System in Package Market: Global Industry Analysis and Forecast (2023-2029)

System in Package Market size was valued at US$ 9.38 Bn. in 2022 and the total revenue is expected to grow at a CAGR of 9.8% through 2023 to 2029, reaching nearly US$ 18.06 Bn.
System in Package Market Overview:
SiP is a technology that combines numerous integrated circuits into a single package or module. The integrated circuits can be stacked vertically on a substrate, and two or more ICs can be packaged together in a single container.To know about the Research Methodology :- Request Free Sample Report
System in Package Market Dynamics:
The demand for reliable and small electronic equipment has grown due to the rapid R&D and technical advancements. Due to this reason, the need for smaller electrical devices is increasing. With the advancement of semiconductor technology, most electronic products have become more advanced, requiring the usage of IC packaging technologies in logic, memory, RF, and sensors to be integrated into compact form factors. The SiP provides high-performance and low-power solutions in a compact package. In addition, by managing the cycle duration and energy dissipation, the reduction in wire length in SiP helps to improve circuit performance and minimise power consumption.

The SiP technique allows for the interference-free integration of many multichip modules, such as DRAM and others. Due to this reason, the growing use of IC packaging technology in small form factors for the production of miniaturised electronic devices is boosting the market for this system. These are the major key factors that are expected to drives the growth of the global market during the forecast period 2023-2029.

SiP allows for extremely deep multilayer integration in a small footprint. While this is appealing for many applications where nanotechnology is a consideration, it also poses thermal management issues. High on-chip temperature is caused by increased integration. There was an issue with overheating during the manufacture of 3D ICs with TSVs. When the temperature rises, the threshold voltage drops, and mobility suffers. Because metal makes up the majority of the component, the resistance and power dissipation increase. The resistance of the wires increases as well, resulting in longer connection delays. Higher power densities and greater thermal resistance along heat dissipation routes generate more pronounced thermal impacts in 3D IC. Due to this, the system's progress in the package market is restricted by thermal difficulties.
System in Package Market Segment Analysis:
Based on the Device, the market is segmented into Application Processor, MEMS, PMIC, RF Power Amplifier, RF Front-End, Baseband Processor, and Others. RF Front-End segment is expected to grow rapidly at a CAGR of xx% during the forecast period 2023-2029. The demand for small-footprint and high-frequency transceivers in products like smart phones and tablets is expected to fuel the growth of RF front-end devices in the global market during the forecast period.

Based on the Packaging Method, the market is segmented into Fan-Out Wafer Level Packaging, Wire Bond and Die Attach, and Flip Chip. Fan-Out Wafer Level Packaging (FOWLP) segment is expected to hold the largest market share of xx% by 2029. Intel was one of the first companies to use the flip chip packaging approach to improve the electrical and thermal performance of their standard CPUs. The adoption of the flip chip packaging technology in baseband and application processors for mobile platforms was driven by the growing demand for functionality and smaller package sizes. FOWLP is a common packaging method for heterogeneous electronics such baseband CPUs, RF transceivers, and power management ICs (PMICs). Furthermore, the growing demand for semiconductor devices with a large number of I/O points is expected to drive up demand for the FOWLP packaging technology.
Regional Insights:
Asia Pacific dominates the Global System in Package market during the forecast period 2023-2029. Asia Pacific is expected to hold the largest market share of xx% by 2029. The consumer electronics market, especially smart phones and tablets, is driving demand for SiP technology. Due to this reason, major businesses in the industry, such as Samsung Electronics (South Korea) and Sony (Japan), are boosting the system in package market in Asia Pacific. These are the major factors that drive the growth of this region in the Global market during the forecast period 2023-2029.

The objective of the report is to present a comprehensive analysis of the Global System in Package Market to the stakeholders in the industry. The past and current status of the industry with the forecasted market size and trends are presented in the report with the analysis of complicated data in simple language. The report covers all the aspects of the industry with a dedicated study of key players that include market leaders, followers, and new entrants.

PORTER, PESTEL analysis with the potential impact of micro-economic factors of the market have been presented in the report. External as well as internal factors that are supposed to affect the business positively or negatively have been analyzed, which will give a clear futuristic view of the industry to the decision-makers.

The reports also help in understanding the Global System in Package Market dynamic, structure by analyzing the market segments and project the Global System in Package Market size. Clear representation of competitive analysis of key players by product, price, financial position, product portfolio, growth strategies, and regional presence in the Global System in Package Market make the report investor’s guide.
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System in Package Market


Report Coverage
Details


Base Year:
2022
Forecast Period:
2023-2029


Historical Data:
2018 to 2022
Market Size in 2022:
US $ 9.38 Bn.


Forecast Period 2023 to 2029 CAGR:
9.8%
Market Size in 2029:
US $ 18.06 Bn.


 Segments Covered:
by Packaging Technology
2-D IC Packaging
2.5-D Packaging
3-D Packaging


by Packaging Type
Small Outline Packages
Flat Packages
Surface Mount
Pin Grid Arrays
Ball Grid Arrays
Quad Flat No-leads packages


by Device
Application Processor
MEMS
PMIC
RF Power Amplifier
RF Front-End
Baseband Processor
Others


by Packaging Method
Fan-Out Wafer Level Packaging
Wire Bond and Die Attach
Flip Chip


by Application
Aerospace & Defence
Industrial System
Consumer Electronics
Automotive
Telecommunication
Healthcare



System in Package Market, by Region
North America (United States, Canada and Mexico)
Europe (UK, France, Germany, Italy, Spain, Sweden, Austria and Rest of Europe)
Asia Pacific (China, South Korea, Japan, India, Australia, Indonesia, Malaysia, Vietnam, Taiwan, Bangladesh, Pakistan and Rest of APAC)
Middle East and Africa (South Africa, GCC, Egypt, Nigeria and Rest of ME&A)
South America (razil, Argentina Rest of South America)
Key Players:
1. Amkor Technology Inc.
2. TriQuint Semiconductor Inc.
3. KLA-Tencor Corporation
4. China Wafer Level CSP Co. Ltd
5. ChipMOS Technologies Inc
6. STATS ChipPAC Ltd.
7. IQE PLC
8. Deca Technologies
9. Siliconware Precision
10. AOI Electronics
11. Tongfu Microelectronics
12. Intel
13. Samsung
14. Texas Instruments
15. Carsem
16. Hana-Micron
17. ASE Group
Frequently Asked Questions:
1] What segments are covered in Global System in Package Market report?
Ans. The segments covered in Global System in Package Market report are based on Packaging Technology, Packaging Type, Device, Packaging Method, and Application.

2] Which region is expected to hold the highest share in the Global System in Package Market?
Ans. Asia Pacific is expected to hold the highest share in the Global System in Package Market.

3] Who are the top key players in the Global System in Package Market?
Ans. Amkor Technology Inc., TriQuint Semiconductor Inc., KLA-Tencor Corporation, China Wafer Level CSP Co. Ltd, and ChipMOS Technologies Inc are the top key players in the Global System in Package Market.

4] Which segment holds the largest market share in the Global System in Package market by 2029?
Ans. Fan-Out Wafer Level Packaging segment hold the largest market share in the Global System in Package market by 2029.

5] What is the market size of the Global System in Package market by 2029?
Ans. The market size of the Global System in Package market is US $ 18.06 Bn. by 2029.

6] What was the market size of the Global System in Package market in 2022?
Ans. The market size of the Global System in Package market was worth US $ 9.38 Bn. in 2022.