Advanced Semiconductor Packaging Market is expected to grow at a CAGR of 10.5% during the forecast period and market is expected to reach US$ 91 Bn. by 2029. The report includes the analysis of impact of COVID-19 lock-down on the revenue of market leaders, followers, and disrupters. Since lock down was implemented differently in different regions and countries, impact of same is also different by regions and segments. The report has covered the current short term and long term impact on the market, same will help decision makers to prepare the outline for short term and long term strategies for companies by region.To know about the Research Methodology :- Request Free Sample Report Advanced semiconductor packaging prevents physical damage and corrosion of the chips that are to be connected to the circuit boards. In the recent years, semiconductor packaging has evolved giving increase to advanced semiconductor packaging technologies. Advanced semiconductor packaging market report studied, analyzed and presented the major trends that will impact the industry and competitive landscape of the advanced semiconductor packaging market. The latest key trend gaining momentum in the market is changing in wafer size. The rapid technological advancements in wafer processing have always been a vital challenge faced by a vendor and are hindering the growth of the global market for advanced semiconductor packaging. The industry is focusing on producing larger diameter wafers which in turn are likely to cut down the manufacturing costs. The report on global advanced semiconductor packaging market covers segments such as packaging type, application and region. Based on the packaging type, the flip-chip packaging technology segment accounted for the major xx% shares of the semiconductor advanced packaging market. Factors such as the expanding shipment of mobile devices and the high adoption of 2.5D/3D ICs in almost all electronic devices will contribute to the growth of this industry segment in the upcoming years. Region-wise, The APAC is projected to witness the fastest growth during the forecast period. Likewise, such growth can be attributed to the presence of prominent semiconductor manufacturing companies present in the region which are driving the demand for advanced semiconductor packaging. Moreover, companies are also seen investing heavily in the R&D of new semiconductor packages with advanced features. Indian Government has deployed enterprises such as Preferential Market Access (PMS), Electronics Manufacturing Clusters (EMC), and Modified Special Incentive Package Scheme (M-SIPS) in order to achieve a degree of sufficiency in electronics, which will push the advanced semiconductors packaging market beyond restrictions, as semiconductor devices are one of the main components of electronic gadgets. In 2013, ASE group, a supplier of independent semiconductor manufacturing services in testing and assembly, hit a roadblock. Various claimed that ASE disposed wastewater with high acidity levels in a water body near the NEPZ, where it runs 12 facilities, and therefore received 48 environmental penalties. However, in 2022, the Kaohsiung High Administrative Court revoked penalties forced by the Kaohsiung City Government’s Environmental Protection Bureau. Since then, ASE invested millions to recycle wastewater from its Kaohsiung operations and made the water-recycling plant. The company further installed ultra-efficient lighting & heating, ventilation and air-conditioning systems and received the 2022 (AREA) Asia Responsible Entrepreneurship Award in the Social Empowerment category. The reports cover detail key developments in the advanced semiconductor packaging market as organic and inorganic growth strategies. Many companies are focusing on organic growth strategies such as product launches, product approvals and others like patents and events. Inorganic growth strategies activities witnessed in the advanced semiconductor packaging market were acquisitions and partnership & collaborations. The objective of the report is to present a comprehensive assessment of the market and contains thoughtful insights, facts, historical data, industry-validated market data and projections with a suitable set of assumptions and methodology. The report also helps in understanding Global Advanced Semiconductor Packaging Market dynamics, structure by identifying and analyzing the market segments and project the global market size. Further, the report also focuses on the competitive analysis of key players by product, price, financial position, product portfolio, growth strategies, and regional presence. The report also provides PEST analysis, PORTER’s analysis, and SWOT analysis to address the question of shareholders to prioritizing the efforts and investment shortly to the emerging segment in the Global Advanced Semiconductor Packaging Market.
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Advanced Semiconductor Packaging Market Report Coverage Details Base Year: 2022 Forecast Period: 2023-2029 Historical Data: 2017 to 2022 Market Size in 2022: US$ 45.24 Bn. Forecast Period 2023 to 2029 CAGR: 10.5% Market Size in 2029: US$ 91 Bn. Segments Covered: by Packaging Type • FO WLP • 2.5D/3D • FI WLP • Flip Chip by Application • Automotive • Aerospace and Defense • Medical Devices • Consumer Electronics • Other by Region • North America (United States, Canada and Mexico) • Europe (UK, France, Germany, Italy, Spain, Sweden, Austria and Rest of Europe) • Asia Pacific (China, South Korea, Japan, India, Australia, Indonesia, Malaysia, Vietnam, Taiwan, Bangladesh, Pakistan and Rest of APAC) • Middle East and Africa (South Africa, GCC, Egypt, Nigeria and Rest of ME&A) • South America (Brazil, Argentina Rest of South America) Advanced Semiconductor Packaging Market Key players are:
• AMD • Intel Corp • Amkor Technology • STMicroelectronics • Hitachi Chemical • Infineon • Avery Dennison • Sumitomo Chemical • ASE Group • Kyocera • China Wafer Level CSP • ChipMOS TECHNOLOGIES • FlipChip International • HANA Micron • Interconnect Systems (Molex) • Jiangsu Changjiang Electronics Technology (JCET) • King Yuan Electronics • Tongfu Microelectronics • Nepes • Powertech Technology (PTI) • SIGNETICS • Tianshui Huatian • Ultratech • UTAC.Frequently Asked Questions:
1. What is the growth rate of Global Advanced Semiconductor Packaging Market? Ans: The Global Advanced Semiconductor Packaging Market is growing at a CAGR of 10.5% during forecasting period 2023-2029. 2. What is scope of the Global Advanced Semiconductor Packaging market report? Ans: Global Advanced Semiconductor Packaging Market report helps with the PESTEL, PORTER, COVID-19 Impact analysis, Recommendations for Investors & Leaders, and market estimation of the forecast period. 3. Who are the key players in Global Advanced Semiconductor Packaging market? Ans: The important key players in the Global Advanced Semiconductor Packaging Market are – , AMD, Intel Corp, Amkor Technology, STMicroelectronics, Hitachi Chemical, Infineon, Avery Dennison, Sumitomo Chemical, ASE Group, Kyocera, China Wafer Level CSP, ChipMOS TECHNOLOGIES, FlipChip International, HANA Micron, Interconnect Systems (Molex), Jiangsu Changjiang Electronics Technology (JCET), King Yuan Electronics, Tongfu Microelectronics, Nepes, Powertech Technology (PTI), SIGNETICS, Tianshui Huatian, Ultratech, and UTAC.. 4. What is the study period of this market? Ans: The Global Advanced Semiconductor Packaging Market is studied from 2022 to 2029.
1. Preface 1.1. Report Scope and Market Segmentation 1.2. Research Highlights 1.3. Research Objectives 2. Assumptions and Research Methodology 2.1. Report Assumptions 2.2. Abbreviations 2.3. Research Methodology 2.3.1. Secondary Research 2.3.1.1. Secondary data 2.3.1.2. Secondary Sources 2.3.2. Primary Research 2.3.2.1. Data from Primary Sources 2.3.2.2. Breakdown of Primary Sources 3. Executive Summary: Global Advanced Semiconductor Packaging Market Size, by Market Value (US$ Bn) 4. Market Overview 4.1. Introduction 4.2. Market Indicator 4.2.1. Drivers 4.2.2. Restraints 4.2.3. Opportunities 4.2.4. Challenges 4.3. Porter’s Analysis 4.4. Value Chain Analysis 4.5. Market Risk Analysis 4.6. SWOT Analysis 4.7. Industry Trends and Emerging Technologies 4.8. Patent Registration 5. Supply Side and Demand Side Indicators 6. Global Advanced Semiconductor Packaging Market Analysis and Forecast 6.1. Global Advanced Semiconductor Packaging Market Size & Y-o-Y Growth Analysis 6.1.1. North America 6.1.2. Europe 6.1.3. Asia Pacific 6.1.4. Middle East & Africa 6.1.5. South America 7. Global Advanced Semiconductor Packaging Market Analysis and Forecast, By Packaging Type 7.1. Introduction and Definition 7.2. Key Findings 7.3. Global Advanced Semiconductor Packaging Market Value Share Analysis, By Packaging Type 7.4. Global Advanced Semiconductor Packaging Market Size (US$ Bn) Forecast, By Packaging Type 7.5. Global Advanced Semiconductor Packaging Market Analysis, By Packaging Type 7.6. Global Advanced Semiconductor Packaging Market Attractiveness Analysis, By Packaging Type 8. Global Advanced Semiconductor Packaging Market Analysis and Forecast, By Application 8.1. Introduction and Definition 8.2. Key Findings 8.3. Global Advanced Semiconductor Packaging Market Value Share Analysis, By Application 8.4. Global Advanced Semiconductor Packaging Market Size (US$ Bn) Forecast, By Application 8.5. Global Advanced Semiconductor Packaging Market Analysis, By Application 8.6. Global Advanced Semiconductor Packaging Market Attractiveness Analysis, By Application 9. Global Advanced Semiconductor Packaging Market Analysis, by Region 9.1. Global Advanced Semiconductor Packaging Market Value Share Analysis, by Region 9.2. Global Advanced Semiconductor Packaging Market Size (US$ Bn) Forecast, by Region 9.3. Global Advanced Semiconductor Packaging Market Attractiveness Analysis, by Region 10. North America Advanced Semiconductor Packaging Market Analysis 10.1. Key Findings 10.2. North America Advanced Semiconductor Packaging Market Overview 10.3. North America Advanced Semiconductor Packaging Market Value Share Analysis, By Packaging Type 10.4. North America Advanced Semiconductor Packaging Market Forecast, By Packaging Type 10.4.1. FO WLP 10.4.2. 2.5D/3D 10.4.3. FI WLP 10.4.4. Flip Chip 10.5. North America Advanced Semiconductor Packaging Market Value Share Analysis, By Application 10.6. North America Advanced Semiconductor Packaging Market Forecast, By Application 10.6.1. Automotive 10.6.2. Aerospace and Defense 10.6.3. Medical Devices 10.6.4. Consumer Electronics 10.6.5. Other 10.7. North America Advanced Semiconductor Packaging Market Value Share Analysis, by Country 10.8. North America Advanced Semiconductor Packaging Market Forecast, by Country 10.8.1. U.S. 10.8.2. Canada 10.9. North America Advanced Semiconductor Packaging Market Analysis, by Country 10.10. U.S. Advanced Semiconductor Packaging Market Forecast, By Packaging Type 10.10.1. FO WLP 10.10.2. 2.5D/3D 10.10.3. FI WLP 10.10.4. Flip Chip 10.11. U.S. Advanced Semiconductor Packaging Market Forecast, By Application 10.11.1. Automotive 10.11.2. Aerospace and Defense 10.11.3. Medical Devices 10.11.4. Consumer Electronics 10.11.5. Other 10.12. Canada Advanced Semiconductor Packaging Market Forecast, By Packaging Type 10.12.1. FO WLP 10.12.2. 2.5D/3D 10.12.3. FI WLP 10.12.4. Flip Chip 10.13. Canada Advanced Semiconductor Packaging Market Forecast, By Application 10.13.1. Automotive 10.13.2. Aerospace and Defense 10.13.3. Medical Devices 10.13.4. Consumer Electronics 10.13.5. Other 10.14. North America Advanced Semiconductor Packaging Market Attractiveness Analysis 10.14.1. By Packaging Type 10.14.2. By Application 10.15. PEST Analysis 10.16. Key Trends 10.17. Key Development 11. Europe Advanced Semiconductor Packaging Market Analysis 11.1. Key Findings 11.2. Europe Advanced Semiconductor Packaging Market Overview 11.3. Europe Advanced Semiconductor Packaging Market Value Share Analysis, By Packaging Type 11.4. Europe Advanced Semiconductor Packaging Market Forecast, By Packaging Type 11.4.1. FO WLP 11.4.2. 2.5D/3D 11.4.3. FI WLP 11.4.4. Flip Chip 11.5. Europe Advanced Semiconductor Packaging Market Value Share Analysis, By Application 11.6. Europe Advanced Semiconductor Packaging Market Forecast, By Application 11.6.1. Automotive 11.6.2. Aerospace and Defense 11.6.3. Medical Devices 11.6.4. Consumer Electronics 11.6.5. Other 11.6.6. Europe Advanced Semiconductor Packaging Market Value Share Analysis, by Country 11.7. Europe Advanced Semiconductor Packaging Market Forecast, by Country 11.7.1. Germany 11.7.2. U.K. 11.7.3. France 11.7.4. Italy 11.7.5. Spain 11.7.6. Rest of Europe 11.8. Europe Advanced Semiconductor Packaging Market Analysis, by Country 11.9. Germany Advanced Semiconductor Packaging Market Forecast, By Packaging Type 11.9.1. FO WLP 11.9.2. 2.5D/3D 11.9.3. FI WLP 11.9.4. Flip Chip 11.10. Germany Advanced Semiconductor Packaging Market Forecast, By Application 11.10.1. Automotive 11.10.2. Aerospace and Defense 11.10.3. Medical Devices 11.10.4. Consumer Electronics 11.10.5. Other 11.11. U.K. Advanced Semiconductor Packaging Market Forecast, By Packaging Type 11.11.1. FO WLP 11.11.2. 2.5D/3D 11.11.3. FI WLP 11.11.4. Flip Chip 11.12. U.K. Advanced Semiconductor Packaging Market Forecast, By Application 11.12.1. Automotive 11.12.2. Aerospace and Defense 11.12.3. Medical Devices 11.12.4. Consumer Electronics 11.12.5. Other 11.13. France Advanced Semiconductor Packaging Market Forecast, By Packaging Type 11.13.1. FO WLP 11.13.2. 2.5D/3D 11.13.3. FI WLP 11.13.4. Flip Chip 11.14. France Advanced Semiconductor Packaging Market Forecast, By Application 11.14.1. Automotive 11.14.2. Aerospace and Defense 11.14.3. Medical Devices 11.14.4. Consumer Electronics 11.14.5. Other 11.15. Italy Advanced Semiconductor Packaging Market Forecast, By Packaging Type 11.15.1. FO WLP 11.15.2. 2.5D/3D 11.15.3. FI WLP 11.15.4. Flip Chip 11.16. Italy Advanced Semiconductor Packaging Market Forecast, By Application 11.16.1. Automotive 11.16.2. Aerospace and Defense 11.16.3. Medical Devices 11.16.4. Consumer Electronics 11.16.5. Other 11.17. Spain Advanced Semiconductor Packaging Market Forecast, By Packaging Type 11.17.1. FO WLP 11.17.2. 2.5D/3D 11.17.3. FI WLP 11.17.4. Flip Chip 11.18. Spain Advanced Semiconductor Packaging Market Forecast, By Application 11.18.1. Automotive 11.18.2. Aerospace and Defense 11.18.3. Medical Devices 11.18.4. Consumer Electronics 11.18.5. Other 11.19. Rest of Europe Advanced Semiconductor Packaging Market Forecast, By Packaging Type 11.19.1. FO WLP 11.19.2. 2.5D/3D 11.19.3. FI WLP 11.19.4. Flip Chip 11.20. Rest of Europe Advanced Semiconductor Packaging Market Forecast, By Application 11.20.1. Automotive 11.20.2. Aerospace and Defense 11.20.3. Medical Devices 11.20.4. Consumer Electronics 11.20.5. Other 11.21. Europe Advanced Semiconductor Packaging Market Attractiveness Analysis 11.21.1. By Packaging Type 11.21.2. By Application 11.22. PEST Analysis 11.23. Key Trend 11.24. Key Development 12. Asia Pacific Advanced Semiconductor Packaging Market Analysis 12.1. Key Findings 12.2. Asia Pacific Advanced Semiconductor Packaging Market Overview 12.3. Asia Pacific Advanced Semiconductor Packaging Market Value Share Analysis, By Packaging Type 12.4. Asia Pacific Advanced Semiconductor Packaging Market Forecast, By Packaging Type 12.4.1. FO WLP 12.4.2. 2.5D/3D 12.4.3. FI WLP 12.4.4. Flip Chip 12.5. Asia Pacific Advanced Semiconductor Packaging Market Value Share Analysis, By Application 12.6. Asia Pacific Advanced Semiconductor Packaging Market Forecast, By Application 12.6.1. Automotive 12.6.2. Aerospace and Defense 12.6.3. Medical Devices 12.6.4. Consumer Electronics 12.6.5. Other 12.7. Asia Pacific Advanced Semiconductor Packaging Market Value Share Analysis, by Country 12.8. Asia Pacific Advanced Semiconductor Packaging Market Forecast, by Country 12.8.1. China 12.8.2. India 12.8.3. Japan 12.8.4. ASEAN 12.8.5. Rest of Asia Pacific 12.9. Asia Pacific Advanced Semiconductor Packaging Market Analysis, by Country 12.10. China Advanced Semiconductor Packaging Market Forecast, By Packaging Type 12.10.1. FO WLP 12.10.2. 2.5D/3D 12.10.3. FI WLP 12.10.4. Flip Chip 12.11. China Advanced Semiconductor Packaging Market Forecast, By Application 12.11.1. Automotive 12.11.2. Aerospace and Defense 12.11.3. Medical Devices 12.11.4. Consumer Electronics 12.11.5. Other 12.12. India Advanced Semiconductor Packaging Market Forecast, By Packaging Type 12.12.1. FO WLP 12.12.2. 2.5D/3D 12.12.3. FI WLP 12.12.4. Flip Chip 12.13. India Advanced Semiconductor Packaging Market Forecast, By Application 12.13.1. Automotive 12.13.2. Aerospace and Defense 12.13.3. Medical Devices 12.13.4. Consumer Electronics 12.13.5. Other 12.14. Japan Advanced Semiconductor Packaging Market Forecast, By Packaging Type 12.14.1. FO WLP 12.14.2. 2.5D/3D 12.14.3. FI WLP 12.14.4. Flip Chip 12.15. Japan Advanced Semiconductor Packaging Market Forecast, By Application 12.15.1. Automotive 12.15.2. Aerospace and Defense 12.15.3. Medical Devices 12.15.4. Consumer Electronics 12.15.5. Other 12.16. ASEAN Advanced Semiconductor Packaging Market Forecast, By Packaging Type 12.16.1. FO WLP 12.16.2. 2.5D/3D 12.16.3. FI WLP 12.16.4. Flip Chip 12.17. ASEAN Advanced Semiconductor Packaging Market Forecast, By Application 12.17.1. Automotive 12.17.2. Aerospace and Defense 12.17.3. Medical Devices 12.17.4. Consumer Electronics 12.17.5. Other 12.18. Rest of Asia Pacific Advanced Semiconductor Packaging Market Forecast, By Packaging Type 12.18.1. FO WLP 12.18.2. 2.5D/3D 12.18.3. FI WLP 12.18.4. Flip Chip 12.19. Rest of Asia Pacific Advanced Semiconductor Packaging Market Forecast, By Application 12.19.1. Automotive 12.19.2. Aerospace and Defense 12.19.3. Medical Devices 12.19.4. Consumer Electronics 12.19.5. Other 12.20. Asia Pacific Advanced Semiconductor Packaging Market Attractiveness Analysis 12.20.1. By Packaging Type 12.20.2. By Application 12.21. PEST Analysis 12.22. Key Trend 12.23. Key Development 13. Middle East & Africa Advanced Semiconductor Packaging Market Analysis 13.1. Key Findings 13.2. Middle East & Africa Advanced Semiconductor Packaging Market Overview 13.3. Middle East & Africa Advanced Semiconductor Packaging Market Value Share Analysis, By Packaging Type 13.4. Middle East & Africa Advanced Semiconductor Packaging Market Forecast, By Packaging Type 13.4.1. FO WLP 13.4.2. 2.5D/3D 13.4.3. FI WLP 13.4.4. Flip Chip 13.5. Middle East & Africa Advanced Semiconductor Packaging Market Value Share Analysis, By Application 13.6. Middle East & Africa Advanced Semiconductor Packaging Market Forecast, By Application 13.6.1. Automotive 13.6.2. Aerospace and Defense 13.6.3. Medical Devices 13.6.4. Consumer Electronics 13.6.5. Other 13.7. Middle East & Africa Advanced Semiconductor Packaging Market Value Share Analysis, by Country 13.8. Middle East & Africa Advanced Semiconductor Packaging Market Forecast, by Country 13.8.1. GCC 13.8.2. South Africa 13.8.3. Rest of Middle East & Africa 13.9. Middle East & Africa Advanced Semiconductor Packaging Market Analysis, by Country 13.10. GCC Advanced Semiconductor Packaging Market Forecast, By Packaging Type 13.10.1. FO WLP 13.10.2. 2.5D/3D 13.10.3. FI WLP 13.10.4. Flip Chip 13.11. GCC Advanced Semiconductor Packaging Market Forecast, By Application 13.11.1. Automotive 13.11.2. Aerospace and Defense 13.11.3. Medical Devices 13.11.4. Consumer Electronics 13.11.5. Other 13.12. South Africa Advanced Semiconductor Packaging Market Forecast, By Packaging Type 13.12.1. FO WLP 13.12.2. 2.5D/3D 13.12.3. FI WLP 13.12.4. Flip Chip 13.13. South Africa Advanced Semiconductor Packaging Market Forecast, By Application 13.13.1. Automotive 13.13.2. Aerospace and Defense 13.13.3. Medical Devices 13.13.4. Consumer Electronics 13.13.5. Other 13.14. Rest of Middle East & Africa Advanced Semiconductor Packaging Market Forecast, By Packaging Type 13.14.1. FO WLP 13.14.2. 2.5D/3D 13.14.3. FI WLP 13.14.4. Flip Chip 13.15. Rest of Middle East & Africa Advanced Semiconductor Packaging Market Forecast, By Application 13.15.1. Automotive 13.15.2. Aerospace and Defense 13.15.3. Medical Devices 13.15.4. Consumer Electronics 13.15.5. Other 13.16. Middle East & Africa Advanced Semiconductor Packaging Market Attractiveness Analysis 13.16.1. By Packaging Type 13.16.2. By Application 13.17. PEST Analysis 13.18. Key Trend 13.19. Key Development 14. South America Advanced Semiconductor Packaging Market Analysis 14.1. Key Findings 14.2. South America Advanced Semiconductor Packaging Market Overview 14.3. South America Advanced Semiconductor Packaging Market Value Share Analysis, By Packaging Type 14.4. South America Advanced Semiconductor Packaging Market Forecast, By Packaging Type 14.4.1. FO WLP 14.4.2. 2.5D/3D 14.4.3. FI WLP 14.4.4. Flip Chip 14.5. South America Advanced Semiconductor Packaging Market Value Share Analysis, By Application 14.6. South America Advanced Semiconductor Packaging Market Forecast, By Application 14.6.1. Automotive 14.6.2. Aerospace and Defense 14.6.3. Medical Devices 14.6.4. Consumer Electronics 14.6.5. Other 14.7. South America Advanced Semiconductor Packaging Market Value Share Analysis, by Country 14.8. South America Advanced Semiconductor Packaging Market Forecast, by Country 14.8.1. Brazil 14.8.2. Mexico 14.8.3. Rest of South America 14.9. Brazil Advanced Semiconductor Packaging Market Forecast, By Packaging Type 14.9.1. FO WLP 14.9.2. 2.5D/3D 14.9.3. FI WLP 14.9.4. Flip Chip 14.10. Brazil Advanced Semiconductor Packaging Market Forecast, By Application 14.10.1. Automotive 14.10.2. Aerospace and Defense 14.10.3. Medical Devices 14.10.4. Consumer Electronics 14.10.5. Other 14.11. Mexico Advanced Semiconductor Packaging Market Forecast, By Packaging Type 14.11.1. FO WLP 14.11.2. 2.5D/3D 14.11.3. FI WLP 14.11.4. Flip Chip 14.12. Mexico Advanced Semiconductor Packaging Market Forecast, By Application 14.12.1. Automotive 14.12.2. Aerospace and Defense 14.12.3. Medical Devices 14.12.4. Consumer Electronics 14.12.5. Other 14.13. Rest of South America Advanced Semiconductor Packaging Market Forecast, By Packaging Type 14.13.1. FO WLP 14.13.2. 2.5D/3D 14.13.3. FI WLP 14.13.4. Flip Chip 14.14. Rest of South America Advanced Semiconductor Packaging Market Forecast, By Application 14.14.1. Automotive 14.14.2. Aerospace and Defense 14.14.3. Medical Devices 14.14.4. Consumer Electronics 14.14.5. Other 14.15. South America Advanced Semiconductor Packaging Market Attractiveness Analysis 14.15.1. By Packaging Type 14.15.2. By Application 14.16. PEST Analysis 14.17. Key Trend 14.18. Key Development 15. Company Profiles 15.1. Market Share Analysis, by Company 15.2. Competition Matrix 15.2.1. Competitive Benchmarking of key players by price, presence, market share, Applications and R&D investment 15.2.2. New Product Launches and Product Enhancements 15.2.3. Market Consolidation 15.2.3.1. M&A by Regions, Investment and Applications 15.2.3.2. M&A Key Players, Forward Integration and Backward Integration 15.3. Company Profiles: Key Players 15.3.1. AMD 15.3.1.1. Company Overview 15.3.1.2. Financial Overview 15.3.1.3. Product Portfolio 15.3.1.4. Business Strategy 15.3.1.5. Recent Developments 15.3.1.6. Company Footprint 15.3.2. Intel Corp 15.3.3. Amkor Technology 15.3.4. STMicroelectronics 15.3.5. Hitachi Chemical 15.3.6. Infineon 15.3.7. Avery Dennison 15.3.8. Sumitomo Chemical 15.3.9. ASE Group 15.3.10. Kyocera 15.3.11. China Wafer Level CSP 15.3.12. ChipMOS TECHNOLOGIES 15.3.13. FlipChip International 15.3.14. HANA Micron 15.3.15. Interconnect Systems (Molex) 15.3.16. Jiangsu Changjiang Electronics Technology (JCET) 15.3.17. King Yuan Electronics 15.3.18. Tongfu Microelectronics 15.3.19. Nepes 15.3.20. Powertech Technology (PTI) 15.3.21. SIGNETICS 15.3.22. Tianshui Huatian 15.3.23. Ultratech 15.3.24. UTAC. 16. Primary Key Insights