Wire Bonder Equipment Market size was valued at US$ 801.03 Mn. in 2022 and the total revenue is expected to grow at a CAGR of 9.73% from 2023 to 2029, reaching nearly US$ 1534.36 Mn.Global Wire Bonder Equipment Market Overview:
Wire Bonder Equipment Market is expected to reach US$ 1,534.36 Mn. by 2029. Wirebonding is an electrical joining technique that uses thin wire and a combination of heat, pressure, and/or ultrasonic energy. The two metallic elements (wire and pad surface) are brought into close contact during the solid phase welding procedure known as wire bonding. This report focuses on the different segments of the Wire Bonder Equipment market (Product, End User, and Region). This report offers a detailed analysis of the top industry participants and geographic regions (North America, Asia Pacific, Europe, Middle East & Africa, and South America). It offers a thorough examination of the phenomenal modern-era growth in the many sectors. Figures, graphics, and slideshows emphasise the essential data analysis from 2018 to 2022. The market drivers, restraints, opportunities, and challenges for Wire Bonder Equipment are examined in this report. The MMR report's investment suggestions are based on a thorough examination of the current competitive environment in the Wire Bonder Equipment market.To know about the Research Methodology :- Request Free Sample Report Impact of COVID-19 on the Wire Bonder Equipment Market: The global economic downturn is being caused by rising COVID-19 instances. Every sector of the economy, including the global semiconductor market, is suffering the impact of COVID-19. However, COVID-19 has little effect on the need for equipment. For instance, Palomar Technologies declared that it is observing demand for essential semiconductor components in April 2020. The company reported an increase in orders for its 3880 ball bonder machines from manufacturers of robots, medical devices, and remote machine tools. As a result, COVID-19 has not caused a decline in equipment demand. In turn, this is expected to drive the global market for wire bonder equipment during the forecast period.
Wire Bonder Equipment Market Dynamics:
Due to the constant launch of innovative electronics, such as smartphones with improved features, which forces the vendors to modify the manufacturing process to meet both old and new standards, the global market for wire bonder equipment is expected to experience an exciting growth rate during the forecast period. The advent of novel forms of chip packing is expected to drive the global market for wire bonder equipment during the forecast period. During the forecast period, this new kind of chip packaging is probably going to present Integrated Device Manufacturers (IDMs) and Outsourced Semiconductor Assembly and Testing (OSATs) with new business opportunities. As a result, equipment for semiconductor packing, such as wire bonder equipment, has grown more rapidly and is expected to have significant growth during the forecast period. The manufacturing environment of the semiconductor industry has altered as a result of the introduction of new packaging technologies including MEMs packaging and TSV packaging. To ensure that their products are up to date and utilize the newest innovations, equipment makers must make a large investment. Wire bonder equipment market growth is expected to be hampered during the forecast period by the rising complexity of the manufacturing process, the need for more time, and the rising probability of errors. Despite these challenges, this market has grown faster due to strong 3D chip packaging usage. Fine-pitch applications demand for a wire bonder with greater capabilities, including better control of the bonding force, higher levels of ultrasonic energy, and the capacity to loop fine wires, which are weaker and more likely to sway during looping. A wire bonder that can handle fine pitch needs to have submicron accuracy in its vision system and high-precision motion as well. One of the developments in the semiconductor industry with the highest rate of growth is stacked die applications. This 3-D packaging technology is expected to be driven by the desire for smaller, lighter, and smarter devices. Several wire bonding issues arise in stacked die applications, including the need for low-loop and multi-level wire bonding loop clearance, bonding to overhanging, unsupported die edges, and loop resistance to wire sweep during moulding. Since forward bonding is quicker and more capable of finer pitch than reverse bonding, it is typically used in wire bonding applications. However, because of the neck region above the ball, forward ball bonding is constrained in terms of loop height. Neck cracks might develop as a result of excessive bending above the ball, which affects reliability. These are the factors that are expected to drive the growth of the global wire bonder equipment market during the forecast period.Wire Bonder Equipment Market Segment Analysis:
The Wire Bonder Equipment Market is segmented by Product, and End User. Based on the Product, the market is segmented into Wedge bonders, Stud-bump bonders, and Ball bonders. Ball bonders segment is expected to hold the largest market share of xx% by 2029. Integrated circuits (ICs) or any other semiconductor device can be connected to one another during chip packing by using a ball bonder machine. Generally constructed of copper, aluminium, gold, or silver, the connection is created using a thin wire. The ball bonding procedure is used to create this connection, and it welds the wire and chip ends together using pressure, heat, and ultrasonic energy. Ball bonding devices are utilised in a variety of applications by a variety of end-user segments, including Outsourced Semiconductor Assembly and Testing (OSATs) and Integrated Device Manufacturers (IDMs). The market for ball bonder machines is expected to grow as end users switch from manual to automated ball bonder machines. Growing consumer demand for electronic goods drives chip demand, which is indirectly expected to drive up demand for ball bonder machines during the forecast period. During the forecast period, strict government rules surrounding workplace safety are also expected to increase demand for ball bonder machines in end-use industries. Based on the End User, the market is segmented into Integrated Device Manufacturers, and Outsourced Semiconductor Assembly and Testing. Outsourced Semiconductor Assembly and Testing segment is expected to grow rapidly at a CAGR of xx% during the forecast period 2023-2029. This is due to the quick adoption of wire wedge bonder machinery for cutting-edge chip manufacture, rising production capacity, and growing demand for premium packaging solutions. Additionally, a key driver expected to drive this segment's revenue growth during the forecast period is the small and medium chip makers' rising dependence on OSAT firms due to a lack of technological resources and knowledge.
Wire Bonder Equipment Market Regional Insights:
The North American region is expected to dominate the Wire Bonder Equipment Market during the forecast period 2023-2029. The North American region is expected to hold the largest market share of xx% by 2029. This is due to the presence of established and cutting-edge manufacturers in the region. In North America, the U.S. is a significant market because the region is producing more electronics. Asia Pacific region is expected to grow rapidly at a CAGR of xx% during the forecast period 2023-2029. This can be due to the mass production of electronic items in China and Taiwan, including wearable technology, cellphones, and white goods. Chip manufacturing technology has received significant investment from suppliers in the Asia Pacific region. Additionally, the demand for consumer electronics in this region has increased demand for semiconductor packaging and equipment, such as wire bonder equipment. These are the key factors that are expected to drive the growth of the Asia Pacific region in the wire bonder equipment market during the forecast period. The objective of the report is to present a comprehensive analysis of the Global Wire Bonder Equipment Market to the stakeholders in the industry. The past and current status of the industry with the forecasted market size and trends are presented in the report with the analysis of complicated data in simple language. The report covers all the aspects of the industry with a dedicated study of key players that include market leaders, followers, and new entrants. PORTER, PESTEL analysis with the potential impact of micro-economic factors of the market has been presented in the report. External as well as internal factors that are supposed to affect the business positively or negatively have been analyzed, which will give a clear futuristic view of the industry to the decision-makers. The reports also help in understanding the Global Wire Bonder Equipment Market dynamic and structure by analyzing the market segments and projecting the Global market size. Clear representation of competitive analysis of key players by Distribution Channel, price, financial position, product portfolio, growth strategies, and regional presence in the Wire Bonder Equipment Market make the report investor’s guide.Wire Bonder Equipment Market Scope: Inquire before buying
Global Wire Bonder Equipment Market Report Coverage Details Base Year: 2022 Forecast Period: 2023-2029 Historical Data: 2018 to 2022 Market Size in 2022: US $ 801.03 Mn. Forecast Period 2023 to 2029 CAGR: 9.73% Market Size in 2029: US $ 1534.36 Mn. Segments Covered: by Product Wedge bonders Stud-bump bonders Ball bonders by End User Integrated Device Manufacturers Outsourced Semiconductor Assembly and Testing Wire Bonder Equipment Market, by Region
North America (United States, Canada and Mexico) Europe (UK, France, Germany, Italy, Spain, Sweden, Austria and Rest of Europe) Asia Pacific (China, South Korea, Japan, India, Australia, Indonesia, Malaysia, Vietnam, Taiwan, Bangladesh, Pakistan and Rest of APAC) Middle East and Africa (South Africa, GCC, Egypt, Nigeria and Rest of ME&A) South America (Brazil, Argentina Rest of South America)Wire Bonder Equipment Market Key Players
1.ASM Pacific Technology 2.Kulicke & Sofa Industries Inc. 3.Palomar Technologies 4.F&K Delvotec Bondetechnik 5.DIAS Automation (HK) Ltd. 6.F & S BONDTEC Semiconductor GmbH 7.SHINKAWA Ltd. 8.TPT Wirebonder GmbH & Co. 9.West Bond Inc. 10.BE Semiconductor Industries N.V. 11.Hesse GmBH 12.Toray Engineering 13.Hybond Inc. 14.Boston Micro-Components 15.Guangzhou Minder-Hightech Co., Ltd. 16.Shenzhen Shuangshi Technology Co., Ltd. 17.Anza Technology 18.Kaijo Corporation 19.Mech-El Industries 20.Planar Corporation 21.Questar Products International Frequently Asked Questions: 1] Which region is expected to hold the highest share in the Wire Bonder Equipment Market? Ans. The North American region is expected to hold the highest share in the market. 2] Who are the top key players in the Wire Bonder Equipment Market? Ans. ASM Pacific Technology, Kulicke & Sofa Industries Inc., Palomar Technologies, F&K Delvotec Bondetechnik, DIAS Automation (HK) Ltd., F & S BONDTEC Semiconductor GmbH, SHINKAWA Ltd., TPT Wirebonder GmbH & Co., and West Bond Inc. are the top key players in the Wire Bonder Equipment Market. 3] Which segment is expected to hold the largest market share in the Wire Bonder Equipment Market by 2029? Ans. Ball bonders segment is expected to hold the largest market share in the market by 2029. 4] What is the market size of the Wire Bonder Equipment Market by 2029? Ans. The market size of the market is expected to reach US $ 1534.36 Mn. by 2029. 5] What was the market size of the Wire Bonder Equipment Market in 2022? Ans. The market size of the market was worth US $ 801.03 Mn. in 2022.
1. Wire Bonder Equipment Market Introduction 1.1. Study Assumption and Market Definition 1.2. Scope of the Study 1.3. Executive Summary 2. Wire Bonder Equipment Market: Dynamics 2.1. Wire Bonder Equipment Market Trends by Region 2.1.1. North America Wire Bonder Equipment Market Trends 2.1.2. Europe Wire Bonder Equipment Market Trends 2.1.3. Asia Pacific Wire Bonder Equipment Market Trends 2.1.4. Middle East and Africa Wire Bonder Equipment Market Trends 2.1.5. South America Wire Bonder Equipment Market Trends 2.2. Wire Bonder Equipment Market Dynamics by Region 2.2.1. North America 2.2.1.1. North America Wire Bonder Equipment Market Drivers 2.2.1.2. North America Wire Bonder Equipment Market Restraints 2.2.1.3. North America Wire Bonder Equipment Market Opportunities 2.2.1.4. North America Wire Bonder Equipment Market Challenges 2.2.2. Europe 2.2.2.1. Europe Wire Bonder Equipment Market Drivers 2.2.2.2. Europe Wire Bonder Equipment Market Restraints 2.2.2.3. Europe Wire Bonder Equipment Market Opportunities 2.2.2.4. Europe Wire Bonder Equipment Market Challenges 2.2.3. Asia Pacific 2.2.3.1. Asia Pacific Wire Bonder Equipment Market Drivers 2.2.3.2. Asia Pacific Wire Bonder Equipment Market Restraints 2.2.3.3. Asia Pacific Wire Bonder Equipment Market Opportunities 2.2.3.4. Asia Pacific Wire Bonder Equipment Market Challenges 2.2.4. Middle East and Africa 2.2.4.1. Middle East and Africa Wire Bonder Equipment Market Drivers 2.2.4.2. Middle East and Africa Wire Bonder Equipment Market Restraints 2.2.4.3. Middle East and Africa Wire Bonder Equipment Market Opportunities 2.2.4.4. Middle East and Africa Wire Bonder Equipment Market Challenges 2.2.5. South America 2.2.5.1. South America Wire Bonder Equipment Market Drivers 2.2.5.2. South America Wire Bonder Equipment Market Restraints 2.2.5.3. South America Wire Bonder Equipment Market Opportunities 2.2.5.4. South America Wire Bonder Equipment Market Challenges 2.3. PORTER’s Five Forces Analysis 2.4. PESTLE Analysis 2.5. Technology Roadmap 2.6. Regulatory Landscape by Region 2.6.1. North America 2.6.2. Europe 2.6.3. Asia Pacific 2.6.4. Middle East and Africa 2.6.5. South America 2.7. Key Opinion Leader Analysis For Wire Bonder Equipment Industry 2.8. Analysis of Government Schemes and Initiatives For Wire Bonder Equipment Industry 2.9. Wire Bonder Equipment Market Trade Analysis 2.10. The Global Pandemic Impact on Wire Bonder Equipment Market 3. Wire Bonder Equipment Market: Global Market Size and Forecast by Segmentation by Demand and Supply Side (by Value in USD Million) 2022-2029 3.1. Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 3.1.1. Wedge bonders 3.1.2. Stud-bump bonders 3.1.3. Ball bonders 3.2. Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 3.2.1. Integrated Device Manufacturers 3.2.2. Outsourced Semiconductor Assembly and Testing 3.3. Wire Bonder Equipment Market Size and Forecast, by Region (2022-2029) 3.3.1. North America 3.3.2. Europe 3.3.3. Asia Pacific 3.3.4. Middle East and Africa 3.3.5. South America 4. North America Wire Bonder Equipment Market Size and Forecast by Segmentation (by Value in USD Million) 2022-2029 4.1. North America Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 4.1.1. Wedge bonders 4.1.2. Stud-bump bonders 4.1.3. Ball bonders 4.2. North America Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 4.2.1. Integrated Device Manufacturers 4.2.2. Outsourced Semiconductor Assembly and Testing 4.3. North America Wire Bonder Equipment Market Size and Forecast, by Country (2022-2029) 4.3.1. United States 4.3.1.1. United States Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 4.3.1.1.1. Wedge bonders 4.3.1.1.2. Stud-bump bonders 4.3.1.1.3. Ball bonders 4.3.1.2. United States Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 4.3.1.2.1. Integrated Device Manufacturers 4.3.1.2.2. Outsourced Semiconductor Assembly and Testing 4.3.2. Canada 4.3.2.1. Canada Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 4.3.2.1.1. Wedge bonders 4.3.2.1.2. Stud-bump bonders 4.3.2.1.3. Ball bonders 4.3.2.2. Canada Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 4.3.2.2.1. Integrated Device Manufacturers 4.3.2.2.2. Outsourced Semiconductor Assembly and Testing 4.3.3. Mexico 4.3.3.1. Mexico Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 4.3.3.1.1. Wedge bonders 4.3.3.1.2. Stud-bump bonders 4.3.3.1.3. Ball bonders 4.3.3.2. Mexico Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 4.3.3.2.1. Integrated Device Manufacturers 4.3.3.2.2. Outsourced Semiconductor Assembly and Testing 5. Europe Wire Bonder Equipment Market Size and Forecast by Segmentation (by Value in USD Million) 2022-2029 5.1. Europe Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 5.2. Europe Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 5.3. Europe Wire Bonder Equipment Market Size and Forecast, by Country (2022-2029) 5.3.1. United Kingdom 5.3.1.1. United Kingdom Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 5.3.1.2. United Kingdom Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 5.3.2. France 5.3.2.1. France Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 5.3.2.2. France Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 5.3.3. Germany 5.3.3.1. Germany Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 5.3.3.2. Germany Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 5.3.4. Italy 5.3.4.1. Italy Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 5.3.4.2. Italy Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 5.3.5. Spain 5.3.5.1. Spain Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 5.3.5.2. Spain Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 5.3.6. Sweden 5.3.6.1. Sweden Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 5.3.6.2. Sweden Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 5.3.7. Austria 5.3.7.1. Austria Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 5.3.7.2. Austria Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 5.3.8. Rest of Europe 5.3.8.1. Rest of Europe Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 5.3.8.2. Rest of Europe Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 6. Asia Pacific Wire Bonder Equipment Market Size and Forecast by Segmentation (by Value in USD Million) 2022-2029 6.1. Asia Pacific Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 6.2. Asia Pacific Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 6.3. Asia Pacific Wire Bonder Equipment Market Size and Forecast, by Country (2022-2029) 6.3.1. China 6.3.1.1. China Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 6.3.1.2. China Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 6.3.2. S Korea 6.3.2.1. S Korea Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 6.3.2.2. S Korea Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 6.3.3. Japan 6.3.3.1. Japan Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 6.3.3.2. Japan Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 6.3.4. India 6.3.4.1. India Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 6.3.4.2. India Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 6.3.5. Australia 6.3.5.1. Australia Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 6.3.5.2. Australia Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 6.3.6. Indonesia 6.3.6.1. Indonesia Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 6.3.6.2. Indonesia Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 6.3.7. Malaysia 6.3.7.1. Malaysia Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 6.3.7.2. Malaysia Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 6.3.8. Vietnam 6.3.8.1. Vietnam Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 6.3.8.2. Vietnam Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 6.3.9. Taiwan 6.3.9.1. Taiwan Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 6.3.9.2. Taiwan Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 6.3.10. Rest of Asia Pacific 6.3.10.1. Rest of Asia Pacific Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 6.3.10.2. Rest of Asia Pacific Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 7. Middle East and Africa Wire Bonder Equipment Market Size and Forecast by Segmentation (by Value in USD Million) 2022-2029 7.1. Middle East and Africa Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 7.2. Middle East and Africa Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 7.3. Middle East and Africa Wire Bonder Equipment Market Size and Forecast, by Country (2022-2029) 7.3.1. South Africa 7.3.1.1. South Africa Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 7.3.1.2. South Africa Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 7.3.2. GCC 7.3.2.1. GCC Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 7.3.2.2. GCC Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 7.3.3. Nigeria 7.3.3.1. Nigeria Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 7.3.3.2. Nigeria Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 7.3.4. Rest of ME&A 7.3.4.1. Rest of ME&A Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 7.3.4.2. Rest of ME&A Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 8. South America Wire Bonder Equipment Market Size and Forecast by Segmentation (by Value in USD Million) 2022-2029 8.1. South America Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 8.2. South America Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 8.3. South America Wire Bonder Equipment Market Size and Forecast, by Country (2022-2029) 8.3.1. Brazil 8.3.1.1. Brazil Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 8.3.1.2. Brazil Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 8.3.2. Argentina 8.3.2.1. Argentina Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 8.3.2.2. Argentina Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 8.3.3. Rest Of South America 8.3.3.1. Rest Of South America Wire Bonder Equipment Market Size and Forecast, by Product (2022-2029) 8.3.3.2. Rest Of South America Wire Bonder Equipment Market Size and Forecast, by End Use (2022-2029) 9. Global Wire Bonder Equipment Market: Competitive Landscape 9.1. MMR Competition Matrix 9.2. Competitive Landscape 9.3. Key Players Benchmarking 9.3.1. Company Name 9.3.2. Business Segment 9.3.3. End-user Segment 9.3.4. Revenue (2022) 9.3.5. Company Locations 9.4. Leading Wire Bonder Equipment Market Companies, by market capitalization 9.5. Market Structure 9.5.1. Market Leaders 9.5.2. Market Followers 9.5.3. Emerging Players 9.6. Mergers and Acquisitions Details 10. Company Profile: Key Players 10.1. ASM Pacific Technology 10.1.1. Company Overview 10.1.2. Business Portfolio 10.1.3. Financial Overview 10.1.4. SWOT Analysis 10.1.5. Strategic Analysis 10.1.6. Scale of Operation (small, medium, and large) 10.1.7. Details on Partnership 10.1.8. Regulatory Accreditations and Certifications Received by Them 10.1.9. Awards Received by the Firm 10.1.10. Recent Developments 10.2. Kulicke & Sofa Industries Inc. 10.3. Palomar Technologies 10.4. F&K Delvotec Bondetechnik 10.5. DIAS Automation (HK) Ltd. 10.6. F & S BONDTEC Semiconductor GmbH 10.7. SHINKAWA Ltd. 10.8. TPT Wirebonder GmbH & Co. 10.9. West Bond Inc. 10.10. BE Semiconductor Industries N.V. 10.11. Hesse GmBH 10.12. Toray Engineering 10.13. Hybond Inc. 10.14. Boston Micro-Components 10.15. Guangzhou Minder-Hightech Co., Ltd. 10.16. Shenzhen Shuangshi Technology Co., Ltd. 10.17. Anza Technology 10.18. Kaijo Corporation 10.19. Mech-El Industries 10.20. Planar Corporation 10.21. Questar Products International 11. Key Findings 12. Industry Recommendations 13. Wire Bonder Equipment Market: Research Methodology 14. Terms and Glossary