Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market: Industry Analysis and forecast (2019 to 2026): By Type, Component, Application, and Region

Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market: Industry Analysis and forecast (2019 to 2026): By Type, Component, Application, and Region

Market Scenario

Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market was valued USD XX Bn in 2019 and is expected to reach US$ XX Bn by 2026, at CAGR of XX% during forecast period of 2019 to 2026. The report includes the analysis of impact of COVID-19 lock-down on the revenue of market leaders, followers, and disrupters. Since lock down was implemented differently in different regions and countries, impact of same is also different by regions and segments. The report has covered the current short term and long term impact on the market, same will help decision makers to prepare the outline for short term and long term strategies for companies by region. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Drivers and Restrains: The advancement of technologies, the change of consumer attitudes and the large quantity of waste electrical and electronic equipment (WEEE) is increasing annually. In light of their characteristics including complex structures, high metals content and potential hazards due to these factors waste PCBs are regarded as the most difficult parts of WEEE to be recycled. Hence, the issue has attracted much attention from researchers and enterprises in the recent ten years. The latest technology for waste PCBs typically categorized as manually dismantling and automatic approaches in developing and developed countries, respectively. Towards achieving the better sustainability and recyclability for waste PCBs, nonmetal powder and precious metals should be developed for a deep recovery using mechanical treatment. A significant shift is emerging from dismantling for recycling of printed circuit boards, to disassembling for remanufacturing of electronic components, which will indicate that a new paradigm of retrieving waste PCBs is shaping. Manufacturers in the E-scrap and printed circuit board (PCB) E-scrap are focusing on competitive pricing as the strategy to capture significant market share. Moreover, strategic mergers and acquisitions and technological innovations are also the key focus areas of the manufacturers. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Segmentation Analysis: Based on source of e-scrap, the market is classified into household appliances, IT and telecommunication products and entertainment devices. E-waste produced from household appliances accounted for the maximum share of the global e-waste market in 2016, at around XX% of the volume of the overall e-scrap and printed circuit board (PCB) e-scrap market. Moreover, the segment is expected to show sustainable growth throughout the forecast period due to high usage of various types of electronic equipment in household application in terms of units. In terms of PCB e-waste type, the market is segmented into telecommunication circuit cards, network communication boards, circuit packs and PC motherboards. The telecommunication circuit cards segment held the largest volume share of around XX% and a value share of XX% in the overall PCB e-scrap market in 2016. Moreover, it is expected to dominate the market throughout the forecast period. In terms of material extracted from PCB e-scrap, the market is segmented into ferrous components, metals (copper, aluminum, tin), and precious metals (gold, silver, palladium). The metals segment held the largest volume share of around XX% and value share of XX% in the overall e-scrap and PCB e-scrap market in 2016. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Regional Analysis: Geographically, Asia Pacific is the leading market for e-scrap and PCB e-scrap. Asia Pacific is also expected to witness the fastest growth during the forecast period. In the Asia Pacific region China, India, Japan, Australia, and South Korea are among the major markets for e-scrap and printed circuit board (PCB) e-scrap. The Asia Pacific market was valued at US$ XX bn in 2016 and is expected to rise to US$ XX bn by 2026 at a sturdy CAGR of 6.2% in the 2018-2026 forecast period. China is the leading national market for e-scrap and PCB e-scrap in Asia Pacific and is bettered only by the U.S. as to its share in the global e-scrap and PCB e-scrap market. The objective of the report is to present comprehensive assessment projections with a suitable set of assumptions and methodology. The report helps in understanding Global E-scrap and printed circuit board (PCB) E-scrap market dynamics, structure by identifying and analyzing the market segments and projecting the global market size. Further, the report also focuses on the competitive analysis of key players by product, price, financial position, growth strategies, and regional presence. To understand the market dynamics and by region, the report has covered the PEST analysis by region and key economies across the globe, which are supposed to have an impact on market in forecast period. PORTER’s analysis, and SVOR analysis of the market as well as detailed SWOT analysis of key players has been done to analyze their strategies. The report will be address all questions of shareholders to prioritize their efforts and investment in the near future to the emerging segment in the Global E-scrap and printed circuit board (PCB) E-scrap market.

Scope of the Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market:

Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market, by PCB E-Scrap Type:

• Telecommunications Circuit Cards • Network Communication Boards • Circuit Packs • PC Motherboards

Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market, by Source of e-scrap:

• Household appliances • IT and Telecommunication products • Entertainment devices

Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market, by Material Recovered:

• Ferrous Components • Metals (Copper, Aluminum, Tin) • Precious Metals (Gold, Silver, Palladium)

Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market, by Region:

• Asia Pacific • North America • Europe • Latin America • Middle East Africa

Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market, Major Players:

• Umicore N.V. • LS-Nikko Copper Inc. • Boliden Group • Dowa Holdings Co. Ltd. • Ultromext Ltd • GCL Recycling and Refining • URT Recycling Technology • Mairec • Feeco International • Qizheng • AmeriScraps

Table of Contents

Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market

1. Preface 1.1. Report Scope and Market Segmentation 1.2. Research Highlights 1.3. Research Objectives 2. Assumptions and Research Methodology 2.1. Report Assumptions 2.2. Abbreviations 2.3. Research Methodology 2.3.1. Secondary Research 2.3.1.1. Secondary data 2.3.1.2. Secondary Sources 2.3.2. Primary Research 2.3.2.1. Data from Primary Sources 2.3.2.2. Breakdown of Primary Sources 3. Executive Summary: Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Size, by Market Value (US$ Bn) 4. Market Overview 4.1. Introduction 4.2. Market Indicator 4.2.1. Drivers 4.2.2. Restraints 4.2.3. Opportunities 4.2.4. Challenges 4.3. Porter’s Analysis 4.4. Value Chain Analysis 4.5. Market Risk Analysis 4.6. SWOT Analysis 4.7. Industry Trends and Emerging Technologies 5. Supply Side and Demand Side Indicators 6. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis and Forecast 6.1. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Size & Y-o-Y Growth Analysis 6.1.1. North America 6.1.2. Europe 6.1.3. Asia Pacific 6.1.4. Middle East & Africa 6.1.5. South America 7. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis and Forecast, by Source of e-scrap 7.1. Introduction and Definition 7.2. Key Findings 7.3. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Source of e-scrap 7.4. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Size (US$ Bn) Forecast, by Source of e-scrap 7.5. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis, by Source of e-scrap 7.6. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Attractiveness Analysis, by Source of e-scrap 8. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis and Forecast, by PCB E-Scrap Type 8.1. Introduction and Definition 8.2. Key Findings 8.3. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by PCB E-Scrap Type 8.4. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Size (US$ Bn) Forecast, by PCB E-Scrap Type 8.5. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis, by PCB E-Scrap Type 8.6. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Attractiveness Analysis, by PCB E-Scrap Type 9. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis and Forecast, by Material Recovered 9.1. Introduction and Definition 9.2. Key Findings 9.3. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Material Recovered 9.4. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Size (US$ Bn) Forecast, by Material Recovered 9.5. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis, by Material Recovered 9.6. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Attractiveness Analysis, by Material Recovered 10. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis, by Region 10.1. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Region 10.2. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Size (US$ Bn) Forecast, by Region 10.3. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Attractiveness Analysis, by Region 11. North America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis 11.1. Key Findings 11.2. North America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Overview 11.3. North America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Source of e-scrap 11.4. North America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap 11.4.1. household appliances 11.4.2. IT and Telecommunication products 11.4.3. Entertainment devices 11.5. North America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by PCB E-Scrap Type 11.6. North America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type 11.6.1. Telecommunications Circuit Cards 11.6.2. Network Communication Boards 11.6.3. Circuit Packs 11.6.4. PC Motherboards 11.7. North America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Material Recovered 11.8. North America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered 11.8.1. Ferrous Components 11.8.2. Metals (Copper, Aluminum, Tin) 11.8.3. Precious Metals (Gold, Silver, Palladium) 11.9. North America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Country 11.10. North America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Country 11.10.1. U.S. 11.10.2. Canada 11.11. North America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis, by Country 11.12. U.S. E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap 11.12.1. household appliances 11.12.2. IT and Telecommunication products 11.12.3. Entertainment devices 11.13. U.S. E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type 11.13.1. Telecommunications Circuit Cards 11.13.2. Network Communication Boards 11.13.3. Circuit Packs 11.13.4. PC Motherboards 11.14. U.S. E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered 11.14.1. Ferrous Components 11.14.2. Metals (Copper, Aluminum, Tin) 11.14.3. Precious Metals (Gold, Silver, Palladium) 11.15. Canada E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap 11.15.1. household appliances 11.15.2. IT and Telecommunication products 11.15.3. Entertainment devices 11.16. Steel Canada E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type 11.16.1. Telecommunications Circuit Cards 11.16.2. Network Communication Boards 11.16.3. Circuit Packs 11.16.4. PC Motherboards 11.17. Canada E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered 11.17.1. Ferrous Components 11.17.2. Metals (Copper, Aluminum, Tin) 11.17.3. Precious Metals (Gold, Silver, Palladium) 11.18. North America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Attractiveness Analysis 11.18.1. By Source of e-scrap 11.18.2. By PCB E-Scrap Type 11.18.3. By Material Recovered 11.19. PEST Analysis 11.20. Key Trends 11.21. Key Developments 12. Europe E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis 12.1. Key Findings 12.2. Europe E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Overview 12.3. Europe E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Source of e-scrap 12.4. Europe E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap 12.4.1. household appliances 12.4.2. IT and Telecommunication products 12.4.3. Entertainment devices 12.5. Europe E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by PCB E-Scrap Type 12.6. Europe E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type 12.6.1. Telecommunications Circuit Cards 12.6.2. Network Communication Boards 12.6.3. Circuit Packs 12.6.4. PC Motherboards 12.7. Europe E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Material Recovered 12.8. Europe E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered 12.8.1. Ferrous Components 12.8.2. Metals (Copper, Aluminum, Tin) 12.8.3. Precious Metals (Gold, Silver, Palladium) 12.9. Europe E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Country 12.10. Europe E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Country 12.10.1. Germany 12.10.2. U.K. 12.10.3. France 12.10.4. Italy 12.10.5. Spain 12.10.6. Rest of Europe 12.11. Europe E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis, by Country 12.12. Germany E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap 12.12.1. household appliances 12.12.2. IT and Telecommunication products 12.12.3. Entertainment devices 12.13. Germany E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type 12.13.1. Telecommunications Circuit Cards 12.13.2. Network Communication Boards 12.13.3. Circuit Packs 12.13.4. PC Motherboards 12.14. Germany E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered 12.14.1. Ferrous Components 12.14.2. Metals (Copper, Aluminum, Tin) 12.14.3. Precious Metals (Gold, Silver, Palladium) 12.15. U.K. E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap 12.15.1. household appliances 12.15.2. IT and Telecommunication products 12.15.3. Entertainment devices 12.16. U.K. E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type 12.16.1. Telecommunications Circuit Cards 12.16.2. Network Communication Boards 12.16.3. Circuit Packs 12.16.4. PC Motherboards 12.17. U.K. E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered 12.17.1. Ferrous Components 12.17.2. Metals (Copper, Aluminum, Tin) 12.17.3. Precious Metals (Gold, Silver, Palladium) 12.18. France E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap 12.18.1. household appliances 12.18.2. IT and Telecommunication products 12.18.3. Entertainment devices 12.19. France E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type 12.19.1. Telecommunications Circuit Cards 12.19.2. Network Communication Boards 12.19.3. Circuit Packs 12.19.4. PC Motherboards 12.20. France E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered 12.20.1. Ferrous Components 12.20.2. Metals (Copper, Aluminum, Tin) 12.20.3. Precious Metals (Gold, Silver, Palladium) 12.21. Italy E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap 12.21.1. household appliances 12.21.2. IT and Telecommunication products 12.21.3. Entertainment devices 12.22. Italy E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type 12.22.1. Telecommunications Circuit Cards 12.22.2. Network Communication Boards 12.22.3. Circuit Packs 12.22.4. PC Motherboards 12.23. Italy E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered 12.23.1. Ferrous Components 12.23.2. Metals (Copper, Aluminum, Tin) 12.23.3. Precious Metals (Gold, Silver, Palladium) 12.24. Spain E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap 12.24.1. household appliances 12.24.2. IT and Telecommunication products 12.24.3. Entertainment devices 12.25. Spain E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type 12.25.1. Telecommunications Circuit Cards 12.25.2. Network Communication Boards 12.25.3. Circuit Packs 12.25.4. PC Motherboards 12.26. Spain E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered 12.26.1. Ferrous Components 12.26.2. Metals (Copper, Aluminum, Tin) 12.26.3. Precious Metals (Gold, Silver, Palladium) 12.27. Rest of Europe E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap 12.27.1. household appliances 12.27.2. IT and Telecommunication products 12.27.3. Entertainment devices 12.28. Rest of Europe E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type 12.28.1. Telecommunications Circuit Cards 12.28.2. Network Communication Boards 12.28.3. Circuit Packs 12.28.4. PC Motherboards 12.29. Rest Of Europe E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered 12.29.1. Ferrous Components 12.29.2. Metals (Copper, Aluminum, Tin) 12.29.3. Precious Metals (Gold, Silver, Palladium) 12.30. Europe E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Attractiveness Analysis 12.30.1. By Source of e-scrap 12.30.2. By PCB E-Scrap Type 12.30.3. By Material Recovered 12.31. PEST Analysis 12.32. Key Trends 12.33. Key Developments 13. Asia Pacific E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis 13.1. Key Findings 13.2. Asia Pacific E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Overview 13.3. Asia Pacific E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Source of e-scrap 13.4. Asia Pacific E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap 13.4.1. household appliances 13.4.2. IT and Telecommunication products 13.4.3. Entertainment devices 13.5. Asia Pacific E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by PCB E-Scrap Type 13.6. Asia Pacific E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type 13.6.1. Telecommunications Circuit Cards 13.6.2. Network Communication Boards 13.6.3. Circuit Packs 13.6.4. PC Motherboards 13.7. Asia Pacific E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Material Recovered 13.8. Asia Pacific E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered 13.8.1. Ferrous Components 13.8.2. Metals (Copper, Aluminum, Tin) 13.8.3. Precious Metals (Gold, Silver, Palladium) 13.9. Asia Pacific E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Country 13.10. Asia Pacific E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Country 13.10.1. China 13.10.2. India 13.10.3. Japan 13.10.4. ASEAN 13.10.5. Rest of Asia Pacific 13.11. Asia Pacific E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis, by Country 13.12. China E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap 13.12.1. household appliances 13.12.2. IT and Telecommunication products 13.12.3. Entertainment devices 13.13. China E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type 13.13.1. Telecommunications Circuit Cards 13.13.2. Network Communication Boards 13.13.3. Circuit Packs 13.13.4. PC Motherboards 13.14. China E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered 13.14.1. Ferrous Components 13.14.2. Metals (Copper, Aluminum, Tin) 13.14.3. Precious Metals (Gold, Silver, Palladium) 13.15. India E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap 13.15.1. household appliances 13.15.2. IT and Telecommunication products 13.15.3. Entertainment devices 13.16. India E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type 13.16.1. Telecommunications Circuit Cards 13.16.2. Network Communication Boards 13.16.3. Circuit Packs 13.16.4. PC Motherboards 13.17. India E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered 13.17.1. Ferrous Components 13.17.2. Metals (Copper, Aluminum, Tin) 13.17.3. Precious Metals (Gold, Silver, Palladium) 13.18. Japan E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap 13.18.1. household appliances 13.18.2. IT and Telecommunication products 13.18.3. Entertainment devices 13.19. Japan E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type 13.19.1. Telecommunications Circuit Cards 13.19.2. Network Communication Boards 13.19.3. Circuit Packs 13.19.4. PC Motherboards 13.20. Japan E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered 13.20.1. Ferrous Components 13.20.2. Metals (Copper, Aluminum, Tin) 13.20.3. Precious Metals (Gold, Silver, Palladium) 13.21. ASEAN E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap 13.21.1. household appliances 13.21.2. IT and Telecommunication products 13.21.3. Entertainment devices 13.22. ASEAN E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type 13.22.1. Telecommunications Circuit Cards 13.22.2. Network Communication Boards 13.22.3. Circuit Packs 13.22.4. PC Motherboards 13.23. ASEAN E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered 13.23.1. Ferrous Components 13.23.2. Metals (Copper, Aluminum, Tin) 13.23.3. Precious Metals (Gold, Silver, Palladium) 13.24. Rest of Asia Pacific E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap 13.24.1. household appliances 13.24.2. IT and Telecommunication products 13.24.3. Entertainment devices 13.25. Rest of Asia Pacific E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type 13.25.1. Telecommunications Circuit Cards 13.25.2. Network Communication Boards 13.25.3. Circuit Packs 13.25.4. PC Motherboards 13.26. Rest of Asia Pacific E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered 13.26.1. Ferrous Components 13.26.2. Metals (Copper, Aluminum, Tin) 13.26.3. Precious Metals (Gold, Silver, Palladium) 13.27. Asia Pacific E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Attractiveness Analysis 13.27.1. By Source of e-scrap 13.27.2. By PCB E-Scrap Type 13.27.3. By Material Recovered 13.28. PEST Analysis 13.29. Key Trends 13.30. Key Developments 14. Middle East & Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis 14.1. Key Findings 14.2. Middle East & Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Overview 14.3. Middle East & Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Source of e-scrap 14.4. Middle East & Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap 14.4.1. household appliances 14.4.2. IT and Telecommunication products 14.4.3. Entertainment devices 14.5. Middle East & Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by PCB E-Scrap Type 14.6. Middle East & Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type 14.6.1. Telecommunications Circuit Cards 14.6.2. Network Communication Boards 14.6.3. Circuit Packs 14.6.4. PC Motherboards 14.7. Middle East & Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Material Recovered 14.8. Middle East & Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered 14.8.1. Ferrous Components 14.8.2. Metals (Copper, Aluminum, Tin) 14.8.3. Precious Metals (Gold, Silver, Palladium) 14.9. Middle East & Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Country 14.10. Middle East & Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Country 14.10.1. GCC 14.10.2. South Africa 14.10.3. Rest of Middle East & Africa 14.11. Middle East & Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis, by Country 14.12. GCC E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap 14.12.1. household appliances 14.12.2. IT and Telecommunication products 14.12.3. Entertainment devices 14.13. GCC E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type 14.13.1. Telecommunications Circuit Cards 14.13.2. Network Communication Boards 14.13.3. Circuit Packs 14.13.4. PC Motherboards 14.14. GCC E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered 14.14.1. Ferrous Components 14.14.2. Metals (Copper, Aluminum, Tin) 14.14.3. Precious Metals (Gold, Silver, Palladium) 14.15. South Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap 14.15.1. household appliances 14.15.2. IT and Telecommunication products 14.15.3. Entertainment devices 14.16. South Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type 14.16.1. Telecommunications Circuit Cards 14.16.2. Network Communication Boards 14.16.3. Circuit Packs 14.16.4. PC Motherboards 14.17. South Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered 14.17.1. Ferrous Components 14.17.2. Metals (Copper, Aluminum, Tin) 14.17.3. Precious Metals (Gold, Silver, Palladium) 14.18. Rest of Middle East & Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap 14.18.1. household appliances 14.18.2. IT and Telecommunication products 14.18.3. Entertainment devices 14.19. Rest of Middle East & Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type 14.19.1. Telecommunications Circuit Cards 14.19.2. Network Communication Boards 14.19.3. Circuit Packs 14.19.4. PC Motherboards 14.20. Rest of Middle East & Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered 14.20.1. Ferrous Components 14.20.2. Metals (Copper, Aluminum, Tin) 14.20.3. Precious Metals (Gold, Silver, Palladium) 14.21. Middle East & Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Attractiveness Analysis 14.21.1. By Source of e-scrap 14.21.2. By PCB E-Scrap Type 14.21.3. By Material Recovered 14.22. PEST Analysis 14.23. Key Trends 14.24. Key Developments 15. South America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis 15.1. Key Findings 15.2. South America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Overview 15.3. South America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Source of e-scrap 15.4. South America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap 15.4.1. household appliances 15.4.2. IT and Telecommunication products 15.4.3. Entertainment devices 15.5. South America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by PCB E-Scrap Type 15.6. South America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type 15.6.1. Telecommunications Circuit Cards 15.6.2. Network Communication Boards 15.6.3. Circuit Packs 15.6.4. PC Motherboards 15.7. South America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Material Recovered 15.8. South America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered 15.8.1. Ferrous Components 15.8.2. Metals (Copper, Aluminum, Tin) 15.8.3. Precious Metals (Gold, Silver, Palladium) 15.9. South America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Country 15.10. South America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Country 15.10.1. Brazil 15.10.2. Mexico 15.10.3. Rest of South America 15.11. South America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis, by Country 15.12. Brazil E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap 15.12.1. household appliances 15.12.2. IT and Telecommunication products 15.12.3. Entertainment devices 15.13. Brazil E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type 15.13.1. Telecommunications Circuit Cards 15.13.2. Network Communication Boards 15.13.3. Circuit Packs 15.13.4. PC Motherboards 15.14. Brazil E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered 15.14.1. Ferrous Components 15.14.2. Metals (Copper, Aluminum, Tin) 15.14.3. Precious Metals (Gold, Silver, Palladium) 15.15. Mexico E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap 15.15.1. household appliances 15.15.2. IT and Telecommunication products 15.15.3. Entertainment devices 15.16. Mexico E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type 15.16.1. Telecommunications Circuit Cards 15.16.2. Network Communication Boards 15.16.3. Circuit Packs 15.16.4. PC Motherboards 15.17. Mexico E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered 15.17.1. Ferrous Components 15.17.2. Metals (Copper, Aluminum, Tin) 15.17.3. Precious Metals (Gold, Silver, Palladium) 15.18. Rest of South America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap 15.18.1. household appliances 15.18.2. IT and Telecommunication products 15.18.3. Entertainment devices 15.19. Rest of South America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type 15.19.1. Telecommunications Circuit Cards 15.19.2. Network Communication Boards 15.19.3. Circuit Packs 15.19.4. PC Motherboards 15.20. Rest of South America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered 15.20.1. Ferrous Components 15.20.2. Metals (Copper, Aluminum, Tin) 15.20.3. Precious Metals (Gold, Silver, Palladium) 15.21. South America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Attractiveness Analysis 15.21.1. By Source of e-scrap 15.21.2. By PCB E-Scrap Type 15.21.3. By Material Recovered 15.22. PEST Analysis 15.23. Key Trends 15.24. Key Developments 16. Company Profiles 16.1. Market Share Analysis, by Company 16.2. Competition Matrix 16.2.1. Competitive Benchmarking of key players by price, presence, market share, Applications and R&D investment 16.2.2. New Product Launches and Product Enhancements 16.2.3. Market Consolidation 16.2.3.1. M&A by Regions, Investment and Applications 16.2.3.2. M&A Key Players, Forward Integration and Backward Integration 16.3. Company Profiles: Key Players 16.3.1. Umicore N.V. 16.3.1.1. Company Overview 16.3.1.2. Financial Overview 16.3.1.3. Product Portfolio 16.3.1.4. Business Strategy 16.3.1.5. Recent Developments 16.3.1.6. Development Footprint 16.3.2. LS-Nikko Copper Inc. 16.3.3. Boliden Group 16.3.4. Dowa Holdings Co. Ltd. 16.3.5. Ultromext Ltd 16.3.6. GCL Recycling and Refining 16.3.7. URT Recycling Techno9logy 16.3.8. Mairec 16.3.9. Feeco International 16.3.10. Qizheng 16.3.11. AmeriScraps 17. Primary Key Insights

About This Report

Report ID35153
Category Electronics
Published DateOct 2019
No of Pages181
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