Global Wafer Back Grinding Tape Market – Industry Analysis and Forecast (2019-2027) – By Type, Wafer Size, and Region.


Global wafer back grinding tape market size was US$ XX Bn in 2019 and is expected to reach US$ XX Bn by 2027, at a CAGR of 5% during the forecast period.

 

Global wafer back grinding tape market

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The report study has analyzed revenue impact of COVID -19 pandemic on the sales revenue of market leaders, market followers, and market disrupters in the report, and the same is reflected in our analysis.

Global wafer back grinding tape market Definition

Wafer back grinding is one of the steps used in the semiconductor device manufacturing process to reduce thickness of the wafer and to allow high-density packaging and stacking of integrated circuits (IC). It is also called as wafer thinning process. The tape which is designed to protect surface of semiconductor wafers throughout the wafer back grinding process is known as wafer back grinding tape.

Global wafer back grinding tape market Dynamics

Growing market for semiconductor manufacturing industry across the globe and rising need to reduce thickness of the wafers for miniature electronics applications is major driving factor behind the growth of the market. A rising need for wafer fabrication process to build components for various electronics products such as optical computer components, television amplifiers, Smartphone’s and many others electronic components, increasing trend of miniaturization of electronic devices, growing investments in wafer fabrication materials and equipments, ever changing trend of semiconductor packaging technology and ongoing advancements in handheld and portable devices are expected to improve growth of the market during the forecast period.
However, high costs associated with the UV curable back grinding tapes is the major restraining factor that could hinder the growth of the market.

Global Wafer Back Grinding Tape Market: Market Overview

The progressing development and growth in semiconductor package miniaturization is creating more focus and interest in semiconductor industry. The growing significance of thinner packages is making more demand of an integrated circuit (IC) with thinner vertical structure. Also, rising need to reduce the size of the various electronics components such as semiconductor chips to use in applications such as in USB memory sticks, Smartcards, handheld music players, Smartphones and many other ultra-compact and advanced electronic products are likely to expand growth of wafer back grinding tape market during the forecast period.

By type, the global wafer back grinding tape market is segmented into UV curable and non-UV. The UV curable segment is dominated the market in 2019 and is projected to witness fast growth at a CAGR of XX% during the forecast period. A rising use of UV curable wafer back grinding tape in semiconductor device fabrication process to prevent wafer surface damages during back grinding process and to prevent contamination in wafer surface which can cause by grinding fluid and debris is accredited to the growth of the market. In addition, rising introduction of wafer back grinding tape by various market players across the globe is further expected to impel growth of the market during the forecast period. For example,

• In Apr 2017, LINTEC develops and provides a tape laminator to protect the wafer surface of the circuit during the thinning and back grinding process of the semiconductor wafer after circuit formation.

Global Wafer Back Grinding Tape Market: Regional Analysis

Region-wise, Asia Pacific held the largest market share in 2019 and is expected to maintain its dominance at a CAGR of XX% during the forecast period. The countries such as China, Japan, India and South Korea are the major key contributors behind the growth of the market. The growth is attributed to the growing market for consumer electronics and semiconductor fabrication industry across the region.

Increasing industrialization, rising adoption of consumer electronics and wearable electronics products, rising industrialization, growing manufacturing output from the region, rising government initiatives and investments in semiconductor manufacturing industry and expanding era of smart connected devices and Internet of Things (IoT) technology are driving the growth of the market in APAC region.

The objective of the report is to present a comprehensive analysis of the Global Wafer Back Grinding Tape Market including all the stakeholders of the industry. The past and current status of the industry with forecasted market size and trends are presented in the report with the analysis of complicated data in simple language. The report covers all the aspects of the industry with a dedicated study of key players that includes market leaders, followers and new entrants. PORTER, SVOR, PESTEL analysis with the potential impact of micro-economic factors of the market have been presented in the report. External as well as internal factors that are supposed to affect the business positively or negatively have been analyzed, which will give a clear futuristic view of the industry to the decision-makers. The report also helps in understanding Global Wafer Back Grinding Tape Market dynamics, structure by analyzing the market segments and projects the Global Wafer Back Grinding Tape Market. Clear representation of competitive analysis of key players by Application, price, financial position, Product portfolio, growth strategies, and regional presence in the Global Wafer Back Grinding Tape Market make the report investor’s guide.

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Global Wafer Back Grinding Tape Market, By Type

• UV Curable
• Non-UV

Global Wafer Back Grinding Tape Market, By Wafer Size

• 6-Inch
• 8-Inch
• 12-Inch
• Others

Global Wafer Back Grinding Tape Market, By Region

• North America
 US
 Canada
• Europe
 UK
 France
 Germany
 Italy
 Spain
 Norway
 Russia
• Asia Pacific
 China
 India
 Japan
 South Korea
 Australia
 Malaysia
 Indonesia
• South America
 Brazil
 Mexico
 Argentina
• Middle East and Africa

Global Wafer Back Grinding Tape Market, Key Players

• AI Technology, Inc.
• AMC Co.,Ltd
• Denka Company Limited
• Force-One Applied Materials
• Furukawa Electric Co., Ltd.
• Lintec Advanced Technologies (Europe) Gmbh
• Loadpoint
• Mitsui Chemicals America, Inc.
• Nitto Denko Corporation
• Pantech Tape Co., Ltd.
• Hibex Singapore Pte Ltd
• Syagrus Systems, LLC
• Okamoto Machine Tool Works,Ltd
• Minitron Elektron GMBH
• NEPTCO, Inc
• Sumitomo Bakelite Co., Ltd
• XX
• XX 




Global Wafer Back Grinding Tape Market

1. Preface
1.1. Report Scope and Market Segmentation
1.2. Research Highlights
1.3. Research Objectives

2. Assumptions and Research Methodology
2.1. Report Assumptions
2.2. Abbreviations
2.3. Research Methodology
2.3.1. Secondary Research
2.3.1.1. Secondary data
2.3.1.2. Secondary Sources
2.3.2. Primary Research
2.3.2.1. Data from Primary Sources
2.3.2.2. Breakdown of Primary Sources

3. Executive Summary: Global Wafer Back Grinding Tape Market Size, by Market Value (US$ Bn)

4. Market Overview
4.1. Introduction
4.2. Market Indicator
4.2.1. Drivers
4.2.2. Restraints
4.2.3. Opportunities
4.2.4. Challenges
4.3. Porter’s Analysis
4.4. Value Chain Analysis
4.5. Market Risk Analysis
4.6. SWOT Analysis
4.7. Industry Trends and Emerging Technologies

5. Supply Side and Demand Side Indicators

6. Global Wafer Back Grinding Tape Market Analysis and Forecast
6.1. Wafer Back Grinding Tape Market Size & Y-o-Y Growth Analysis
6.1.1. North America
6.1.2. Europe
6.1.3. Asia Pacific
6.1.4. Middle East & Africa
6.1.5. South America

7. Global Wafer Back Grinding Tape Market Analysis and Forecast, By Type
7.1. Introduction and Definition
7.2. Key Findings
7.3. Wafer Back Grinding Tape Market Value Share Analysis, By Type
7.4. Wafer Back Grinding Tape Market Size (US$ Bn) Forecast, By Type
7.5. Wafer Back Grinding Tape Market Analysis, By Type
7.6. Wafer Back Grinding Tape Market Attractiveness Analysis, By Type

8. Global Wafer Back Grinding Tape Market Analysis and Forecast, By Wafer Size
8.1. Introduction and Definition
8.2. Key Findings
8.3. Wafer Back Grinding Tape Market Value Share Analysis, By Wafer Size
8.4. Wafer Back Grinding Tape Market Size (US$ Bn) Forecast, By Wafer Size
8.5. Wafer Back Grinding Tape Market Analysis, By Wafer Size
8.6. Wafer Back Grinding Tape Market Attractiveness Analysis, By Wafer Size

9. Global Wafer Back Grinding Tape Market Analysis, by Region
9.1. Wafer Back Grinding Tape Market Value Share Analysis, by Region
9.2. Wafer Back Grinding Tape Market Size (US$ Bn) Forecast, by Region
9.3. Wafer Back Grinding Tape Market Attractiveness Analysis, by Region

10. North America Wafer Back Grinding Tape Market Analysis
10.1. Key Findings
10.2. North America Wafer Back Grinding Tape Market Overview
10.3. North America Wafer Back Grinding Tape Market Value Share Analysis, By Type
10.4. North America Wafer Back Grinding Tape Market Forecast, By Type
10.4.1. UV Curable
10.4.2. Non-UV
10.5. North America Wafer Back Grinding Tape Market Value Share Analysis, By Wafer Size
10.6. North America Wafer Back Grinding Tape Market Forecast, By Wafer Size
10.6.1. 6-Inch
10.6.2. 8-Inch
10.6.3. 12-Inch
10.6.4. Others
10.7. North America Wafer Back Grinding Tape Market Value Share Analysis, by Country
10.8. North America Wafer Back Grinding Tape Market Forecast, by Country
10.8.1. U.S.
10.8.2. Canada
10.9. North America Wafer Back Grinding Tape Market Analysis, by Country
10.10. U.S. Wafer Back Grinding Tape Market Forecast, By Type
10.10.1. UV Curable
10.10.2. Non-UV
10.11. U.S. Wafer Back Grinding Tape Market Forecast, By Wafer Size
10.11.1. 6-Inch
10.11.2. 8-Inch
10.11.3. 12-Inch
10.11.4. Others
10.12. Canada Wafer Back Grinding Tape Market Forecast, By Type
10.12.1. UV Curable
10.12.2. Non-UV
10.13. Canada Wafer Back Grinding Tape Market Forecast, By Wafer Size
10.13.1. 6-Inch
10.13.2. 8-Inch
10.13.3. 12-Inch
10.13.4. Others
10.14. North America Wafer Back Grinding Tape Market Attractiveness Analysis
10.14.1. By Type
10.14.2. By Wafer Size
10.15. PEST Analysis
10.16. Key Trends
10.17. Key Developments

11. Europe Wafer Back Grinding Tape Market Analysis
11.1. Key Findings
11.2. Europe Wafer Back Grinding Tape Market Overview
11.3. Europe Wafer Back Grinding Tape Market Value Share Analysis, By Type
11.4. Europe Wafer Back Grinding Tape Market Forecast, By Type
11.4.1. UV Curable
11.4.2. Non-UV
11.5. Europe Wafer Back Grinding Tape Market Value Share Analysis, By Wafer Size
11.6. Europe Wafer Back Grinding Tape Market Forecast, By Wafer Size
11.6.1. 6-Inch
11.6.2. 8-Inch
11.6.3. 12-Inch
11.6.4. Others
11.7. Europe Wafer Back Grinding Tape Market Value Share Analysis, by Country
11.8. Europe Wafer Back Grinding Tape Market Forecast, by Country
11.8.1. Germany
11.8.2. U.K.
11.8.3. France
11.8.4. Italy
11.8.5. Spain
11.8.6. Norway
11.8.7. Russia
11.8.8. Rest of Europe
11.9. Europe Wafer Back Grinding Tape Market Analysis, by Country
11.10. Germany Wafer Back Grinding Tape Market Forecast, By Type
11.10.1. UV Curable
11.10.2. Non-UV
11.11. Germany Wafer Back Grinding Tape Market Forecast, By Wafer Size
11.11.1. 6-Inch
11.11.2. 8-Inch
11.11.3. 12-Inch
11.11.4. Others
11.12. U.K. Wafer Back Grinding Tape Market Forecast, By Type
11.12.1. UV Curable
11.12.2. Non-UV
11.13. U.K. Wafer Back Grinding Tape Market Forecast, By Wafer Size
11.13.1. 6-Inch
11.13.2. 8-Inch
11.13.3. 12-Inch
11.13.4. Others
11.14. France Wafer Back Grinding Tape Market Forecast, By Type
11.14.1. UV Curable
11.14.2. Non-UV
11.15. France Wafer Back Grinding Tape Market Forecast, By Wafer Size
11.15.1. 6-Inch
11.15.2. 8-Inch
11.15.3. 12-Inch
11.15.4. Others
11.16. Italy Wafer Back Grinding Tape Market Forecast, By Type
11.16.1. UV Curable
11.16.2. Non-UV
11.17. Italy Wafer Back Grinding Tape Market Forecast, By Wafer Size
11.17.1. 6-Inch
11.17.2. 8-Inch
11.17.3. 12-Inch
11.17.4. Others
11.18. Spain Wafer Back Grinding Tape Market Forecast, By Type
11.18.1. UV Curable
11.18.2. Non-UV
11.19. Spain Wafer Back Grinding Tape Market Forecast, By Wafer Size
11.19.1. 6-Inch
11.19.2. 8-Inch
11.19.3. 12-Inch
11.19.4. Others
11.20. Norway Wafer Back Grinding Tape Market Forecast, By Type
11.20.1. UV Curable
11.20.2. Non-UV
11.21. Norway Wafer Back Grinding Tape Market Forecast, By Wafer Size
11.21.1. 6-Inch
11.21.2. 8-Inch
11.21.3. 12-Inch
11.21.4. Others
11.22. Russia Wafer Back Grinding Tape Market Forecast, By Type
11.22.1. UV Curable
11.22.2. Non-UV
11.23. Russia Wafer Back Grinding Tape Market Forecast, By Wafer Size
11.23.1. 6-Inch
11.23.2. 8-Inch
11.23.3. 12-Inch
11.23.4. Others
11.24. Rest of Europe Wafer Back Grinding Tape Market Forecast, By Type
11.24.1. UV Curable
11.24.2. Non-UV
11.25. Rest of Europe Wafer Back Grinding Tape Market Forecast, By Wafer Size
11.25.1. 6-Inch
11.25.2. 8-Inch
11.25.3. 12-Inch
11.25.4. Others
11.26. Europe Wafer Back Grinding Tape Market Attractiveness Analysis
11.26.1. By Type
11.26.2. By Wafer Size
11.27. PEST Analysis
11.28. Key Trends
11.29. Key Developments

12. Asia Pacific Wafer Back Grinding Tape Market Analysis
12.1. Key Findings
12.2. Asia Pacific Wafer Back Grinding Tape Market Overview
12.3. Asia Pacific Wafer Back Grinding Tape Market Value Share Analysis, By Type
12.4. Asia Pacific Wafer Back Grinding Tape Market Forecast, By Type
12.4.1. UV Curable
12.4.2. Non-UV
12.5. Asia Pacific Wafer Back Grinding Tape Market Value Share Analysis, By Wafer Size
12.6. Asia Pacific Wafer Back Grinding Tape Market Forecast, By Wafer Size
12.6.1. 6-Inch
12.6.2. 8-Inch
12.6.3. 12-Inch
12.6.4. Others
12.7. Asia Pacific Wafer Back Grinding Tape Market Value Share Analysis, by Country
12.8. Asia Pacific Wafer Back Grinding Tape Market Forecast, by Country
12.8.1. China
12.8.2. India
12.8.3. Japan
12.8.4. South Korea
12.8.5. Australia
12.8.6. Malaysia
12.8.7. Indonesia
12.8.8. Rest of Asia Pacific
12.9. Asia Pacific Wafer Back Grinding Tape Market Analysis, by Country
12.10. China Wafer Back Grinding Tape Market Forecast, By Type
12.10.1. UV Curable
12.10.2. Non-UV
12.11. China Wafer Back Grinding Tape Market Forecast, By Wafer Size
12.11.1. 6-Inch
12.11.2. 8-Inch
12.11.3. 12-Inch
12.11.4. Others
12.12. India Wafer Back Grinding Tape Market Forecast, By Type
12.12.1. UV Curable
12.12.2. Non-UV
12.13. India Wafer Back Grinding Tape Market Forecast, By Wafer Size
12.13.1. 6-Inch
12.13.2. 8-Inch
12.13.3. 12-Inch
12.13.4. Others
12.14. Japan Wafer Back Grinding Tape Market Forecast, By Type
12.14.1. UV Curable
12.14.2. Non-UV
12.15. Japan Wafer Back Grinding Tape Market Forecast, By Wafer Size
12.15.1. 6-Inch
12.15.2. 8-Inch
12.15.3. 12-Inch
12.15.4. Others
12.16. South Korea Wafer Back Grinding Tape Market Forecast, By Type
12.16.1. UV Curable
12.16.2. Non-UV
12.17. South Korea Wafer Back Grinding Tape Market Forecast, By Wafer Size
12.17.1. 6-Inch
12.17.2. 8-Inch
12.17.3. 12-Inch
12.17.4. Others
12.18. Australia Wafer Back Grinding Tape Market Forecast, By Type
12.18.1. UV Curable
12.18.2. Non-UV
12.19. Australia Wafer Back Grinding Tape Market Forecast, By Wafer Size
12.19.1. 6-Inch
12.19.2. 8-Inch
12.19.3. 12-Inch
12.19.4. Others
12.20. Malaysia Wafer Back Grinding Tape Market Forecast, By Type
12.20.1. UV Curable
12.20.2. Non-UV
12.21. Malaysia Wafer Back Grinding Tape Market Forecast, By Wafer Size
12.21.1. 6-Inch
12.21.2. 8-Inch
12.21.3. 12-Inch
12.21.4. Others
12.22. Indonesia Wafer Back Grinding Tape Market Forecast, By Type
12.22.1. UV Curable
12.22.2. Non-UV
12.23. Indonesia Wafer Back Grinding Tape Market Forecast, By Wafer Size
12.23.1. 6-Inch
12.23.2. 8-Inch
12.23.3. 12-Inch
12.23.4. Others
12.24. Rest of Asia Pacific Wafer Back Grinding Tape Market Forecast, By Type
12.24.1. UV Curable
12.24.2. Non-UV
12.25. Rest of Asia Pacific Wafer Back Grinding Tape Market Forecast, By Wafer Size
12.25.1. 6-Inch
12.25.2. 8-Inch
12.25.3. 12-Inch
12.25.4. Others
12.26. Asia Pacific Wafer Back Grinding Tape Market Attractiveness Analysis
12.26.1. By Type
12.26.2. By Wafer Size
12.27. PEST Analysis
12.28. Key Trends
12.29. Key Developments

13. Middle East & Africa Wafer Back Grinding Tape Market Analysis
13.1. Key Findings
13.2. Middle East & Africa Wafer Back Grinding Tape Market Overview
13.3. Middle East & Africa Wafer Back Grinding Tape Market Value Share Analysis, By Type
13.4. Middle East & Africa Wafer Back Grinding Tape Market Forecast, By Type
13.4.1. UV Curable
13.4.2. Non-UV
13.5. Middle East & Africa Wafer Back Grinding Tape Market Value Share Analysis, By Wafer Size
13.6. Middle East & Africa Wafer Back Grinding Tape Market Forecast, By Wafer Size
13.6.1. 6-Inch
13.6.2. 8-Inch
13.6.3. 12-Inch
13.6.4. Others
13.7. Middle East & Africa Wafer Back Grinding Tape Market Value Share Analysis, by Country
13.8. Middle East & Africa Wafer Back Grinding Tape Market Forecast, by Country
13.8.1. GCC
13.8.2. South Africa
13.8.3. Rest of Middle East & Africa
13.9. Middle East & Africa Wafer Back Grinding Tape Market Analysis, by Country
13.10. GCC Wafer Back Grinding Tape Market Forecast, By Type
13.10.1. UV Curable
13.10.2. Non-UV
13.11. GCC Wafer Back Grinding Tape Market Forecast, By Wafer Size
13.11.1. 6-Inch
13.11.2. 8-Inch
13.11.3. 12-Inch
13.11.4. Others
13.12. South Africa Wafer Back Grinding Tape Market Forecast, By Type
13.12.1. UV Curable
13.12.2. Non-UV
13.13. South Africa Wafer Back Grinding Tape Market Forecast, By Wafer Size
13.13.1. 6-Inch
13.13.2. 8-Inch
13.13.3. 12-Inch
13.13.4. Others
13.14. Rest of Middle East & Africa Wafer Back Grinding Tape Market Forecast, By Type
13.14.1. UV Curable
13.14.2. Non-UV
13.15. Rest of Middle East & Africa Wafer Back Grinding Tape Market Forecast, By Wafer Size
13.15.1. 6-Inch
13.15.2. 8-Inch
13.15.3. 12-Inch
13.15.4. Others
13.16. Middle East & Africa Wafer Back Grinding Tape Market Attractiveness Analysis
13.16.1. By Type
13.16.2. By Wafer Size
13.17. PEST Analysis
13.18. Key Trends
13.19. Key Developments

14. South America Wafer Back Grinding Tape Market Analysis
14.1. Key Findings
14.2. South America Wafer Back Grinding Tape Market Overview
14.3. South America Wafer Back Grinding Tape Market Value Share Analysis, By Type
14.4. South America Wafer Back Grinding Tape Market Forecast, By Type
14.4.1. UV Curable
14.4.2. Non-UV
14.5. South America Wafer Back Grinding Tape Market Value Share Analysis, By Wafer Size
14.6. South America Wafer Back Grinding Tape Market Forecast, By Wafer Size
14.6.1. 6-Inch
14.6.2. 8-Inch
14.6.3. 12-Inch
14.6.4. Others
14.7. South America Wafer Back Grinding Tape Market Value Share Analysis, by Country
14.8. South America Wafer Back Grinding Tape Market Forecast, by Country
14.8.1. Brazil
14.8.2. Mexico
14.8.3. Argentina
14.8.4. Rest of South America
14.9. South America Wafer Back Grinding Tape Market Analysis, by Country
14.10. Brazil Wafer Back Grinding Tape Market Forecast, By Type
14.10.1. UV Curable
14.10.2. Non-UV
14.11. Brazil Wafer Back Grinding Tape Market Forecast, By Wafer Size
14.11.1. 6-Inch
14.11.2. 8-Inch
14.11.3. 12-Inch
14.11.4. Others
14.12. Mexico Wafer Back Grinding Tape Market Forecast, By Type
14.12.1. UV Curable
14.12.2. Non-UV
14.13. Mexico Wafer Back Grinding Tape Market Forecast, By Wafer Size
14.13.1. 6-Inch
14.13.2. 8-Inch
14.13.3. 12-Inch
14.13.4. Others
14.14. Argentina Wafer Back Grinding Tape Market Forecast, By Type
14.14.1. UV Curable
14.14.2. Non-UV
14.15. Argentina Wafer Back Grinding Tape Market Forecast, By Wafer Size
14.15.1. 6-Inch
14.15.2. 8-Inch
14.15.3. 12-Inch
14.15.4. Others
14.16. Rest of South America Wafer Back Grinding Tape Market Forecast, By Type
14.16.1. UV Curable
14.16.2. Non-UV
14.17. Rest of South America Wafer Back Grinding Tape Market Forecast, By Wafer Size
14.17.1. 6-Inch
14.17.2. 8-Inch
14.17.3. 12-Inch
14.17.4. Others
14.18. South America Wafer Back Grinding Tape Market Attractiveness Analysis
14.18.1. By Type
14.18.2. By Wafer Size
14.19. PEST Analysis
14.20. Key Trends
14.21. Key Developments

15. Company Profiles
15.1. Market Share Analysis, by Company
15.2. Competition Matrix
15.2.1. Competitive Benchmarking of key players by price, presence, market share, Type and R&D investment
15.2.2. New Product Launches and Product Enhancements
15.2.3. Market Consolidation
15.2.3.1. M&A by Regions, Investment and Raw Materials
15.2.3.2. M&A Key Players, Forward Integration and Backward Integration
15.3. Company Profiles: Key Players
15.3.1. AI Technology, Inc.
15.3.1.1. Company Overview
15.3.1.2. Financial Overview
15.3.1.3. Product Portfolio
15.3.1.4. Business Strategy
15.3.1.5. Recent Developments
15.3.1.6. Development Footprint
15.3.2. AMC Co.,Ltd
15.3.3. Denka Company Limited
15.3.4. Force-One Applied Materials
15.3.5. Furukawa Electric Co., Ltd.
15.3.6. Lintec Advanced Technologies (Europe) Gmbh
15.3.7. Loadpoint
15.3.8. Mitsui Chemicals America, Inc.
15.3.9. Nitto Denko Corporation
15.3.10. Pantech Tape Co., Ltd
15.3.11. Hibex Singapore Pte Ltd
15.3.12. Syagrus Systems, LLC
15.3.13. Okamoto Machine Tool Works,Ltd
15.3.14. Minitron Elektron GMBH
15.3.15. NEPTCO, Inc
15.3.16. Sumitomo Bakelite Co., Ltd
16. Primary Key Insights
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