middle East & Africa Radiation-Hardened Electronics Market Overview 14.3. Middle East & Africa Radiation-Hardened Electronics Market Value Share Analysis, By Component 14.4. Middle East & Africa Radiation-Hardened Electronics Market Forecast, By Component 14.4.1. Power Management 14.4.2. ASIC 14.4.3. Logic 14.4.4. Memory 14.4.5. FPGA 14.5. Middle East & Africa Radiation-Hardened Electronics Market Value Share Analysis, By Manufacturing Technique 14.6. Middle East & Africa Radiation-Hardened Electronics Market Forecast, By Manufacturing Technique 14.6.1. RHBD (Radiation Hardening by Design) 14.6.2. RHBP(Radiation Hardening by Process) 14.7. Middle East & Africa Radiation-Hardened Electronics Market Value Share Analysis, by Application 14.8. Middle East & Africa Radiation-Hardened Electronics Market Forecast, by Application 14.8.1. Space (Satellite) 14.8.2. Aerospace & Defense 14.8.3. Nuclear Power Plant 14.9. Middle East & Africa Radiation-Hardened Electronics Market Value Share Analysis, by Country 14.10. Middle East & Africa Radiation-Hardened Electronics Market Forecast, by Country 14.10.1. GCC 14.10.2. South Africa 14.10.3. Rest of Middle East & Africa 14.11. Middle East & Africa Radiation-Hardened Electronics Market Analysis, by Country 14.12. GCC Radiation-Hardened Electronics Market Forecast, By Component 14.12.1. Power Management 14.12.2. ASIC 14.12.3. Logic 14.12.4. Memory 14.12.5. FPGA 14.13. GCC Radiation-Hardened Electronics Market Forecast, By Manufacturing Technique 14.13.1. RHBD (Radiation Hardening by Design) 14.13.2. RHBP(Radiation Hardening by Process) 14.14. GCC Radiation-Hardened Electronics Market Forecast, by Application 14.14.1. Space (Satellite) 14.14.2. Aerospace & Defense 14.14.3. Nuclear Power Plant 14.15. South Africa Radiation-Hardened Electronics Market Forecast, By Component 14.15.1. Power Management 14.15.2. ASIC 14.15.3. Logic 14.15.4. Memory 14.15.5. FPGA 14.16. South Africa Radiation-Hardened Electronics Market Forecast, By Manufacturing Technique 14.16.1. RHBD (Radiation Hardening by Design) 14.16.2. RHBP(Radiation Hardening by Process) 14.17. South Africa Radiation-Hardened Electronics Market Forecast, by Application 14.17.1. Space (Satellite) 14.17.2. Aerospace & Defense 14.17.3. Nuclear Power Plant 14.18. Rest of Middle East & Africa Radiation-Hardened Electronics Market Forecast, By Component 14.18.1. Power Management 14.18.2. ASIC 14.18.3. Logic 14.18.4. Memory 14.18.5. FPGA 14.19. Rest of Middle East & Africa Radiation-Hardened Electronics Market Forecast, By Manufacturing Technique 14.19.1. RHBD (Radiation Hardening by Design) 14.19.2. RHBP(Radiation Hardening by Process) 14.20. Rest of Middle East & Africa Radiation-Hardened Electronics Market Forecast, by Application 14.20.1. Space (Satellite) 14.20.2. Aerospace & Defense 14.20.3. Nuclear Power Plant 14.21. Middle East & Africa Radiation-Hardened Electronics Market Attractiveness Analysis 14.21.1. By Component 14.21.2. By Manufacturing Technique 14.21.3. By Application 14.22. PEST Analysis 14.23. Key Trends 14.24. Key Development 15. South America Radiation-Hardened Electronics Market Analysis 15.1. Key Findings 15.2. South America Radiation-Hardened Electronics Market Overview 15.3. South America Radiation-Hardened Electronics Market Value Share Analysis, By Component 15.4. South America Radiation-Hardened Electronics Market Forecast, By Component 15.4.1. Power Management 15.4.2. ASIC 15.4.3. Logic 15.4.4. Memory 15.4.5. FPGA 15.5. South America Radiation-Hardened Electronics Market Value Share Analysis, By Manufacturing Technique 15.6. South America Radiation-Hardened Electronics Market Forecast, By Manufacturing Technique 15.6.1. RHBD (Radiation Hardening by Design) 15.6.2. RHBP(Radiation Hardening by Process) 15.7. South America Radiation-Hardened Electronics Market Value Share Analysis, by Application 15.8. South America Radiation-Hardened Electronics Market Forecast, by Application 15.8.1. Space (Satellite) 15.8.2. Aerospace & Defense 15.8.3. Nuclear Power Plant 15.9. South America Radiation-Hardened Electronics Market Value Share Analysis, by Country 15.10. South America Radiation-Hardened Electronics Market Forecast, by Country 15.10.1. Brazil 15.10.2. Mexico 15.10.3. Rest of South America 15.11. South America Radiation-Hardened Electronics Market Analysis, by Country 15.12. Brazil Radiation-Hardened Electronics Market Forecast, By Component 15.12.1. Power Management 15.12.2. ASIC 15.12.3. Logic 15.12.4. Memory 15.12.5. FPGA 15.13. Brazil Radiation-Hardened Electronics Market Forecast, By Manufacturing Technique 15.13.1. RHBD (Radiation Hardening by Design) 15.13.2. RHBP(Radiation Hardening by Process) 15.14. Brazil Radiation-Hardened Electronics Market Forecast, by Application 15.14.1. Space (Satellite) 15.14.2. Aerospace & Defense 15.14.3. Nuclear Power Plant 15.15. Mexico Radiation-Hardened Electronics Market Forecast, By Component 15.15.1. Power Management 15.15.2. ASIC 15.15.3. Logic 15.15.4. Memory 15.15.5. FPGA 15.16. Mexico Radiation-Hardened Electronics Market Forecast, By Manufacturing Technique 15.16.1. RHBD (Radiation Hardening by Design) 15.16.2. RHBP(Radiation Hardening by Process) 15.17. Mexico Radiation-Hardened Electronics Market Forecast, by Application 15.17.1. Space (Satellite) 15.17.2. Aerospace & Defense 15.17.3. Nuclear Power Plant 15.18. Rest of South America Radiation-Hardened Electronics Market Forecast, By Component 15.18.1. Power Management 15.18.2. ASIC 15.18.3. Logic 15.18.4. Memory 15.18.5. FPGA 15.19. Rest of South America Radiation-Hardened Electronics Market Forecast, By Manufacturing Technique 15.19.1. RHBD (Radiation Hardening by Design) 15.19.2. RHBP(Radiation Hardening by Process) 15.20. Rest of South America Radiation-Hardened Electronics Market Forecast, by Application 15.20.1. Space (Satellite) 15.20.2. Aerospace & Defense 15.20.3. Nuclear Power Plant 15.21. South America Radiation-Hardened Electronics Market Attractiveness Analysis 15.21.1. By Component 15.21.2. By Manufacturing Technique 15.21.3. By Application 15.22. PEST Analysis 15.23. Key Trends 15.24. Key Development 16. Company Profiles 16.1. Market Share Analysis, by Company 16.2. Competition Matrix 16.2.1. Competitive Benchmarking of key players by price, presence, market share, Applications and R&D investment 16.2.2. New Product Launches and Product Enhancements 16.2.3. Market Consolidation 16.2.3.1. M&A by Regions, Investment and Applications 16.2.3.2. M&A Key Players, Forward Integration and Backward Integration 16.3. Company Profiles: Key Players 16.3.1. Honeywell Aerospace 16.3.1.1. Company Overview 16.3.1.2. Financial Overview 16.3.1.3. Product Portfolio 16.3.1.4. Business Strategy 16.3.1.5. Recent Developments 16.3.1.6. Company Footprint 16.3.2. BAE Systems 16.3.3. Microsemi Corporation 16.3.4. Xilinx Incorporation 16.3.5. Texas Instruments 16.3.6. Maxwell Technologies 16.3.7. Intersil Corporation 16.3.8. Atmel Corporation 16.3.9. Linear Technology Corporation 16.3.10. ST Microelectronics 16.3.11. Microchip Technology 16.3.12. Renesas Electronics 16.3.13. Infeneon Technologies 16.3.14. Cobham Plc 16.3.15. Data Device Corporation 16.3.16. Boeing Company 16.3.17. AIS Tech Space 16.3.18. Helios Wire 16.3.19. Kepler Communications 16.3.20. Swarm Technology 17. Primary Key Insights
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