E-Scrap and Printed Circuit Board (PCB) E-Scrap Market: Global Industry Analysis and forecast (2023-2029)


EScrap and Printed Circuit Board (PCB) EScrap Market is expected to grow at a CAGR of 7.2% during the forecast period and the market is expected to reach US$ 68.24 Bn. by 2029.

The report includes the analysis of impact of COVID-19 lock-down on the revenue of market leaders, followers, and disrupters. Since lock down was implemented differently in different regions and countries, impact of same is also different by regions and segments. The report has covered the current short term and long term impact on the market, same will help decision makers to prepare the outline for short term and long term strategies for companies by region.EScrap and Printed Circuit Board (PCB) EScrap MarketTo know about the Research Methodology :- Request Free Sample Report

E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Drivers and Restrains:

The advancement of technologies, the change of consumer attitudes and the large quantity of waste electrical and electronic equipment (WEEE) is increasing annually. In light of their characteristics including complex structures, high metals content and potential hazards due to these factors waste PCBs are regarded as the most difficult parts of WEEE to be recycled. Hence, the issue has attracted much attention from researchers and enterprises in the recent ten years. The latest technology for waste PCBs typically categorized as manually dismantling and automatic approaches in developing and developed countries, respectively. Towards achieving the better sustainability and recyclability for waste PCBs, nonmetal powder and precious metals should be developed for a deep recovery using mechanical treatment. A significant shift is emerging from dismantling for recycling of printed circuit boards, to disassembling for remanufacturing of electronic components, which will indicate that a new paradigm of retrieving waste PCBs is shaping.

Manufacturers in the E-scrap and printed circuit board (PCB) E-scrap are focusing on competitive pricing as the strategy to capture significant market share. Moreover, strategic mergers and acquisitions and technological innovations are also the key focus areas of the manufacturers.

E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Segmentation Analysis:

Based on source of e-scrap, the market is classified into household appliances, IT and telecommunication products and entertainment devices. E-waste produced from household appliances accounted for the maximum share of the global e-waste market in 2016, at around xx% of the volume of the overall e-scrap and printed circuit board (PCB) e-scrap market. Moreover, the segment is expected to show sustainable growth throughout the forecast period due to high usage of various types of electronic equipment in household application in terms of units.

In terms of PCB e-waste type, the market is segmented into telecommunication circuit cards, network communication boards, circuit packs and PC motherboards. The telecommunication circuit cards segment held the largest volume share of around xx% and a value share of xx% in the overall PCB e-scrap market in 2016. Moreover, it is expected to dominate the market throughout the forecast period.

In terms of material extracted from PCB e-scrap, the market is segmented into ferrous components, metals (copper, aluminum, tin), and precious metals (gold, silver, palladium). The metals segment held the largest volume share of around xx% and value share of xx% in the overall e-scrap and PCB e-scrap market in 2016.

E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Regional Analysis:

Geographically, Asia Pacific is the leading market for e-scrap and PCB e-scrap. Asia Pacific is also expected to witness the fastest growth during the forecast period. In the Asia Pacific region China, India, Japan, Australia, and South Korea are among the major markets for e-scrap and printed circuit board (PCB) e-scrap. The Asia Pacific market was valued at US$ xx bn in 2022 and is expected to rise to US$ xx bn by 2029 at a sturdy CAGR of 6.2% in the 2023-2029 forecast period. China is the leading national market for e-scrap and PCB e-scrap in Asia Pacific and is bettered only by the U.S. as to its share in the global e-scrap and PCB e-scrap market.

The objective of the report is to present comprehensive assessment projections with a suitable set of assumptions and methodology. The report helps in understanding Global E-scrap and printed circuit board (PCB) E-scrap market dynamics, structure by identifying and analyzing the market segments and projecting the global market size. Further, the report also focuses on the competitive analysis of key players by product, price, financial position, growth strategies, and regional presence. To understand the market dynamics and by region, the report has covered the PEST analysis by region and key economies across the globe, which are supposed to have an impact on market in forecast period. PORTER’s analysis, and SVOR analysis of the market as well as detailed SWOT analysis of key players has been done to analyze their strategies. The report will be address all questions of shareholders to prioritize their efforts and investment in the near future to the emerging segment in the Global E-scrap and printed circuit board (PCB) E-scrap market.

E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Scope: Inquire before buying






E-Scrap and Printed Circuit Board (PCB) E-Scrap Market




Report Coverage
Details




Base Year:
2022
Forecast Period:
2023-2029




Historical Data:
2017 to 2022
Market Size in 2022:
US $ 41.94 Bn.




Forecast Period 2023 to 2029 CAGR:
7.2%
Market Size in 2029:
US $ 68.24 Bn.




 Segments Covered:
by PCB E-Scrap Type
• Telecommunications Circuit Cards
• Network Communication Boards
• Circuit Packs
• PC Motherboards




by Source of E-scrap
• Household appliances
• IT and Telecommunication products
• Entertainment devices




by Material Recovered
• Ferrous Components
• Metals (Copper, Aluminum, Tin)
• Precious Metals (Gold, Silver, Palladium)






EScrap and Printed Circuit Board (PCB) EScrap Market by Region

• North America (United States, Canada and Mexico)
• Europe (UK, France, Germany, Italy, Spain, Sweden, Austria and Rest of Europe)
• Asia Pacific (China, South Korea, Japan, India, Australia, Indonesia, Malaysia, Vietnam, Taiwan, Bangladesh, Pakistan and Rest of APAC)
• Middle East and Africa (South Africa, GCC, Egypt, Nigeria and Rest of ME&A)
• South America (Brazil, Argentina Rest of South America)

E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Key Players:

• Umicore N.V.
• LS-Nikko Copper Inc.
• Boliden Group
• Dowa Holdings Co. Ltd.
• Ultromext Ltd
• GCL Recycling and Refining
• URT Recycling Technology
• Mairec
• Feeco International
• Qizheng
• AmeriScraps
• LS-Nikko Copper Inc.
• Recycling Technology
• Sims Recycling Solutions
• EnvironCom
• Waste Management
• Dongjiang
• Cimelia
• Stena Metall Group
• URT Umwelt- und Recyclingtechnik GmbH,

Frequently Asked Questions:

1. Which region has the largest share in Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market?
Ans: Asia Pacific region held the highest share in 2022.

2. What is the growth rate of Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market?
Ans: The Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market is growing at a CAGR of 7.2% during forecasting period 2023-2029.

3. What is scope of the Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market report?
Ans: Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market report helps with the PESTEL, PORTER, COVID-19 Impact analysis, Recommendations for Investors & Leaders, and market estimation of the forecast period.

4. Who are the key players in Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market?
Ans: The important key players in the Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market are – Umicore N.V., LS-Nikko Copper Inc., Boliden Group, Dowa Holdings Co. Ltd., Ultromext Ltd, GCL Recycling and Refining, URT Recycling Technology, Mairec, Feeco International, Qizheng, AmeriScraps, LS-Nikko Copper Inc., Recycling Technology, Sims Recycling Solutions, EnvironCom, Waste Management, Dongjiang, Cimelia, Stena Metall Group, URT Umwelt- und Recyclingtechnik GmbH, and

5. What is the study period of this Market?
Ans: The Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market is studied from 2022 to 2029. 





Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market

1. Preface
1.1. Report Scope and Market Segmentation
1.2. Research Highlights
1.3. Research Objectives

2. Assumptions and Research Methodology
2.1. Report Assumptions
2.2. Abbreviations
2.3. Research Methodology
2.3.1. Secondary Research
2.3.1.1. Secondary data
2.3.1.2. Secondary Sources
2.3.2. Primary Research
2.3.2.1. Data from Primary Sources
2.3.2.2. Breakdown of Primary Sources

3. Executive Summary: Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Size, by Market Value (US$ Bn)

4. Market Overview
4.1. Introduction
4.2. Market Indicator
4.2.1. Drivers
4.2.2. Restraints
4.2.3. Opportunities
4.2.4. Challenges
4.3. Porter’s Analysis
4.4. Value Chain Analysis
4.5. Market Risk Analysis
4.6. SWOT Analysis
4.7. Industry Trends and Emerging Technologies

5. Supply Side and Demand Side Indicators

6. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis and Forecast
6.1. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Size & Y-o-Y Growth Analysis
6.1.1. North America
6.1.2. Europe
6.1.3. Asia Pacific
6.1.4. Middle East & Africa
6.1.5. South America

7. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis and Forecast, by Source of e-scrap
7.1. Introduction and Definition
7.2. Key Findings
7.3. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Source of e-scrap
7.4. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Size (US$ Bn) Forecast, by Source of e-scrap
7.5. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis, by Source of e-scrap
7.6. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Attractiveness Analysis, by Source of e-scrap

8. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis and Forecast, by PCB E-Scrap Type
8.1. Introduction and Definition
8.2. Key Findings
8.3. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by PCB E-Scrap Type
8.4. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Size (US$ Bn) Forecast, by PCB E-Scrap Type
8.5. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis, by PCB E-Scrap Type
8.6. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Attractiveness Analysis, by PCB E-Scrap Type

9. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis and Forecast, by Material Recovered
9.1. Introduction and Definition
9.2. Key Findings
9.3. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Material Recovered
9.4. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Size (US$ Bn) Forecast, by Material Recovered
9.5. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis, by Material Recovered
9.6. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Attractiveness Analysis, by Material Recovered

10. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis, by Region
10.1. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Region
10.2. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Size (US$ Bn) Forecast, by Region
10.3. Global E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Attractiveness Analysis, by Region

11. North America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis
11.1. Key Findings
11.2. North America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Overview
11.3. North America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Source of e-scrap
11.4. North America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap
11.4.1. household appliances
11.4.2. IT and Telecommunication products
11.4.3. Entertainment devices
11.5. North America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by PCB E-Scrap Type
11.6. North America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type
11.6.1. Telecommunications Circuit Cards
11.6.2. Network Communication Boards
11.6.3. Circuit Packs
11.6.4. PC Motherboards
11.7. North America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Material Recovered
11.8. North America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered
11.8.1. Ferrous Components
11.8.2. Metals (Copper, Aluminum, Tin)
11.8.3. Precious Metals (Gold, Silver, Palladium)
11.9. North America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Country
11.10. North America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Country
11.10.1. U.S.
11.10.2. Canada
11.11. North America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis, by Country
11.12. U.S. E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap
11.12.1. household appliances
11.12.2. IT and Telecommunication products
11.12.3. Entertainment devices
11.13. U.S. E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type
11.13.1. Telecommunications Circuit Cards
11.13.2. Network Communication Boards
11.13.3. Circuit Packs
11.13.4. PC Motherboards
11.14. U.S. E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered
11.14.1. Ferrous Components
11.14.2. Metals (Copper, Aluminum, Tin)
11.14.3. Precious Metals (Gold, Silver, Palladium)
11.15. Canada E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap
11.15.1. household appliances
11.15.2. IT and Telecommunication products
11.15.3. Entertainment devices
11.16. Steel Canada E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type
11.16.1. Telecommunications Circuit Cards
11.16.2. Network Communication Boards
11.16.3. Circuit Packs
11.16.4. PC Motherboards
11.17. Canada E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered
11.17.1. Ferrous Components
11.17.2. Metals (Copper, Aluminum, Tin)
11.17.3. Precious Metals (Gold, Silver, Palladium)
11.18. North America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Attractiveness Analysis
11.18.1. By Source of e-scrap
11.18.2. By PCB E-Scrap Type
11.18.3. By Material Recovered
11.19. PEST Analysis
11.20. Key Trends
11.21. Key Developments

12. Europe E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis
12.1. Key Findings
12.2. Europe E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Overview
12.3. Europe E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Source of e-scrap
12.4. Europe E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap
12.4.1. household appliances
12.4.2. IT and Telecommunication products
12.4.3. Entertainment devices
12.5. Europe E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by PCB E-Scrap Type
12.6. Europe E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type
12.6.1. Telecommunications Circuit Cards
12.6.2. Network Communication Boards
12.6.3. Circuit Packs
12.6.4. PC Motherboards
12.7. Europe E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Material Recovered
12.8. Europe E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered
12.8.1. Ferrous Components
12.8.2. Metals (Copper, Aluminum, Tin)
12.8.3. Precious Metals (Gold, Silver, Palladium)
12.9. Europe E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Country
12.10. Europe E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Country
12.10.1. Germany
12.10.2. U.K.
12.10.3. France
12.10.4. Italy
12.10.5. Spain
12.10.6. Rest of Europe
12.11. Europe E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis, by Country
12.12. Germany E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap
12.12.1. household appliances
12.12.2. IT and Telecommunication products
12.12.3. Entertainment devices
12.13. Germany E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type
12.13.1. Telecommunications Circuit Cards
12.13.2. Network Communication Boards
12.13.3. Circuit Packs
12.13.4. PC Motherboards
12.14. Germany E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered
12.14.1. Ferrous Components
12.14.2. Metals (Copper, Aluminum, Tin)
12.14.3. Precious Metals (Gold, Silver, Palladium)
12.15. U.K. E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap
12.15.1. household appliances
12.15.2. IT and Telecommunication products
12.15.3. Entertainment devices
12.16. U.K. E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type
12.16.1. Telecommunications Circuit Cards
12.16.2. Network Communication Boards
12.16.3. Circuit Packs
12.16.4. PC Motherboards
12.17. U.K. E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered
12.17.1. Ferrous Components
12.17.2. Metals (Copper, Aluminum, Tin)
12.17.3. Precious Metals (Gold, Silver, Palladium)
12.18. France E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap
12.18.1. household appliances
12.18.2. IT and Telecommunication products
12.18.3. Entertainment devices
12.19. France E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type
12.19.1. Telecommunications Circuit Cards
12.19.2. Network Communication Boards
12.19.3. Circuit Packs
12.19.4. PC Motherboards
12.20. France E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered
12.20.1. Ferrous Components
12.20.2. Metals (Copper, Aluminum, Tin)
12.20.3. Precious Metals (Gold, Silver, Palladium)
12.21. Italy E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap
12.21.1. household appliances
12.21.2. IT and Telecommunication products
12.21.3. Entertainment devices
12.22. Italy E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type
12.22.1. Telecommunications Circuit Cards
12.22.2. Network Communication Boards
12.22.3. Circuit Packs
12.22.4. PC Motherboards
12.23. Italy E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered
12.23.1. Ferrous Components
12.23.2. Metals (Copper, Aluminum, Tin)
12.23.3. Precious Metals (Gold, Silver, Palladium)
12.24. Spain E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap
12.24.1. household appliances
12.24.2. IT and Telecommunication products
12.24.3. Entertainment devices
12.25. Spain E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type
12.25.1. Telecommunications Circuit Cards
12.25.2. Network Communication Boards
12.25.3. Circuit Packs
12.25.4. PC Motherboards
12.26. Spain E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered
12.26.1. Ferrous Components
12.26.2. Metals (Copper, Aluminum, Tin)
12.26.3. Precious Metals (Gold, Silver, Palladium)
12.27. Rest of Europe E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap
12.27.1. household appliances
12.27.2. IT and Telecommunication products
12.27.3. Entertainment devices
12.28. Rest of Europe E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type
12.28.1. Telecommunications Circuit Cards
12.28.2. Network Communication Boards
12.28.3. Circuit Packs
12.28.4. PC Motherboards
12.29. Rest Of Europe E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered
12.29.1. Ferrous Components
12.29.2. Metals (Copper, Aluminum, Tin)
12.29.3. Precious Metals (Gold, Silver, Palladium)
12.30. Europe E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Attractiveness Analysis
12.30.1. By Source of e-scrap
12.30.2. By PCB E-Scrap Type
12.30.3. By Material Recovered
12.31. PEST Analysis
12.32. Key Trends
12.33. Key Developments

13. Asia Pacific E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis
13.1. Key Findings
13.2. Asia Pacific E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Overview
13.3. Asia Pacific E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Source of e-scrap
13.4. Asia Pacific E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap
13.4.1. household appliances
13.4.2. IT and Telecommunication products
13.4.3. Entertainment devices
13.5. Asia Pacific E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by PCB E-Scrap Type
13.6. Asia Pacific E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type
13.6.1. Telecommunications Circuit Cards
13.6.2. Network Communication Boards
13.6.3. Circuit Packs
13.6.4. PC Motherboards
13.7. Asia Pacific E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Material Recovered
13.8. Asia Pacific E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered
13.8.1. Ferrous Components
13.8.2. Metals (Copper, Aluminum, Tin)
13.8.3. Precious Metals (Gold, Silver, Palladium)
13.9. Asia Pacific E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Country
13.10. Asia Pacific E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Country
13.10.1. China
13.10.2. India
13.10.3. Japan
13.10.4. ASEAN
13.10.5. Rest of Asia Pacific
13.11. Asia Pacific E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis, by Country
13.12. China E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap
13.12.1. household appliances
13.12.2. IT and Telecommunication products
13.12.3. Entertainment devices
13.13. China E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type
13.13.1. Telecommunications Circuit Cards
13.13.2. Network Communication Boards
13.13.3. Circuit Packs
13.13.4. PC Motherboards
13.14. China E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered
13.14.1. Ferrous Components
13.14.2. Metals (Copper, Aluminum, Tin)
13.14.3. Precious Metals (Gold, Silver, Palladium)
13.15. India E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap
13.15.1. household appliances
13.15.2. IT and Telecommunication products
13.15.3. Entertainment devices
13.16. India E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type
13.16.1. Telecommunications Circuit Cards
13.16.2. Network Communication Boards
13.16.3. Circuit Packs
13.16.4. PC Motherboards
13.17. India E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered
13.17.1. Ferrous Components
13.17.2. Metals (Copper, Aluminum, Tin)
13.17.3. Precious Metals (Gold, Silver, Palladium)
13.18. Japan E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap
13.18.1. household appliances
13.18.2. IT and Telecommunication products
13.18.3. Entertainment devices
13.19. Japan E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type
13.19.1. Telecommunications Circuit Cards
13.19.2. Network Communication Boards
13.19.3. Circuit Packs
13.19.4. PC Motherboards
13.20. Japan E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered
13.20.1. Ferrous Components
13.20.2. Metals (Copper, Aluminum, Tin)
13.20.3. Precious Metals (Gold, Silver, Palladium)
13.21. ASEAN E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap
13.21.1. household appliances
13.21.2. IT and Telecommunication products
13.21.3. Entertainment devices
13.22. ASEAN E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type
13.22.1. Telecommunications Circuit Cards
13.22.2. Network Communication Boards
13.22.3. Circuit Packs
13.22.4. PC Motherboards
13.23. ASEAN E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered
13.23.1. Ferrous Components
13.23.2. Metals (Copper, Aluminum, Tin)
13.23.3. Precious Metals (Gold, Silver, Palladium)
13.24. Rest of Asia Pacific E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap
13.24.1. household appliances
13.24.2. IT and Telecommunication products
13.24.3. Entertainment devices
13.25. Rest of Asia Pacific E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type
13.25.1. Telecommunications Circuit Cards
13.25.2. Network Communication Boards
13.25.3. Circuit Packs
13.25.4. PC Motherboards
13.26. Rest of Asia Pacific E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered
13.26.1. Ferrous Components
13.26.2. Metals (Copper, Aluminum, Tin)
13.26.3. Precious Metals (Gold, Silver, Palladium)
13.27. Asia Pacific E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Attractiveness Analysis
13.27.1. By Source of e-scrap
13.27.2. By PCB E-Scrap Type
13.27.3. By Material Recovered
13.28. PEST Analysis
13.29. Key Trends
13.30. Key Developments

14. Middle East & Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis
14.1. Key Findings
14.2. Middle East & Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Overview
14.3. Middle East & Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Source of e-scrap
14.4. Middle East & Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap
14.4.1. household appliances
14.4.2. IT and Telecommunication products
14.4.3. Entertainment devices
14.5. Middle East & Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by PCB E-Scrap Type
14.6. Middle East & Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type
14.6.1. Telecommunications Circuit Cards
14.6.2. Network Communication Boards
14.6.3. Circuit Packs
14.6.4. PC Motherboards
14.7. Middle East & Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Material Recovered
14.8. Middle East & Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered
14.8.1. Ferrous Components
14.8.2. Metals (Copper, Aluminum, Tin)
14.8.3. Precious Metals (Gold, Silver, Palladium)
14.9. Middle East & Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Country
14.10. Middle East & Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Country
14.10.1. GCC
14.10.2. South Africa
14.10.3. Rest of Middle East & Africa
14.11. Middle East & Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis, by Country
14.12. GCC E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap
14.12.1. household appliances
14.12.2. IT and Telecommunication products
14.12.3. Entertainment devices
14.13. GCC E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type
14.13.1. Telecommunications Circuit Cards
14.13.2. Network Communication Boards
14.13.3. Circuit Packs
14.13.4. PC Motherboards
14.14. GCC E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered
14.14.1. Ferrous Components
14.14.2. Metals (Copper, Aluminum, Tin)
14.14.3. Precious Metals (Gold, Silver, Palladium)
14.15. South Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap
14.15.1. household appliances
14.15.2. IT and Telecommunication products
14.15.3. Entertainment devices
14.16. South Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type
14.16.1. Telecommunications Circuit Cards
14.16.2. Network Communication Boards
14.16.3. Circuit Packs
14.16.4. PC Motherboards
14.17. South Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered
14.17.1. Ferrous Components
14.17.2. Metals (Copper, Aluminum, Tin)
14.17.3. Precious Metals (Gold, Silver, Palladium)
14.18. Rest of Middle East & Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap
14.18.1. household appliances
14.18.2. IT and Telecommunication products
14.18.3. Entertainment devices
14.19. Rest of Middle East & Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type
14.19.1. Telecommunications Circuit Cards
14.19.2. Network Communication Boards
14.19.3. Circuit Packs
14.19.4. PC Motherboards
14.20. Rest of Middle East & Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered
14.20.1. Ferrous Components
14.20.2. Metals (Copper, Aluminum, Tin)
14.20.3. Precious Metals (Gold, Silver, Palladium)
14.21. Middle East & Africa E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Attractiveness Analysis
14.21.1. By Source of e-scrap
14.21.2. By PCB E-Scrap Type
14.21.3. By Material Recovered
14.22. PEST Analysis
14.23. Key Trends
14.24. Key Developments

15. South America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis
15.1. Key Findings
15.2. South America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Overview
15.3. South America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Source of e-scrap
15.4. South America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap
15.4.1. household appliances
15.4.2. IT and Telecommunication products
15.4.3. Entertainment devices
15.5. South America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by PCB E-Scrap Type
15.6. South America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type
15.6.1. Telecommunications Circuit Cards
15.6.2. Network Communication Boards
15.6.3. Circuit Packs
15.6.4. PC Motherboards
15.7. South America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Material Recovered
15.8. South America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered
15.8.1. Ferrous Components
15.8.2. Metals (Copper, Aluminum, Tin)
15.8.3. Precious Metals (Gold, Silver, Palladium)
15.9. South America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Value Share Analysis, by Country
15.10. South America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Country
15.10.1. Brazil
15.10.2. Mexico
15.10.3. Rest of South America
15.11. South America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Analysis, by Country
15.12. Brazil E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap
15.12.1. household appliances
15.12.2. IT and Telecommunication products
15.12.3. Entertainment devices
15.13. Brazil E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type
15.13.1. Telecommunications Circuit Cards
15.13.2. Network Communication Boards
15.13.3. Circuit Packs
15.13.4. PC Motherboards
15.14. Brazil E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered
15.14.1. Ferrous Components
15.14.2. Metals (Copper, Aluminum, Tin)
15.14.3. Precious Metals (Gold, Silver, Palladium)
15.15. Mexico E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap
15.15.1. household appliances
15.15.2. IT and Telecommunication products
15.15.3. Entertainment devices
15.16. Mexico E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type
15.16.1. Telecommunications Circuit Cards
15.16.2. Network Communication Boards
15.16.3. Circuit Packs
15.16.4. PC Motherboards
15.17. Mexico E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered
15.17.1. Ferrous Components
15.17.2. Metals (Copper, Aluminum, Tin)
15.17.3. Precious Metals (Gold, Silver, Palladium)
15.18. Rest of South America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Source of e-scrap
15.18.1. household appliances
15.18.2. IT and Telecommunication products
15.18.3. Entertainment devices
15.19. Rest of South America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by PCB E-Scrap Type
15.19.1. Telecommunications Circuit Cards
15.19.2. Network Communication Boards
15.19.3. Circuit Packs
15.19.4. PC Motherboards
15.20. Rest of South America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Forecast, by Material Recovered
15.20.1. Ferrous Components
15.20.2. Metals (Copper, Aluminum, Tin)
15.20.3. Precious Metals (Gold, Silver, Palladium)
15.21. South America E-Scrap and Printed Circuit Board (PCB) E-Scrap Market Attractiveness Analysis
15.21.1. By Source of e-scrap
15.21.2. By PCB E-Scrap Type
15.21.3. By Material Recovered
15.22. PEST Analysis
15.23. Key Trends
15.24. Key Developments

16. Company Profiles
16.1. Market Share Analysis, by Company
16.2. Competition Matrix
16.2.1. Competitive Benchmarking of key players by price, presence, market share, Applications and R&D investment
16.2.2. New Product Launches and Product Enhancements
16.2.3. Market Consolidation
16.2.3.1. M&A by Regions, Investment and Applications
16.2.3.2. M&A Key Players, Forward Integration and Backward
Integration
16.3. Company Profiles: Key Players
16.3.1. Umicore N.V.
16.3.1.1. Company Overview
16.3.1.2. Financial Overview
16.3.1.3. Product Portfolio
16.3.1.4. Business Strategy
16.3.1.5. Recent Developments
16.3.1.6. Development Footprint
16.3.2. LS-Nikko Copper Inc.
16.3.3. Boliden Group
16.3.4. Dowa Holdings Co. Ltd.
16.3.5. Ultromext Ltd
16.3.6. GCL Recycling and Refining
16.3.7. URT Recycling Techno9logy
16.3.8. Mairec
16.3.9. Feeco International
16.3.10. Qizheng
16.3.11. AmeriScraps
16.3.12. LS-Nikko Copper Inc.
16.3.13. Recycling Technology
16.3.14. Sims Recycling Solutions
16.3.15. EnvironCom
16.3.16. Waste Management
16.3.17. Dongjiang
16.3.18. Cimelia
16.3.19. Stena Metall Group
16.3.20. URT Umwelt- und Recyclingtechnik GmbH,

17. Primary Key Insights
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