Embedded Die Packaging Market – Global Industry Analysis and Forecast (2022-2027) by Platform, Application, End-Use, and Region

Embedded Die Packaging Market is expected to reach US$ 75.78 Mn. by 2027 from US$ 29.56 Mn. in 2021 at a CAGR of 16.99%during the forecast period. The report includes an analysis of the impact of COVID-19 lockdown on the revenue of market leaders, followers, and disruptors. Since the lockdown was implemented differently in various regions and countries; the impact of the same is also seen differently by regions and segments. The report has covered the current short-term and long-term impact on the market, and it would help the decision-makers to prepare the outline and strategies for companies by region.

Embedded Die Packaging Definition:

Embedded Die is defined as a passive component or an integrated circuit that is placed or formed on an inner layer of an organic circuit board, module, or chip package, such that it is buried inside the completed structure, rather than on the top or bottom. Global Embedded Die Packaging Market To know about the Research Methodology :- Request Free Sample Report

Embedded Die Packaging Market Dynamics:

The combination of increased I/O density, reduced footprint, and multi-die capability within a single platform makes embedded die an attractive solution. Additionally, embedded die products offer flexible memory configurations with routing above and below the die in addition to standard JEDEC pin-outs, while also providing integration of disparate die technologies onto a single platform. Thus, a new era of innovation has resulted in increased die content and functionality moving to the packaging industry to address the resulting integration gap, which has boosted the growth of the Global Embedded Die Packaging Market. Traditionally, the act of embedding die has been burdened by factors such as dedicating a known good die to a poor yielding substrate build-up process, long cycle-time, and the difficulty to inspect, test, and rework the embedded die structure. Recently, however, companies are making significant advancements to minimize these issues and develop an infrastructure to support the growing demand for embedded die products. Shifting the die embedding to mid-stream in the circuit build-up process helps to reduce die yield loss. In addition, leveraging mature, large format thin-film buildup and substrate lamination processes, in conjunction with high throughput die attach and panel-based assembly equipment helps to ensure a more robust and efficient process, which is acting as a driving factor to the growth of the Global Embedded Die Packaging Market. Modularization has become a critical focus throughout the semiconductor industry resulting in sophisticated packaging approaches to address the desire for miniaturization and increased levels of integration. At the lower end, the long-standing incumbent technology that has customarily addressed this, Multichip Modules (MCM), leverages traditional multichip attach methods using standard and advanced organic substrates. At the highest end, the most advanced technology platform leverages silicon interposers with metal vias to provide a highly integrated version of the incumbent, but at a cost premium. In the middle, the Embedded Die platform provides perhaps the most compelling argument, especially from the mobile perspective. The embedded die platform cuts a clear path between each of the previous two technology platforms mentioned. The embedded die platform provides an opportunity for true System-in-Package (SiP) architectures with much higher levels of integration than the incumbent MCM at much lower costs. Traditional multichip attach methods using standard and advanced organic substrates are limited to 2D planar scaling for MCM applications. The most advanced technology platform (2.5D TSV) is burdened by high packaging costs and an immature supply chain. The embedded die provides an alternate path for true heterogeneous integration in a 3D architecture within a cost structure that is attractive for consumer application. Both integrated device manufacturers companies are projecting significant growth opportunities for embedded die products, primarily for mobile applications.

Embedded Die Packaging Market Segment Analysis:

The report groups the Global Embedded Die Packaging Market in different segments by Platform, application, end-user, and region to forecast the revenues and analyze the market share of each segment over the forecast period. Based on end-use, the Global Embedded Die Packaging Market is segmented into Consumer Electronics, IT and Telecommunication, Automotive, Healthcare and Other. The Consumer Electronics segment was dominant in 2021 and is expected to command a market share of xx% by 2027. Embedding of semiconductor chips into organic substrates allows a very high degree of miniaturization by stacking multiple layers of embedded components, superior electrical performance by short and geometrically well-controlled interconnects as well as a homogeneous mechanical environment of the chips, resulting in good reliability. Embedded Die Packaging Market Based on application, the Global Embedded Die Packaging Market is segmented into Smartphones and Tablets, Medical and Wearable Devices, Industrial Devices, Security Devices, and Others.

Embedded Die Packaging Market Regional Insights:

Europe is expected to command the largest market share of xx% by 2027 With the funded European Project “EmPower” in the frame of CATRENE (Cluster for Application and Technology Research in Europe on Nanoelectronics) academic and industrial players have formed a consortium to develop the next generation of embedded power packages and power modules, which have increased the demand of the embedded die packaging in the region. In the frame of the EU-funded project “HIDING DIES” partners from industry and research organizations have developed an embedding technology, which is based on the "Chip-in-Polymer". Many such adoptions of technological advancements by manufacturers have boosted the growth of the production of embedded die packaging in the region. The objective of the report is to present a comprehensive analysis of the Global Embedded Die PackagingMarket to the stakeholders in the industry. The past and current status of the industry with forecasted market size and trends are presented in the report with the analysis of complicated data in simple language. The report covers all the aspects of the industry with a dedicated study of key players that include market leaders, followers, and new entrants. PORTER, SVOR, PESTEL analysis with the potential impact of micro-economic factors of the market have been presented in the report. External as well as internal factors that are supposed to affect the business positively or negatively have been analyzed, which will give a clear futuristic view of the industry to the decision-makers. The report also helps in understanding the Global Embedded Die Packaging Market dynamics, structure by analyzing the market segments and projects Global Embedded Die Packaging Market size. Clear representation of competitive analysis of key players by product, price, financial position, product portfolio, growth strategies, and regional presence in the Global Embedded Die Packaging Market make the report investor’s guide.

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Global Embedded Die Packaging Market
Report Coverage Details
Base Year: 2021 Forecast Period: 2022-2027
Historical Data: 2017 to 2021 Market Size in 2021: US $ 29.56 Mn.
Forecast Period 2021 to 2027 CAGR: 16.99% Market Size in 2027: US $ 75.78 Mn.
Segments Covered: by Platform • IC Package Substrate • Rigid Board • Flexible Board
by Application • Smartphones and Tablets • Medical and Wearable Devices • Industrial Devices • Security Devices • Other
by End Use • Consumer Electronics • IT and Telecommunication • Automotive • Healthcare • Other

Embedded Die Packaging Market by Region

• North America • Asia-Pacific • Latin America • Europe • Middle East and Africa

Embedded Die Packaging Market Key Players

ASE Group, • AT&S, • Fujitsu Limited, • General Electric, • Infineon Technologies AG, • Microsemi Corporation, • STMicroelectronics, • TDK Corporation, • Texas Instruments Incorporation • Toshiba Corporation • Amkor Technology, Inc. • Fujikura Ltd. • SCHWEIZER ELECTRONIC AG • SHINKO ELECTRIC INDUSTRIES CO., LTD. • Taiwan Semiconductor Manufacturing Company Limited Frequently Asked Questions: 1. Which region has the largest share in Global Embedded Die Packaging Market? Ans: Europe region holds the highest share in 2021. 2. What is the growth rate of Global Embedded Die Packaging Market? Ans: The Global Embedded Die Packaging Market is growing at a CAGR of 16.99%during forecasting period 2022-2027. 3. What is scope of the Global Embedded Die Packaging market report? Ans: Global Embedded Die Packaging Market report helps with the PESTEL, PORTER, COVID-19 Impact analysis, Recommendations for Investors & Leaders, and market estimation of the forecast period. 4. Who are the key players in Global Embedded Die Packaging market? Ans: The important key players in the Global Embedded Die Packaging Market are – ASE Group, AT&S, Fujitsu Limited, General Electric, Infineon Technologies AG, Microsemi Corporation, STMicroelectronics, TDK Corporation, Texas Instruments Incorporation 5. What is the study period of this market? Ans: The Global Embedded Die Packaging Market is studied from 2021 to 2027.
1. Preface 1.1. Market Definition and Key Research Objectives 1.2. Research Highlights 2. Assumptions and Research Methodology 2.1. Report Assumptions 2.2. Abbreviations 2.3. Research Methodology 2.3.1. Secondary Research 2.3.1.1. Secondary data 2.3.1.2. Secondary Sources 2.3.2. Primary Research 2.3.2.1. Data from Primary Sources 2.3.2.2. Breakdown of Primary Sources 3. Executive Summary: Global Embedded Die Packaging Market Size, by Market Value (US$ Mn) 3.1. Global Market Segmentation 3.2. Global Market Segmentation Share Analysis, 2021 3.2.1. Global 3.2.2. By Region (North America, Europe, Asia Pacific, South America, Middle East Africa) 3.3. Geographical Snapshot of the Embedded Die Packaging Market 3.4. Geographical Snapshot of the Embedded Die Packaging Market, By Manufacturer share 4. Global Embedded Die Packaging Market Overview, 2021-2027 4.1. Market Dynamics 4.1.1. Drivers 4.1.1.1. Global 4.1.1.2. By Region (North America, Europe, Asia Pacific, South America, Middle East Africa) 4.1.2. Restraints 4.1.2.1. Global 4.1.2.2. By Region (North America, Europe, Asia Pacific, South America, Middle East Africa) 4.1.3. Opportunities 4.1.3.1. Global 4.1.3.2. By Region (North America, Europe, Asia Pacific, South America, Middle East Africa) 4.1.4. Challenges 4.1.4.1. Global 4.1.4.2. By Region (North America, Europe, Asia Pacific, South America, Middle East Africa) 4.1.5. Industry Trends and Emerging Technologies 4.1.6. Porters Five Forces Analysis 4.1.6.1. Threat of New Entrants 4.1.6.2. Bargaining Power of Buyers/Consumers 4.1.6.3. Bargaining Power of Suppliers 4.1.6.4. Threat of Substitute Products 4.1.6.5. Intensity of Competitive Rivalry 4.1.7. Value Chain Analysis 4.1.8. Technological Roadmap 4.1.9. Regulatory landscape 4.1.10. Impact of the Covid-19 Pandemic on the Global Embedded Die Packaging Market 5. Supply Side and Demand Side Indicators 6. Global Embedded Die Packaging Market Analysis and Forecast, 2021-2027 6.1. Global Embedded Die Packaging Market Size & Y-o-Y Growth Analysis. 7. Global Embedded Die Packaging Market Analysis and Forecasts, 2021-2027 7.1. Market Size (Value) Estimates & Forecast By Platform, 2021-2027 7.1.1. IC Package Substrate 7.1.2. Rigid Board 7.1.3. Flexible Board 7.2. Market Size (Value) Estimates & Forecast By Application, 2021-2027 7.2.1. Smartphones and Tablets 7.2.2. Medical and Wearable Devices 7.2.3. Industrial Devices 7.2.4. Security Devices 7.2.5. Other 7.3. Market Size (Value) Estimates & Forecast By End Use, 2021-2027 7.3.1. Consumer Electronics 7.3.2. IT and Telecommunication 7.3.3. Automotive 7.3.4. Healthcare 7.3.5. Other 8. Global Embedded Die Packaging Market Analysis and Forecasts, By Region 8.1. Market Size (Value) Estimates & Forecast By Region, 2021-2027 8.1.1. North America 8.1.2. Europe 8.1.3. Asia-Pacific 8.1.4. Middle East & Africa 8.1.5. South America 9. North America Embedded Die Packaging Market Analysis and Forecasts, 2021-2027 9.1. Market Size (Value) Estimates & Forecast By Platform, 2021-2027 9.1.1. IC Package Substrate 9.1.2. Rigid Board 9.1.3. Flexible Board 9.2. Market Size (Value) Estimates & Forecast By Application, 2021-2027 9.2.1. Smartphones and Tablets 9.2.2. Medical and Wearable Devices 9.2.3. Industrial Devices 9.2.4. Security Devices 9.2.5. Other 9.3. Market Size (Value) Estimates & Forecast By End Use, 2021-2027 9.3.1. Consumer Electronics 9.3.2. IT and Telecommunication 9.3.3. Automotive 9.3.4. Healthcare 9.3.5. Other 10. North America Embedded Die Packaging Market Analysis and Forecasts, By Country 10.1. Market Size (Value) Estimates & Forecast By Country, 2021-2027 10.1.1. US 10.1.2. Canada 10.1.3. Mexico 11. U.S. Embedded Die Packaging Market Analysis and Forecasts, 2021-2027 11.1. Market Size (Value) Estimates & Forecast By Platform, 2021-2027 11.2. Market Size (Value) Estimates & Forecast By Application, 2021-2027 11.3. Market Size (Value) Estimates & Forecast By End Use, 2021-2027 12. Canada Embedded Die Packaging Market Analysis and Forecasts, 2021-2027 12.1. Market Size (Value) Estimates & Forecast By Platform, 2021-2027 12.2. Market Size (Value) Estimates & Forecast By Application, 2021-2027 12.3. Market Size (Value) Estimates & Forecast By End Use, 2021-2027 13. Mexico Embedded Die Packaging Market Analysis and Forecasts, 2021-2027 13.1. Market Size (Value) Estimates & Forecast By Platform, 2021-2027 13.2. Market Size (Value) Estimates & Forecast By Application, 2021-2027 13.3. Market Size (Value) Estimates & Forecast By End Use, 2021-2027 14. Europe Embedded Die Packaging Market Analysis and Forecasts, 2021-2027 14.1. Market Size (Value) Estimates & Forecast By Platform, 2021-2027 14.2. Market Size (Value) Estimates & Forecast By Application, 2021-2027 14.3. Market Size (Value) Estimates & Forecast By End Use, 2021-2027 15. Europe Embedded Die Packaging Market Analysis and Forecasts, By Country 15.1. Market Size (Value) Estimates & Forecast By Country, 2021-2027 15.1.1. U.K 15.1.2. France 15.1.3. Germany 15.1.4. Italy 15.1.5. Spain 15.1.6. Sweden 15.1.7. CIS Countries 15.1.8. Rest of Europe 16. U.K. Embedded Die Packaging Market Analysis and Forecasts, 2021-2027 16.1. Market Size (Value) Estimates & Forecast By Platform, 2021-2027 16.2. Market Size (Value) Estimates & Forecast By Application, 2021-2027 16.3. Market Size (Value) Estimates & Forecast By End Use, 2021-2027 17. France Embedded Die Packaging Market Analysis and Forecasts, 2021-2027 17.1. Market Size (Value) Estimates & Forecast By Platform, 2021-2027 17.2. Market Size (Value) Estimates & Forecast By Application, 2021-2027 17.3. Market Size (Value) Estimates & Forecast By End Use, 2021-2027 18. Germany Embedded Die Packaging Market Analysis and Forecasts, 2021-2027 18.1. Market Size (Value) Estimates & Forecast By Platform, 2021-2027 18.2. Market Size (Value) Estimates & Forecast By Application, 2021-2027 18.3. Market Size (Value) Estimates & Forecast By End Use, 2021-2027 19. Italy Embedded Die Packaging Market Analysis and Forecasts, 2021-2027 19.1. Market Size (Value) Estimates & Forecast By Platform, 2021-2027 19.2. Market Size (Value) Estimates & Forecast By Application, 2021-2027 19.3. Market Size (Value) Estimates & Forecast By End Use, 2021-2027 20. Spain Embedded Die Packaging Market Analysis and Forecasts, 2021-2027 20.1. Market Size (Value) Estimates & Forecast By Platform, 2021-2027 20.2. Market Size (Value) Estimates & Forecast By Application, 2021-2027 20.3. Market Size (Value) Estimates & Forecast By End Use, 2021-2027 21. Sweden Embedded Die Packaging Market Analysis and Forecasts, 2021-2027 21.1. Market Size (Value) Estimates & Forecast By Platform, 2021-2027 21.2. Market Size (Value) Estimates & Forecast By Application, 2021-2027 21.3. Market Size (Value) Estimates & Forecast By End Use, 2021-2027 22. CIS Countries Embedded Die Packaging Market Analysis and Forecasts, 2021-2027 22.1. Market Size (Value) Estimates & Forecast By Platform, 2021-2027 22.2. Market Size (Value) Estimates & Forecast By Application, 2021-2027 22.3. Market Size (Value) Estimates & Forecast By End Use, 2021-2027 23. Rest of Europe Embedded Die Packaging Market Analysis and Forecasts, 2021-2027 23.1. Market Size (Value) Estimates & Forecast By Platform, 2021-2027 23.2. Market Size (Value) Estimates & Forecast By Application, 2021-2027 23.3. Market Size (Value) Estimates & Forecast By End Use, 2021-2027 24. Asia Pacific Embedded Die Packaging Market Analysis and Forecasts, 2021-2027 24.1. Market Size (Value) Estimates & Forecast By Platform, 2021-2027 24.2. Market Size (Value) Estimates & Forecast By Application, 2021-2027 24.3. Market Size (Value) Estimates & Forecast By End Use, 2021-2027 25. Asia Pacific Embedded Die Packaging Market Analysis and Forecasts, by Country 25.1. Market Size (Value) Estimates & Forecast By Country, 2021-2027 25.1.1. China 25.1.2. India 25.1.3. Japan 25.1.4. South Korea 25.1.5. Australia 25.1.6. ASEAN 25.1.7. Rest of Asia Pacific 26. China Embedded Die Packaging Market Analysis and Forecasts, 2021-2027 26.1. Market Size (Value) Estimates & Forecast By Platform, 2021-2027 26.2. Market Size (Value) Estimates & Forecast By Application, 2021-2027 26.3. Market Size (Value) Estimates & Forecast By End Use, 2021-2027 27. India Embedded Die Packaging Market Analysis and Forecasts, 2021-2027 27.1. Market Size (Value) Estimates & Forecast By Platform, 2021-2027 27.2. Market Size (Value) Estimates & Forecast By Application, 2021-2027 27.3. Market Size (Value) Estimates & Forecast By End Use, 2021-2027 28. Japan Embedded Die Packaging Market Analysis and Forecasts, 2021-2027 28.1. Market Size (Value) Estimates & Forecast By Platform, 2021-2027 28.2. Market Size (Value) Estimates & Forecast By Application, 2021-2027 28.3. Market Size (Value) Estimates & Forecast By End Use, 2021-2027 29. South Korea Embedded Die Packaging Market Analysis and Forecasts, 2021-2027 29.1. Market Size (Value) Estimates & Forecast By Platform, 2021-2027 29.2. Market Size (Value) Estimates & Forecast By Application, 2021-2027 29.3. Market Size (Value) Estimates & Forecast By End Use, 2021-2027 30. Australia Embedded Die Packaging Market Analysis and Forecasts, 2021-2027 30.1. Market Size (Value) Estimates & Forecast By Platform, 2021-2027 30.2. Market Size (Value) Estimates & Forecast By Application, 2021-2027 30.3. Market Size (Value) Estimates & Forecast By End Use, 2021-2027 31. ASEAN Embedded Die Packaging Market Analysis and Forecasts, 2021-2027 31.1. Market Size (Value) Estimates & Forecast By Platform, 2021-2027 31.2. Market Size (Value) Estimates & Forecast By Application, 2021-2027 31.3. Market Size (Value) Estimates & Forecast By End Use, 2021-2027 32. Rest of Asia Pacific Embedded Die Packaging Market Analysis and Forecasts, 2021-2027 32.1. Market Size (Value) Estimates & Forecast By Platform, 2021-2027 32.2. Market Size (Value) Estimates & Forecast By Application, 2021-2027 32.3. Market Size (Value) Estimates & Forecast By End Use, 2021-2027 33. Middle East Africa Embedded Die Packaging Market Analysis and Forecasts, 2021-2027 33.1. Market Size (Value) Estimates & Forecast By Platform, 2021-2027 33.2. Market Size (Value) Estimates & Forecast By Application, 2021-2027 33.3. Market Size (Value) Estimates & Forecast By End Use, 2021-2027 34. Middle East Africa Embedded Die Packaging Market Analysis and Forecasts, by Country 34.1. Market Size (Value) Estimates & Forecast by Country, 2021-2027 34.1.1. South Africa 34.1.2. GCC Countries 34.1.3. Egypt 34.1.4. Nigeria 34.1.5. Rest of ME&A 35. South Africa Embedded Die Packaging Market Analysis and Forecasts, 2021-2027 35.1. Market Size (Value) Estimates & Forecast By Platform, 2021-2027 35.2. Market Size (Value) Estimates & Forecast By Application, 2021-2027 35.3. Market Size (Value) Estimates & Forecast By End Use, 2021-2027 36. GCC Countries Embedded Die Packaging Market Analysis and Forecasts, 2021-2027 36.1. Market Size (Value) Estimates & Forecast By Platform, 2021-2027 36.2. Market Size (Value) Estimates & Forecast By Application, 2021-2027 36.3. Market Size (Value) Estimates & Forecast By End Use, 2021-2027 37. Egypt Embedded Die Packaging Market Analysis and Forecasts, 2021-2027 37.1. Market Size (Value) Estimates & Forecast By Platform, 2021-2027 37.2. Market Size (Value) Estimates & Forecast By Application, 2021-2027 37.3. Market Size (Value) Estimates & Forecast By End Use, 2021-2027 38. Nigeria Embedded Die Packaging Market Analysis and Forecasts, 2021-2027 38.1. Market Size (Value) Estimates & Forecast By Platform, 2021-2027 38.2. Market Size (Value) Estimates & Forecast By Application, 2021-2027 38.3. Market Size (Value) Estimates & Forecast By End Use, 2021-2027 39. Rest of ME&A Embedded Die Packaging Market Analysis and Forecasts, 2021-2027 39.1. Market Size (Value) Estimates & Forecast By Platform, 2021-2027 39.2. Market Size (Value) Estimates & Forecast By Application, 2021-2027 39.3. Market Size (Value) Estimates & Forecast By End Use, 2021-2027 40. South America Embedded Die Packaging Market Analysis and Forecasts, 2021-2027 40.1. Market Size (Value) Estimates & Forecast By Platform, 2021-2027 40.2. Market Size (Value) Estimates & Forecast By Application, 2021-2027 40.3. Market Size (Value) Estimates & Forecast By End Use, 2021-2027 41. South America Embedded Die Packaging Market Analysis and Forecasts, by Country 41.1. Market Size (Value) Estimates & Forecast by Country, 2021-2027 41.1.1. Brazil 41.1.2. Argentina 41.1.3. Rest of South America 42. Brazil Embedded Die Packaging Market Analysis and Forecasts, 2021-2027 42.1. Market Size (Value) Estimates & Forecast By Platform, 2021-2027 42.2. Market Size (Value) Estimates & Forecast By Application, 2021-2027 42.3. Market Size (Value) Estimates & Forecast By End Use, 2021-2027 43. Argentina Embedded Die Packaging Market Analysis and Forecasts, 2021-2027 43.1. Market Size (Value) Estimates & Forecast By Platform, 2021-2027 43.2. Market Size (Value) Estimates & Forecast By Application, 2021-2027 43.3. Market Size (Value) Estimates & Forecast By End Use, 2021-2027 44. Rest of South America Embedded Die Packaging Market Analysis and Forecasts, 2021-2027 44.1. Market Size (Value) Estimates & Forecast By Platform, 2021-2027 44.2. Market Size (Value) Estimates & Forecast By Application, 2021-2027 44.3. Market Size (Value) Estimates & Forecast By End Use, 2021-2027 45. Competitive Landscape 45.1. Geographic Footprint of Major Players in the Global Embedded Die Packaging Market 45.2. Competition Matrix 45.2.1. Competitive Benchmarking of Key Players By Price, Presence, Market Share, Applications and R&D Investment 45.2.2. New Product Launches and Product Enhancements 45.2.3. Market Consolidation 45.2.3.1. M&A by Regions, Investment and Verticals 45.2.3.2. M&A, Forward Integration and Backward Integration 45.2.3.3. Partnership, Joint Ventures and Strategic Alliances/ Sales Agreements 45.3. Company Profile : Key Players 45.3.1. ASE Group 45.3.1.1. Company Overview 45.3.1.2. Financial Overview 45.3.1.3. Geographic Footprint 45.3.1.4. Product Portfolio 45.3.1.5. Business Strategy 45.3.1.6. Recent Developments 45.3.2. AT&S, 45.3.3. Fujitsu Limited, 45.3.4. General Electric, 45.3.5. Infineon Technologies AG, 45.3.6. Microsemi Corporation, 45.3.7. STMicroelectronics, 45.3.8. TDK Corporation, 45.3.9. Texas Instruments Incorporation 45.3.10. Toshiba Corporation 45.3.11. Amkor Technology, Inc. 45.3.12. Fujikura Ltd. 45.3.13. SCHWEIZER ELECTRONIC AG 45.3.14. SHINKO ELECTRIC INDUSTRIES CO., LTD. 45.3.15. Taiwan Semiconductor Manufacturing Company Limited 46. Primary Key Insights

About This Report

Report ID 31201
Category Material & Chemical
Published Date June 2019
Updated Date April 2022
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