Global Semiconductor Wafer Polishing and Grinding Equipment Market is expected to grow at a CAGR of 4.95% during the forecast period. Global Semiconductor Wafer Polishing and Grinding Equipment Market is expected to reach US$ 490.45 Mn by2027.To know about the Research Methodology :- Request Free Sample Report
Global Semiconductor Wafer Polishing and Grinding Equipment market Overview:
The growing demand in MEMS, IC manufacturing, optics, & compound semiconductors will increase the planarization in semiconductor devices. In the present market situation, as almost all the electronic devices, with laptops, smartphones, computers, etc., make use of Silicon ICs & other wafer dependent packages, the demand for progressive grinding & polishing machinery is always on the growth. In fact, according to MMR study silicon wafer shipments for semiconductor applications is projected to reach 17,600 Mn Square Inches by 2027, from 11,810 MSI in the year 2019. This market situation is estimated to open some opportunities for the polishing & grinding equipment market during the forecast period. The yearly data published by SEMI shown that there had been a minor dip in the silicon wafer shipments for the year 2019 (11,810 MSI) following a nonstop growth until 2018 (12,732 MSI) as a result of overall economic slowdown & ongoing geopolitical tensions that have negatively impacted silicon demand for the year. Further, the rising need for decrease in the electronics is expected to drive some developments in the Semiconductor Wafer Polishing and Grinding Equipment market market during the forecast period. However, the recent developments in etching, which bid more advantages when compared to the polishing methods, are affecting the demand for polishing machinery. Moreover, the elimination of partial defects through polishing with traditional CMP technology preserves the surface profile, making it very difficult for manufacturers & service providers involved in wafer reclaim activities. Also, the current Covid-19 is anticipated to have a major effect on the silicon wafer market sales through the globe. A recent quarterly report from SEMI laid out two market states for the semiconductor wafer market in the 2nd half of 2020. First, the sales could see further dip amidst the uncertainty surrounding the impact of corona virus to the semiconductor industry. Second, the semiconductor industry could hike on the strength of recovering chip sales.According to MMR study, the dip in silicon wafer sales in the 2nd half of 2020 could have ripple effects on price negotiations in the year 2021. Wafer shipments, supply & demand shifts, suppliers' dynamics, & pricing trends are considered for the same. Due to such a situation, the sale of 300mm silicon wafer shipments might see a minor decline, whereas the 200mm & 150mm shipments would drop by 5 percent & 13 percent, respectively, in the 1st half of 2020.
Rising Consumption of Consumer Electronics is Anticipated to Positively Impact the Market:
The technical advancements in consumer electronic devices, like smartphones & tablets, and the growth of smart home devices & wearables globally are driving the need for small integrated circuits. This, in turn, is powering the demand for wafer polishing & grinding equipment, which plays an essential role in the semiconductor wafer fabrication process. The global demand for the semiconductor materials market is being driven by smartphones & other applications through consumer electronics, automotive applications, etc. These industries have been encouraged by technology transitions like wireless technologies (5G), Artificial intelligence, etc. Also, the trend of growing numbers of Internet of Things (IoT) devices is estimated to force the semiconductor industry to invest in this equipment, in a bid to attain intelligent products. Furthermore, in the year 2019, Apple declared a contribution of USD 350 Bn to the US economy by the year 2023 & promised 2.4 Mn jobs, during the forecast period, which includes of the latest investments & its existing spending with local companies for supply & manufacturing. The company is one of the key players in the consumer electronics industry; hence, the announcement is projected to propel the demand for semiconductors. Every smartphone is included of a System on a Chip (SoC), which is an IC that integrates all or most components of a computer or other electronic system. SoC chips are usually fabricated using metal oxide semiconductor (MOS) technology & are sent to a wafer fabrication plant to create the SoC dice before packaging & testing where wafer polishing & grinding is done. According to MMR study, the global smartphone users are of 3.2 Bn in the year 2019 & are anticipated to grow to 3.8 Bn by 2021, which in turn is anticipated to impact the market positively. The report covers Semiconductor Wafer Grinding Equipment, Semiconductor Wafer Polishing Equipment with detailed analysis Global Semiconductor Wafer Polishing and Grinding Equipment market industry with the classifications of the market on the Type, Application & region. Analysis of past market dynamics from 2016 to 2019 is given in the report, which will help readers to benchmark the past trends with current market scenarios with the key players' contribution in it. The report has profiled twelve key players in the market from different regions. However, the report has considered all market leaders, followers, and new entrants with investors while analyzing the market and estimation the size of the same. The manufacturing environment in each region is different and focus is given on the regional impact on the cost of manufacturing, supply chain, availability of raw materials, labor cost, availability of advanced Plastic Type, trusted vendors are analyzed and the report has come up with recommendations for a future hot spot in five regions. The major country’s policies about manufacturing & Covid 19 impact on demand side are covered in the report.Scope of the Global Semiconductor Wafer Polishing and Grinding Equipment market: Inquire before buying
Global Semiconductor Wafer Polishing and Grinding Equipment market, by Region
• North America: o US o Canada • Europe o UK o Germany o France o Spain o Italy o Sweden o CIS countries o Rest of Europe • APAC o China o India o South Korea o Japan o Australia o Rest of APAC o ASEAN Indonesia Malaysia Singapore Thailand Vietnam • Middle East & Africa o GCC Countries o South Africa o Rest of MEA • Latin America o Mexico o Brazil o Rest of Latin AmericaGlobal Semiconductor Wafer Polishing and Grinding Equipment market Key Players
• TOKYO SEIMITSU • Revasum • Logomatic • Logitech • Lapmaster • Entrepix • EBARA • Applied Materials • Axus Technology • Tesla • ASM International • Hitachi High-Technologies Co. • Lam Research Co. • KLA-Tencor Co. • Screen Semiconductor Solutions.
Global Semiconductor Wafer Polishing and Grinding Equipment Market 1. Preface 1.1. Report Scope and Market Segmentation 1.2. Research Highlights 1.3. Research Objectives 2. Assumptions and Research Methodology 2.1. Report Assumptions 2.2. Abbreviations 2.3. Research Methodology 2.3.1. Secondary Research 2.3.1.1. Secondary data 2.3.1.2. Secondary Sources 2.3.2. Primary Research 2.3.2.1. Data from Primary Sources 2.3.2.2. Breakdown of Primary Sources 3. Executive Summary: Global Semiconductor Wafer Polishing and Grinding Equipment market Size, by Market Value (US$ Mn) 4. Market Overview 4.1. Introduction 4.2. Market Indicator 4.2.1. Drivers 4.2.2. Restraints 4.2.3. Opportunities 4.2.4. Challenges 4.3. Porter’s Analysis 4.4. Value Chain Analysis 4.5. Market Risk Analysis 4.6. SWOT Analysis 4.7. Industry Trends and Emerging Technologies 5. Supply Side and Demand Side Indicators 6. Global Semiconductor Wafer Polishing and Grinding Equipment market Analysis and Forecast 7. Global Semiconductor Wafer Polishing and Grinding Equipment market Analysis and Forecast, by Type 7.1. Introduction and Definition 7.2. Key Findings 7.3. Global Semiconductor Wafer Polishing and Grinding Equipment market Value Share Analysis, by Type 7.4. Global Semiconductor Wafer Polishing and Grinding Equipment market Size (US$ Mn) Forecast, by Type 7.5. Global Semiconductor Wafer Polishing and Grinding Equipment market Analysis, by Type 8. Global Semiconductor Wafer Polishing and Grinding Equipment market Analysis and Forecast, by Application 8.1. Introduction and Definition 8.2. Key Findings 8.3. Global Semiconductor Wafer Polishing and Grinding Equipment market Value Share Analysis, by Application 8.4. Global Semiconductor Wafer Polishing and Grinding Equipment market Size (US$ Mn) Forecast, by Application 8.5. Global Semiconductor Wafer Polishing and Grinding Equipment market Analysis, by Application 8.6. Global Semiconductor Wafer Polishing and Grinding Equipment market Attractiveness Analysis, by Application 9. Global Semiconductor Wafer Polishing and Grinding Equipment market Analysis and Forecast, by Region 9.1. Introduction and Definition 9.2. Key Findings 9.3. Global Semiconductor Wafer Polishing and Grinding Equipment market Value Share Analysis, by Region 9.4. Global Semiconductor Wafer Polishing and Grinding Equipment market Size (US$ Mn) Forecast, by Region 9.5. Global Semiconductor Wafer Polishing and Grinding Equipment market Analysis, by Region 10. Global Semiconductor Wafer Polishing and Grinding Equipment market Analysis 10.1. Key Findings 10.2. Global Semiconductor Wafer Polishing and Grinding Equipment market Overview 10.3. Global Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Type 10.3.1. Semiconductor Wafer Grinding Equipment 10.3.2. Semiconductor Wafer Polishing Equipment 10.4. Global Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Application 10.4.1. Memory manufacturers 10.4.2. Interlevel Dielectric Material (IDM) 10.4.3. Foundries 10.4.4. Other 10.5. Global Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Region 10.5.1. North America 10.5.2. Europe 10.5.3. Asia-Pacific 10.5.4. MEA & Africa 10.5.5. Latin America 10.6. PEST Analysis 10.7. Key Trends 10.8. Key Developments 11. North-America Semiconductor Wafer Polishing and Grinding Equipment market Analysis 11.1. Key Findings 11.2. North America Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Type 11.2.1. Semiconductor Wafer Grinding Equipment 11.2.2. Semiconductor Wafer Polishing Equipment 11.3. North America Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Application 11.3.1. Memory manufacturers 11.3.2. Interlevel Dielectric Material (IDM) 11.3.3. Foundries 11.3.4. Other 11.4. North-America Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Country 11.4.1. US 11.4.2. Canada 11.5. US Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Type 11.5.1. Semiconductor Wafer Grinding Equipment 11.5.2. Semiconductor Wafer Polishing Equipment 11.6. US Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Application 11.6.1. Memory manufacturers 11.6.2. Interlevel Dielectric Material (IDM) 11.6.3. Foundries 11.6.4. Other 11.7. Canada Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Type 11.7.1. Semiconductor Wafer Grinding Equipment 11.7.2. Semiconductor Wafer Polishing Equipment 11.8. Canada Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Application 11.8.1. Memory manufacturers 11.8.2. Interlevel Dielectric Material (IDM) 11.8.3. Foundries 11.8.4. Other 11.9. PEST Analysis 11.10. Key Trends 11.11. Key Developments 12. Europe Semiconductor Wafer Polishing and Grinding Equipment market Analysis 12.1. Key Findings 12.2. Europe Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Type 12.2.1. Semiconductor Wafer Grinding Equipment 12.2.2. Semiconductor Wafer Polishing Equipment 12.3. Europe Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Application 12.3.1. Memory manufacturers 12.3.2. Interlevel Dielectric Material (IDM) 12.3.3. Foundries 12.3.4. Other 12.4. Europe Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Country 12.4.1. UK 12.4.2. France 12.4.3. Germany 12.4.4. Russia 12.4.5. Italy 12.4.6. Rest of Europe 12.5. UK Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Type 12.5.1. Semiconductor Wafer Grinding Equipment 12.5.2. Semiconductor Wafer Polishing Equipment 12.6. UK Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Application 12.6.1. Memory manufacturers 12.6.2. Interlevel Dielectric Material (IDM) 12.6.3. Foundries 12.6.4. Other 12.7. France Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Type 12.7.1. Semiconductor Wafer Grinding Equipment 12.7.2. Semiconductor Wafer Polishing Equipment 12.8. France Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Application 12.8.1. Memory manufacturers 12.8.2. Interlevel Dielectric Material (IDM) 12.8.3. Foundries 12.8.4. Other 12.9. Germany Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Type 12.9.1. Semiconductor Wafer Grinding Equipment 12.9.2. Semiconductor Wafer Polishing Equipment 12.10. Germany Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Application 12.10.1. Memory manufacturers 12.10.2. Interlevel Dielectric Material (IDM) 12.10.3. Foundries 12.10.4. Other 12.11. Russia Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Type 12.11.1. Semiconductor Wafer Grinding Equipment 12.11.2. Semiconductor Wafer Polishing Equipment 12.12. Russia Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Application 12.12.1. Memory manufacturers 12.12.2. Interlevel Dielectric Material (IDM) 12.12.3. Foundries 12.12.4. Other 12.13. Italy Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Type 12.13.1. Semiconductor Wafer Grinding Equipment 12.13.2. Semiconductor Wafer Polishing Equipment 12.14. Italy Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Application 12.14.1. Memory manufacturers 12.14.2. Interlevel Dielectric Material (IDM) 12.14.3. Foundries 12.14.4. Other 12.15. Rest of Europe Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Type 12.15.1. Semiconductor Wafer Grinding Equipment 12.15.2. Semiconductor Wafer Polishing Equipment 12.16. Rest of Europe Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Application 12.16.1. Memory manufacturers 12.16.2. Interlevel Dielectric Material (IDM) 12.16.3. Foundries 12.16.4. Other 12.17. PEST Analysis 12.18. Key Trends 12.19. Key Developments 13. Asia-Pacific Semiconductor Wafer Polishing and Grinding Equipment market Analysis 13.1. Key Findings 13.2. Asia-Pacific Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Type 13.2.1. Semiconductor Wafer Grinding Equipment 13.2.2. Semiconductor Wafer Polishing Equipment 13.3. Asia-Pacific Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Application 13.3.1. Memory manufacturers 13.3.2. Interlevel Dielectric Material (IDM) 13.3.3. Foundries 13.3.4. Other 13.4. Asia-Pacific Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Country 13.4.1. China 13.4.2. India 13.4.3. Japan 13.4.4. Malaysia 13.4.5. Indonesia 13.4.6. Rest of Asia-Pacific 13.5. China Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Type 13.5.1. Semiconductor Wafer Grinding Equipment 13.5.2. Semiconductor Wafer Polishing Equipment 13.6. China Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Application 13.6.1. Memory manufacturers 13.6.2. Interlevel Dielectric Material (IDM) 13.6.3. Foundries 13.6.4. Other 13.7. India Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Type 13.7.1. Semiconductor Wafer Grinding Equipment 13.7.2. Semiconductor Wafer Polishing Equipment 13.8. India Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Application 13.8.1. Memory manufacturers 13.8.2. Interlevel Dielectric Material (IDM) 13.8.3. Foundries 13.8.4. Other 13.9. Japan Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Type 13.9.1. Semiconductor Wafer Grinding Equipment 13.9.2. Semiconductor Wafer Polishing Equipment 13.10. Japan Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Application 13.10.1. Memory manufacturers 13.10.2. Interlevel Dielectric Material (IDM) 13.10.3. Foundries 13.10.4. Other 13.11. ASEAN Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Type 13.11.1. Semiconductor Wafer Grinding Equipment 13.11.2. Semiconductor Wafer Polishing Equipment 13.12. ASEAN Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Application 13.12.1. Memory manufacturers 13.12.2. Interlevel Dielectric Material (IDM) 13.12.3. Foundries 13.12.4. Other 13.13. Rest of APAC Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Type 13.13.1. Semiconductor Wafer Grinding Equipment 13.13.2. Semiconductor Wafer Polishing Equipment 13.14. Rest of APAC Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Application 13.14.1. Memory manufacturers 13.14.2. Interlevel Dielectric Material (IDM) 13.14.3. Foundries 13.14.4. Other 13.15. PEST Analysis 13.16. Key Trends 13.17. Key Developments 14. MEA & Africa Semiconductor Wafer Polishing and Grinding Equipment market Analysis 14.1. Key Findings 14.2. MEA &Africa Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Type 14.2.1. Semiconductor Wafer Grinding Equipment 14.2.2. Semiconductor Wafer Polishing Equipment 14.3. MEA &Africa Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Application 14.3.1. Memory manufacturers 14.3.2. Interlevel Dielectric Material (IDM) 14.3.3. Foundries 14.3.4. Other 14.4. MEA &Africa Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Country 14.4.1. GCC 14.4.2. South Africa 14.4.3. Rest of MEA & Africa 14.5. GCC Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Type 14.5.1. Semiconductor Wafer Grinding Equipment 14.5.2. Semiconductor Wafer Polishing Equipment 14.6. GCC Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Application 14.6.1. Memory manufacturers 14.6.2. Interlevel Dielectric Material (IDM) 14.6.3. Foundries 14.6.4. Other 14.7. South Africa Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Type 14.7.1. Semiconductor Wafer Grinding Equipment 14.7.2. Semiconductor Wafer Polishing Equipment 14.8. South Africa Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Application 14.8.1. Memory manufacturers 14.8.2. Interlevel Dielectric Material (IDM) 14.8.3. Foundries 14.8.4. Other 14.9. Rest of MEA &Africa Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Type 14.9.1. Semiconductor Wafer Grinding Equipment 14.9.2. Semiconductor Wafer Polishing Equipment 14.10. Rest of MEA &Africa Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Application 14.10.1. Memory manufacturers 14.10.2. Interlevel Dielectric Material (IDM) 14.10.3. Foundries 14.10.4. Other 14.11. PEST Analysis 14.12. Key Trends 14.13. Key Developments 15. Latin America Semiconductor Wafer Polishing and Grinding Equipment market Analysis 15.1. Key Findings 15.2. Latin America Semiconductor Wafer Polishing and Grinding Equipment market Overview 15.3. Latin America Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Type 15.3.1. Semiconductor Wafer Grinding Equipment 15.3.2. Semiconductor Wafer Polishing Equipment 15.4. Latin America Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Application 15.4.1. Memory manufacturers 15.4.2. Interlevel Dielectric Material (IDM) 15.4.3. Foundries 15.4.4. Other 15.5. Latin America Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Country 15.5.1. Mexico 15.5.2. Brazil 15.5.3. Rest of Latin America 15.6. Mexico Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Type 15.6.1. Semiconductor Wafer Grinding Equipment 15.6.2. Semiconductor Wafer Polishing Equipment 15.7. Mexico Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Application 15.7.1. Memory manufacturers 15.7.2. Interlevel Dielectric Material (IDM) 15.7.3. Foundries 15.7.4. Other 15.8. Brazil Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Type 15.8.1. Semiconductor Wafer Grinding Equipment 15.8.2. Semiconductor Wafer Polishing Equipment 15.9. Brazil Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Application 15.9.1. Memory manufacturers 15.9.2. Interlevel Dielectric Material (IDM) 15.9.3. Foundries 15.9.4. Other 15.10. Rest of LA Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Type 15.10.1. Semiconductor Wafer Grinding Equipment 15.10.2. Semiconductor Wafer Polishing Equipment 15.11. Rest of LA Semiconductor Wafer Polishing and Grinding Equipment market Forecast, by Application 15.11.1. Memory manufacturers 15.11.2. Interlevel Dielectric Material (IDM) 15.11.3. Foundries 15.11.4. Other 15.12. PEST Analysis 15.13. Key Trends 15.14. Key Developments 16. Company Profiles 16.1. Market Share Analysis, by Company 16.2. Market Share Analysis, by Region 16.3. Market Share Analysis, by Country 16.4. Competition Matrix 16.4.1. Competitive Benchmarking of key players by price, presence, market share, Raw material and R&D investment 16.4.2. New Raw material Launches and Raw material Enhancements 16.4.2.1. Market Consolidation 16.4.2.2. M&A by Regions, Investment and Raw material 16.4.2.3. M&A Key Players, Forward Integration and Backward Integration 16.5. Company Profiles: Key Players 16.5.1. TOKYO SEIMITSU 16.5.2. Revasum 16.5.3. Logomatic 16.5.4. Logitech 16.5.5. Lapmaster 16.5.6. Entrepix 16.5.7. EBARA 16.5.8. Applied Materials 16.5.9. Axus Technology 16.5.10. Tesla 16.5.11. ASM International 16.5.12. Hitachi High-Technologies Co. 16.5.13. Lam Research Co. 16.5.14. KLA-Tencor Co. 16.5.15. Screen Semiconductor Solutions.