Global Microelectronics Packaging Market is expected to reach US$ XX Mn by 2026 from US$ XX Mn in 2019 at a CAGR of 18 % during the forecast period. The report includes an analysis of the impact of COVID-19 lockdown on the revenue of market leaders, followers, and disruptors. Since the lockdown was implemented differently in various regions and countries; the impact of the same is also seen differently by regions and segments. The report has covered the current short-term and long-term impact on the market, and it would help the decision-makers to prepare the outline and strategies for companies by region.Microelectronics Packaging Definition:
Microelectronics Packaging is a type of packaging used to protect the chip by outside sources for the continuation of the working of the component. It involves the use of various engineering components and technologies for protective features and the security of the product packaged.Global Microelectronics Packaging Market Dynamic:
Microelectronic equipment and components have to withstand extreme conditions during the manufacturing process like exposure to intense temperatures and harsh pressurized solvents. Microelectronics Packaging has the property, which can withstand the high temperature and also such harsh conditions, which is expected to act as a driver to the growth of the Global Microelectronics Packaging Market. The increasing use of connected devices has increased the use of the Internet of Things (IoT), which has increased the demand for Microelectronics Packaging. Also, because of the increase in the demand for consumer wearable goods like smartphones, laptops, and appliances, the demand for microelectronics has increased. Increasing enhancement of the manufacturing capabilities and the smart packaging technology has driven the growth of the Global Microelectronics Packaging Market. The manufacturers of semiconductors are working on the advancement and development of more secure chips because of the security concerns of the users. The technological advancement is expected to act as an opportunity for the growth of the Global Microelectronics Packaging Market. Microelectronics packaging with different materials like metals, ceramics, glass, polymer, and others is also expected to increase during the forecast period. The high cost of microelectronics packaging is expected to act as a restraint on the growth of the Global Microelectronics Packaging Market.Global Microelectronics Packaging Market Segment Analysis:
The report groups the Global Microelectronics Packaging Market in different segments by Packaging Type, end-user, and region to forecast the revenues and analyze the market share of each segment over the forecast period.To know about the Research Methodology :- Request Free Sample Report Based on end-use, the Global Microelectronics Packaging Market is segmented into Consumer Electronics, Automotive, Industrial, Healthcare, Aerospace & Defense, and Others. The Aerospace & Defense segment was dominant in 2019 and is expected to command a market share of xx% by 2026. Aerospace & Defense equipment such as data processing units, data display systems, and aircraft control systems assemblies the use of Microelectronics Packaging is done on a large scale. Many electronic components are used in the naval warships, satellite communication channels, weapon control systems, coastguards, etc in, which microelectronics packaging is done. Humidity and Environment are the two main important reasons for the demand for Microelectronics Packaging. Also, various developing and developing regions are investing huge amounts in defense regularly increasing the defense budget. Also, the import-export of the weapons has increased the usage of microelectronics packaging in the region. Based on Packaging Type, the Global Microelectronics Packaging Market is segmented into Single-Chip Packaging and Multi-Chip Packaging. The Multi-Chip Packaging segment was dominant in 2019 and is expected to command a market share of xx% by 2026.
Global Microelectronics Packaging Market Regional Insights:
Asia Pacific is expected to command the largest market share of xx% by 2026 In APAC, developing economies like China and India are considered electronics hubs because of the presence of a large number of manufacturing and production of electrical components in the region. For meeting the high standards of quality, performance, and delivery the demand for Microelectronics Packaging has increased in the region. Manufacturers in the region are investing in the installation of machinery, which enables electronics and microelectronics packaging. In North America, the increased usage of IoT in various applications used by various industries, which is acting as a driver to the growth of the Global Microelectronics Packaging Market. High performance and the flexibility of microelectronics packaging are expected to lead to its success in electronics components in the region. The objective of the report is to present a comprehensive analysis of the Global Microelectronics Packaging Market to the stakeholders in the industry. The past and current status of the industry with forecasted market size and trends are presented in the report with the analysis of complicated data in simple language. The report covers all the aspects of the industry with a dedicated study of key players that include market leaders, followers, and new entrants. PORTER, SVOR, PESTEL analysis with the potential impact of micro-economic factors of the market have been presented in the report. External as well as internal factors that are supposed to affect the business positively or negatively have been analyzed, which will give a clear futuristic view of the industry to the decision-makers. The report also helps in understanding the Global Microelectronics Packaging Market dynamics, structure by analyzing the market segments and projects the Global Microelectronics Packaging Market size. Clear representation of competitive analysis of key players by product, price, financial position, product portfolio, growth strategies, and regional presence in the Global Microelectronics Packaging Market make the report investor’s guide.
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Global Microelectronics Packaging Market Key Players
• Amkor Technology • ASE Group • Siliconware Precision Industries Co., Ltd. • Jiangsu Changjiang Electronics Technology Co. Ltd. • SÜSS MicroTec AG. • International Business Machines Corporation (IBM) • Intel Corporation • Qualcomm Technologies, Inc. • STMicroelectronics • Taiwan Semiconductor Manufacturing Company • Sony Corp • SAMSUNG Electronics Co. Ltd. • Advanced Micro Devices, Inc. • Cisco • 3M Company • Advanced Semiconductor Engineering • Micron Technology • United Microelectronics • STATS ChipPAC • Taiwan Semiconductor Manufacturing • Samsung Electronics • IBM • STMicroelectronics • Xilinx • AMETEK ECP • Teledyne Microelectronics
1. Preface 1.1. Market Definition and Key Research Objectives 1.2. Research Highlights 2. Assumptions and Research Methodology 2.1. Report Assumptions 2.2. Abbreviations 2.3. Research Methodology 2.3.1. Secondary Research 2.3.1.1. Secondary data 2.3.1.2. Secondary Sources 2.3.2. Primary Research 2.3.2.1. Data from Primary Sources 2.3.2.2. Breakdown of Primary Sources 3. Executive Summary: Global Microelectronics Packaging Market Size, by Market Value (US$ Mn) 3.1. Global Market Segmentation 3.2. Global Market Segmentation Share Analysis, 2019 3.2.1. Global 3.2.2. By Region (North America, Europe, Asia Pacific, South America, Middle East Africa) 3.3. Geographical Snapshot of the Microelectronics Packaging Market 3.4. Geographical Snapshot of the Microelectronics Packaging Market, By Manufacturer share 4. Global Microelectronics Packaging Market Overview, 2019-2026 4.1. Market Dynamics 4.1.1. Drivers 4.1.1.1. Global 4.1.1.2. By Region (North America, Europe, Asia Pacific, South America, Middle East Africa) 4.1.2. Restraints 4.1.2.1. Global 4.1.2.2. By Region (North America, Europe, Asia Pacific, South America, Middle East Africa) 4.1.3. Opportunities 4.1.3.1. Global 4.1.3.2. By Region (North America, Europe, Asia Pacific, South America, Middle East Africa) 4.1.4. Challenges 4.1.4.1. Global 4.1.4.2. By Region (North America, Europe, Asia Pacific, South America, Middle East Africa) 4.1.5. Industry Trends and Emerging Technologies 4.1.6. Porters Five Forces Analysis 4.1.6.1. Threat of New Entrants 4.1.6.2. Bargaining Power of Buyers/Consumers 4.1.6.3. Bargaining Power of Suppliers 4.1.6.4. Threat of Substitute Products 4.1.6.5. Intensity of Competitive Rivalry 4.1.7. Value Chain Analysis 4.1.8. Technological Roadmap 4.1.9. Regulatory landscape 4.1.10. Impact of the Covid-19 Pandemic on the Global Microelectronics Packaging Market 5. Supply Side and Demand Side Indicators 6. Global Microelectronics Packaging Market Analysis and Forecast, 2019-2026 6.1. Global Microelectronics Packaging Market Size & Y-o-Y Growth Analysis. 7. Global Microelectronics Packaging Market Analysis and Forecasts, 2019-2026 7.1. Market Size (Value) Estimates & Forecast By Packaging Type, 2019-2026 7.1.1. Single chip packaging (SCP) 7.1.2. Multi-chip package (MCP) 7.2. Market Size (Value) Estimates & Forecast By End Use, 2019-2026 7.2.1. Consumer electronics 7.2.2. Automotive 7.2.3. Industrial 7.2.4. Healthcare 7.2.5. Aerospace & defense 7.2.6. Others 8. Global Microelectronics Packaging Market Analysis and Forecasts, By Region 8.1. Market Size (Value) Estimates & Forecast By Region, 2019-2026 8.1.1. North America 8.1.2. Europe 8.1.3. Asia-Pacific 8.1.4. Middle East & Africa 8.1.5. South America 9. North America Microelectronics Packaging Market Analysis and Forecasts, 2019-2026 9.1. Market Size (Value) Estimates & Forecast By Packaging Type, 2019-2026 9.1.1. Single chip packaging (SCP) 9.1.2. Multi-chip package (MCP) 9.2. Market Size (Value) Estimates & Forecast By End Use, 2019-2026 9.2.1. Consumer electronics 9.2.2. Automotive 9.2.3. Industrial 9.2.4. Healthcare 9.2.5. Aerospace & defense 9.2.6. Others 10. North America Microelectronics Packaging Market Analysis and Forecasts, By Country 10.1. Market Size (Value) Estimates & Forecast By Country, 2019-2026 10.1.1. US 10.1.2. Canada 10.1.3. Mexico 11. U.S. Microelectronics Packaging Market Analysis and Forecasts, 2019-2026 11.1. Market Size (Value) Estimates & Forecast By Packaging Type, 2019-2026 11.2. Market Size (Value) Estimates & Forecast By End Use, 2019-2026 12. Canada Microelectronics Packaging Market Analysis and Forecasts, 2019-2026 12.1. Market Size (Value) Estimates & Forecast By Packaging Type, 2019-2026 12.2. Market Size (Value) Estimates & Forecast By End Use, 2019-2026 13. Mexico Microelectronics Packaging Market Analysis and Forecasts, 2019-2026 13.1. Market Size (Value) Estimates & Forecast By Packaging Type, 2019-2026 13.2. Market Size (Value) Estimates & Forecast By End Use, 2019-2026 14. Europe Microelectronics Packaging Market Analysis and Forecasts, 2019-2026 14.1. Market Size (Value) Estimates & Forecast By Packaging Type, 2019-2026 14.2. Market Size (Value) Estimates & Forecast By End Use, 2019-2026 15. Europe Microelectronics Packaging Market Analysis and Forecasts, By Country 15.1. Market Size (Value) Estimates & Forecast By Country, 2019-2026 15.1.1. U.K 15.1.2. France 15.1.3. Germany 15.1.4. Italy 15.1.5. Spain 15.1.6. Sweden 15.1.7. CIS Countries 15.1.8. Rest of Europe 16. U.K. Microelectronics Packaging Market Analysis and Forecasts, 2019-2026 16.1. Market Size (Value) Estimates & Forecast By Packaging Type, 2019-2026 16.2. Market Size (Value) Estimates & Forecast By End Use, 2019-2026 17. France Microelectronics Packaging Market Analysis and Forecasts, 2019-2026 17.1. Market Size (Value) Estimates & Forecast By Packaging Type, 2019-2026 17.2. Market Size (Value) Estimates & Forecast By End Use, 2019-2026 18. Germany Microelectronics Packaging Market Analysis and Forecasts, 2019-2026 18.1. Market Size (Value) Estimates & Forecast By Packaging Type, 2019-2026 18.2. Market Size (Value) Estimates & Forecast By End Use, 2019-2026 19. Italy Microelectronics Packaging Market Analysis and Forecasts, 2019-2026 19.1. Market Size (Value) Estimates & Forecast By Packaging Type, 2019-2026 19.2. Market Size (Value) Estimates & Forecast By End Use, 2019-2026 20. Spain Microelectronics Packaging Market Analysis and Forecasts, 2019-2026 20.1. Market Size (Value) Estimates & Forecast By Packaging Type, 2019-2026 20.2. Market Size (Value) Estimates & Forecast By End Use, 2019-2026 21. Sweden Microelectronics Packaging Market Analysis and Forecasts, 2019-2026 21.1. Market Size (Value) Estimates & Forecast By Packaging Type, 2019-2026 21.2. Market Size (Value) Estimates & Forecast By End Use, 2019-2026 22. CIS Countries Microelectronics Packaging Market Analysis and Forecasts, 2019-2026 22.1. Market Size (Value) Estimates & Forecast By Packaging Type, 2019-2026 22.2. Market Size (Value) Estimates & Forecast By End Use, 2019-2026 23. Rest of Europe Microelectronics Packaging Market Analysis and Forecasts, 2019-2026 23.1. Market Size (Value) Estimates & Forecast By Packaging Type, 2019-2026 23.2. Market Size (Value) Estimates & Forecast By End Use, 2019-2026 24. Asia Pacific Microelectronics Packaging Market Analysis and Forecasts, 2019-2026 24.1. Market Size (Value) Estimates & Forecast By Packaging Type, 2019-2026 24.2. Market Size (Value) Estimates & Forecast By End Use, 2019-2026 25. Asia Pacific Microelectronics Packaging Market Analysis and Forecasts, by Country 25.1. Market Size (Value) Estimates & Forecast By Country, 2019-2026 25.1.1. China 25.1.2. India 25.1.3. Japan 25.1.4. South Korea 25.1.5. Australia 25.1.6. ASEAN 25.1.7. Rest of Asia Pacific 26. China Microelectronics Packaging Market Analysis and Forecasts, 2019-2026 26.1. Market Size (Value) Estimates & Forecast By Packaging Type, 2019-2026 26.2. Market Size (Value) Estimates & Forecast By End Use, 2019-2026 27. India Microelectronics Packaging Market Analysis and Forecasts, 2019-2026 27.1. Market Size (Value) Estimates & Forecast By Packaging Type, 2019-2026 27.2. Market Size (Value) Estimates & Forecast By End Use, 2019-2026 28. Japan Microelectronics Packaging Market Analysis and Forecasts, 2019-2026 28.1. Market Size (Value) Estimates & Forecast By Packaging Type, 2019-2026 28.2. Market Size (Value) Estimates & Forecast By End Use, 2019-2026 29. South Korea Microelectronics Packaging Market Analysis and Forecasts, 2019-2026 29.1. Market Size (Value) Estimates & Forecast By Packaging Type, 2019-2026 29.2. Market Size (Value) Estimates & Forecast By End Use, 2019-2026 30. Australia Microelectronics Packaging Market Analysis and Forecasts, 2019-2026 30.1. Market Size (Value) Estimates & Forecast By Packaging Type, 2019-2026 30.2. Market Size (Value) Estimates & Forecast By End Use, 2019-2026 31. ASEAN Microelectronics Packaging Market Analysis and Forecasts, 2019-2026 31.1. Market Size (Value) Estimates & Forecast By Packaging Type, 2019-2026 31.2. Market Size (Value) Estimates & Forecast By End Use, 2019-2026 32. Rest of Asia Pacific Microelectronics Packaging Market Analysis and Forecasts, 2019-2026 32.1. Market Size (Value) Estimates & Forecast By Packaging Type, 2019-2026 32.2. Market Size (Value) Estimates & Forecast By End Use, 2019-2026 33. Middle East Africa Microelectronics Packaging Market Analysis and Forecasts, 2019-2026 33.1. Market Size (Value) Estimates & Forecast By Packaging Type, 2019-2026 33.2. Market Size (Value) Estimates & Forecast By End Use, 2019-2026 34. Middle East Africa Microelectronics Packaging Market Analysis and Forecasts, by Country 34.1. Market Size (Value) Estimates & Forecast by Country, 2019-2026 34.1.1. South Africa 34.1.2. GCC Countries 34.1.3. Egypt 34.1.4. Nigeria 34.1.5. Rest of ME&A 35. South Africa Microelectronics Packaging Market Analysis and Forecasts, 2019-2026 35.1. Market Size (Value) Estimates & Forecast By Packaging Type, 2019-2026 35.2. Market Size (Value) Estimates & Forecast By End Use, 2019-2026 36. GCC Countries Microelectronics Packaging Market Analysis and Forecasts, 2019-2026 36.1. Market Size (Value) Estimates & Forecast By Packaging Type, 2019-2026 36.2. Market Size (Value) Estimates & Forecast By End Use, 2019-2026 37. Egypt Microelectronics Packaging Market Analysis and Forecasts, 2019-2026 37.1. Market Size (Value) Estimates & Forecast By Packaging Type, 2019-2026 37.2. Market Size (Value) Estimates & Forecast By End Use, 2019-2026 38. Nigeria Microelectronics Packaging Market Analysis and Forecasts, 2019-2026 38.1. Market Size (Value) Estimates & Forecast By Packaging Type, 2019-2026 38.2. Market Size (Value) Estimates & Forecast By End Use, 2019-2026 39. Rest of ME&A Microelectronics Packaging Market Analysis and Forecasts, 2019-2026 39.1. Market Size (Value) Estimates & Forecast By Packaging Type, 2019-2026 39.2. Market Size (Value) Estimates & Forecast By End Use, 2019-2026 40. South America Microelectronics Packaging Market Analysis and Forecasts, 2019-2026 40.1. Market Size (Value) Estimates & Forecast By Packaging Type, 2019-2026 40.2. Market Size (Value) Estimates & Forecast By End Use, 2019-2026 41. South America Microelectronics Packaging Market Analysis and Forecasts, by Country 41.1. Market Size (Value) Estimates & Forecast by Country, 2019-2026 41.1.1. Brazil 41.1.2. Argentina 41.1.3. Rest of South America 42. Brazil Microelectronics Packaging Market Analysis and Forecasts, 2019-2026 42.1. Market Size (Value) Estimates & Forecast By Packaging Type, 2019-2026 42.2. Market Size (Value) Estimates & Forecast By End Use, 2019-2026 43. Argentina Microelectronics Packaging Market Analysis and Forecasts, 2019-2026 43.1. Market Size (Value) Estimates & Forecast By Packaging Type, 2019-2026 43.2. Market Size (Value) Estimates & Forecast By End Use, 2019-2026 44. Rest of South America Microelectronics Packaging Market Analysis and Forecasts, 2019-2026 44.1. Market Size (Value) Estimates & Forecast By Packaging Type, 2019-2026 44.2. Market Size (Value) Estimates & Forecast By End Use, 2019-2026 45. Competitive Landscape 45.1. Geographic Footprint of Major Players in the Global Microelectronics Packaging Market 45.2. Competition Matrix 45.2.1. Competitive Benchmarking of Key Players By Price, Presence, Market Share, Applications and R&D Investment 45.2.2. New Product Launches and Product Enhancements 45.2.3. Market Consolidation 45.2.3.1. M&A by Regions, Investment and Verticals 45.2.3.2. M&A, Forward Integration and Backward Integration 45.2.3.3. Partnership, Joint Ventures and Strategic Alliances/ Sales Agreements 45.3. Company Profile : Key Players 45.3.1. Amkor Technology 45.3.1.1. Company Overview 45.3.1.2. Financial Overview 45.3.1.3. Geographic Footprint 45.3.1.4. Product Portfolio 45.3.1.5. Business Strategy 45.3.1.6. Recent Developments 45.3.2. ASE Group 45.3.3. Siliconware Precision Industries Co., Ltd. 45.3.4. Jiangsu Changjiang Electronics Technology Co. Ltd. 45.3.5. SÜSS MicroTec AG. 45.3.6. International Business Machines Corporation (IBM) 45.3.7. Intel Corporation 45.3.8. Qualcomm Technologies, Inc. 45.3.9. STMicroelectronics 45.3.10. Taiwan Semiconductor Manufacturing Company 45.3.11. Sony Corp 45.3.12. SAMSUNG Electronics Co. Ltd. 45.3.13. Advanced Micro Devices, Inc. 45.3.14. Cisco 45.3.15. 3M Company 45.3.16. Advanced Semiconductor Engineering 45.3.17. Micron Technology 45.3.18. United Microelectronics 45.3.19. STATS ChipPAC 45.3.20. Taiwan Semiconductor Manufacturing 45.3.21. Samsung Electronics 45.3.22. IBM 45.3.23. STMicroelectronics 45.3.24. Xilinx 45.3.25. AMETEK ECP 45.3.26. Teledyne Microelectronics 46. Primary Key Insights